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This requires a huge number of measurements. For a board with N networks, the total number of measurements M required would be: M = (N2 N)/2 For example, a fairly ordinary board with 1,000 networks would require 499,500 measurements. Fortunately, several means of reducing the measurement burden have been developed. The program preparation software can analyze the conductor pattern on the board and, noting that short circuits should occur only between physically adjacent conductors, reduce the number of measurements required. This is termed adjacency analysis. To achieve further time savings, the testing department might use an indirect measurement method. Please refer to Sec. 38.4.4. Some indirect methods require only a single probing action of each net, combining continuity and isolation testing with some extra probing to verify any suspect results. Theoretically, our example board with 1,000 networks might have isolation verified with only 1,000 probe placements.
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Economics of Flying-Probe Systems The primary limitation of flying-probe test systems is throughput. Although systems with up to 16 test heads are commonly available, these systems still lose a substantial fraction of the operating time due to mechanical positioning of the heads. Yet the cost savings derived from elimination of direct fixture costs, fixture support infrastructure, fixture debugging, and so on, are substantial. Accurate comparison of the costs associated with grid and prober methods requires inclusion of all the costs associated with each approach. Common omissions include:
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Labor overhead Floor space allocated to fixture storage, materials, and assembly Costs outside the test department (such as drilling) Stranded investment in completed fixtures, pins, other fixture materials Stranded investment in drills and other equipment Lost throughput of test systems due to maintenance Lost throughput of fixtured systems during fixture setup, debugging, and maintenance Peak throughput demand
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It is quite possible that, depending upon product mix, a testing department would be made more efficient with a larger investment in capital equipment (in the form of flying probe systems) and a smaller investment in fixtures. With smaller runs and/or smaller lots necessitating frequent fixture teardown/bring-up, this becomes more likely.
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Flying-Probe Throughput Enhancement Systems The tremendous advantages of flying probers for advanced substrates (such as the ability to hit the smallest targets even on large panels, the lack of fixture cost, witness mark reduction or elimination, and fractional ohm measurement) have traditionally been offset by the relatively slow speed of test compared to universal grid methods. As products have included increased amounts of high-density features, test managers find that flying probers are the solution that can reliably contact the smaller features without damaging them. This has provided tremendous motivation for flying-probe manufacturers to find ways to increase throughput.
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Recognizing that many of the test targets are easily measured (only a fraction of the sites on most boards presents the majority of the challenge), one new approach uses an extra piece of equipment to prescreen the boards before they are placed on the flying prober, eliminating many of the measurements from the flying prober s task list. This approach is described in this section, with each of the two commercially available models summarized. In the first case, a row of thousands of regularly spaced sliding contacts moves relative to the board surface, scanning the surface electrically as a row of scan lines. The contacts are designed to be individually flexible and to apply minimum force, eliminating witness mark concerns for most surfaces. Adjacent to the row of contacts is a planar section of a pliant conductive surface. This surface electrically grounds all exposed conductors on the board that lie beneath any part of the planar area.This conductive plane is fixed in position relative to the row of scanning contacts and extends to within a fraction of an in. of the row of scanning contacts. The relationship is illustrated in Fig. 38.20.
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FIGURE 38.20 Flying-probe throughput enhancement system. (Courtesy of Everett Charles Technologies.)
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As relative motion of the board to the scanning contacts/pliant conductive plane occurs, a high-speed measurement apparatus constantly makes measurements among the scanning contacts and between the scanning contacts and the pliant conductor. For example, if a scanning contact is at one moment making electrical contact at one point end of a network so that another end of the same network is being grounded by the compliant planar surface, then current injected into the scanning contact will fail to increase the voltage of (that is, fail to charge)
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