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Printed board laminates are usually composed of copper foils bonded to organic dielectric materials, ceramics, or other metals. 1. Organic dielectrics. These are thermosetting or thermoplastic resins usually combined with a selected reinforcing filler. Thermoset-reinforced materials used for rigid and flexible boards provide overall stability, chemical resistance, and good dielectric properties. Thermoplastic materials are also used for flexible circuit applications. A factor in material selection is the effect of process solutions, etchants, and solvents on the material. In addition, the adhesives used in laminating metal to substrate can be softened, loosened, and attacked by some solutions. Flat-surface planarity is an aid to precision etching. This can be improved by selection of laminate with fine glass woven structures that do not express a waviness to the free copper foil surface. 2. Thin-clad copper. Etched printed boards with epoxy laminate of 1 4 oz (9 mm) copper or less show minimal lateral etching, thus enabling higher fidelity to pattern-plated traces. The problem with very thin copper foils is pinhole density and fragility in the laminate
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ETCHING PROCESS AND TECHNOLOGIES
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manufacturing process. One method of avoiding these problems is to start with a more conventional 1 2-oz (18-mm) foil and reduce its thickness by etching to a thinner state (3 to 9 mm).32 This technique depends on a uniform starting foil and a very well-controlled etching process. Although the particulars of the published process were not disclosed, cupric chloride and sodium persulfate formulations have been used for this process. 3. Reverse foil laminate. This construction is receiving attention for improving precision and control of etched lines. In order to achieve this foil structure, the tooth or crystalline roughness must also be controlled in the foil. The tooth side is usually placed on the dielectric interface of the laminate to increase peel strength and present a flat surface for processing. However, one variation is to place the drum or flat side of the laminate toward the dielectric and leave the tooth side upward.This forms a flat interface so that the etching stops at this surface, instead of the conventional extra etching to remove the teeth that are buried in dielectric. 4. Semiadditive copper. A copper thickness of 0.000050 to 0.000200 in with subsequent copper and resist metal plating shows no overhang or sliver formation. These layers must be of sufficient thickness and uniformity to withstand the cleaning and preparation steps for plating the required conductors.
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METALS OTHER THAN COPPER
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Aluminum Aluminum-clad flexible circuits find use in microwave stripline33 and radiation-resistance applications. Aluminum and its alloys have good electrical conductivity, are lightweight, and can be plated, soldered, brazed, chem-milled, and anodized with good results. Laminate dielectrics include PPO,33 polyimide,34 epoxy-glass, and polyester. Precleaning for resist application includes nonetch alkaline soak, water rinsing for 5 to 10 s in chromic-sulfuric acid, rinsing, and drying. Preferred etchants include ferric chloride (12 to 18 Baum ), sodium hydroxide (5 to 10 percent), inhibited hydrochloric acid, phosphoric acid mixtures, solutions of HCl and HF, and ferric chloride hydrochloric acid mixture. Screen-printed vinyl resists and dry-film photoresist are the most durable for deep etching or chem-milling. A dip in a 10 percent nitric or chromic acid solution will remove residues from the surface or edges of conductor lines that may be left on some alloys. Dilute chromic acid has also been used for this purpose. Spray rinse thoroughly with deionized water after etching.
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Nickel and Nickel-Based Alloys Nickel is increasingly used as a metal cladding, electroplated deposit, or electroformed structure for printed wiring because of its welding properties. Nichrome- and nickel-based magnetic alloys are other examples of materials requiring special etching techniques. The methods previously described are adaptable to image transfer and etching of nickelbased materials. Etching uses ferric chloride (42 Baum ) at about 100 F. Other etchants include solutions made from one part nitric acid, one part hydrochloric acid, and three parts water, or one part nitric acid, four parts hydrochloric acid, and one part water.
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Stainless Steel Alloys of stainless steel are used for resistive elements or for materials with high tensile strength. Etching of the common 300 to 400 series can be done with the following solutions:
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