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33. Nappi, L., Rapelo, J., Pohjonen, H., Holloway, P., and Ristolainen, E., Integrating Passive Components with Thin-Film Deposition, HDI, July 2000, pp. 38 48. 34. Logan, Elizabeth A., and Young, James L., Integration Ends Passives Domination of Wireless Circuits, Electronic Packaging and Production, August 2000, pp. 26 30. 35. Hou, Zhenwei, Johnson, R. Wayne, Yaeger, Erin, Konarski, Mark, and Crane, Larry, Lead-Free Solder for Flip Chip, HDI, September 2000, pp. 38 47. 36. Young, Jedediah J., Malshe, Ajay P., Brown, W. D., and Lenihan, Timothy, Modeling and Analysis of Very Thin Silicon Chips for Conformal Electronics Systems, paper presented at the International Conference and Exhibition on High-Density Interconnect and Systems Packaging, , Santa Clara, CA, April 18 20, 2001. 37. Railkar, Tarak A., and Warren, Robert W., in Brown, William D., and Ulrich, Richard K. (eds.), Electronic Package assembly Advanced Electronic Packaging, 2nd ed., Wiley-IEEE Press, 2006. 38. http://europa.eu.int/eur-lex/pri/en/oj/dat/2003/l_037/l_03720030213en00190024.pdf. 39. Malshe, Ajay P., O Neal, Chad, Singh, Sushila B., Brown, William D., Eaton, William P., and Miller, William M., Challenges in the Packaging of MEMS, International Journal of Microcircuits and Electronic Packaging, Vol. 22, No. 3, 1999, pp. 233 241. 40. O Neal, Chad B., Malshe, Ajay P., Schmidt, William F., Gordon, Matthew H., Reynolds, Robert R., Brown, William D., Eaton, William P., and Miller, William M., A Study of the Effects of Packaging Induced Stress on the Reliability of the Sandia MEMS Microengine, paper presented at the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 8 13, 2001.
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TYPES OF PRINTED WIRING BOARDS
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5.1 INTRODUCTION
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Since the invention of printed wiring technology by Dr. Paul Eisner in 1936, several methods and processes have been developed for manufacturing printed wiring board (PWBs) of various types. Most of these have not changed significantly over the years; however, some specific trends continue to exert major influences on the types of PWBs required and the processes that create them: 1. Computers and portable telecommunications equipment require higher-frequency circuits, boards, and materials, and also use more functional components that generate considerable amounts of heat that need to be extracted. 2. Consumer products have incorporated digital products into their design, requiring more functionality at ever-lower total cost. 3. Products for all uses continue to get smaller and more functional, driving the total circuit package itself to become more dense, causing the PWBs to evolve to meet these needs. These trends have led to the larger use of nonorganic base substrates, such as aluminum and soft iron. In addition, alternate ways to create boards have been developed. These will be discussed in this chapter, along with the traditional board structures and processes. The terms printed wiring board, PWB, and board will be used synonymously. Also, the words laminate, substrate, and panel will be used interchangeably.
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5.2 CLASSIFICATION OF PRINTED WIRING BOARDS
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PWBs may be classified in many different ways according to their various attributes. One fundamental structure common to all of them is that they must provide electrical conductor paths which interconnect components to be mounted on them. 5.2.1 Basic PWB Classifications There are two basic ways to form these conductors:
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1. Subtractive: In the subtractive process, the unwanted portion of the copper foil on the base substrate is etched away, leaving the desired conductor pattern in place. 2. Additive: In the additive process, formation of the conductor pattern is accomplished by adding copper to a bare (no copper foil) substrate in the pattern and places desired. This can be done by plating copper, screening conductive paste, or laying down insulating wire onto the substrate on the predetermined conductor paths. The PWB classifications given in Fig. 5.1 take into consideration all these factors, i.e., fabrication processes as well as substrate material. The use of this figure is as follows:
Column 1 shows the classification of PWBs by the nature of their substrate. Column 2 shows the classification of PWBs by the way the conductor pattern is imaged. Column 3 shows the classification of PWBs by their physical nature. Column 4 shows the classification of PWBs by the method of actual conductor formation.
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