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connected by conveyor belts to create the inline process. In fact, the final step cleaning the circuit board may also be a part of the assembly process sequence. Of course, various levels of automation may be considered, depending on production volumes and capital expenditure costs. However, with continued miniaturization of surfacemount products as well as the strict requirements for the repeatable placement of specific solder paste volumes and accurate placement of components, it will be a foregone necessity to assemble surface-mount technology with a fully automated assembly process. Mixed technology refers to the combination of surface-mount and through-hole components on the same printed circuit board.The lack of components in a surface-mount package is nearly always the reason for using a through-hole counterpart. In general, the surface-mount devices are soldered first to the top side of the circuit board using a convection/radiation reflow furnace or vapor-phase soldering machine process. (Surface-mount is performed first because the through-hole components would interfere with solder paste printing and pick-and-place steps.) The through-hole components are then soldered to the board. The actual soldering process is performed at the bottom side. For larger numbers of through-hole components, the board is wave-soldered. If there are surface-mount components located on the bottom side, they can likewise be wave-soldered; however, those components must first be secured in place by an adhesive. Hand soldering may be preferred if there are relatively few through-hole devices or if bottomside surface-mount devices cannot be exposed to the solder wave.
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Pb-Free Soldering Pb-free soldering technology has affected surface-mount technology. Fortunately, the fallout has not included the need for new automation equipment. Lead-free solder paste behaves essentially the same as its Sn-Pb counterpart in the printing process. Slight modifications have been suggested for the screen and stencil apertures to accommodate the reduce solderability of Pb-free alloys once the paste enters the reflow furnace. Pick-and-place equipment can remain unchanged by a Pb-free soldering process. Reflow furnaces must be able to accommodate the higher process temperatures required by Pb-free solders. Vapor phase reflow machines are available with fluids that provide the higher process temperatures needed for Pb-free assembly. (As noted earlier, significant equipment costs are associated with altering a wave-soldering machine for the Pb-free assembly, which would pertain to mixed-technology printed circuit boards.Those costs include the replacement of the solder as well as the replacement of some components that are susceptible to erosion by the high-Sn alloys.) The most significant impact of Pb-free technology is in reflow process parameters, specifically the time-temperature profile. Longer times at higher reflow temperatures increase the likelihood of thermal damage to components and substrate materials. Also, in seeking to reach higher reflow temperatures, one must also consider the sensitivity of the solder paste to the temperature ramp-up rate.An incompatibility between the paste and time-temperature profile can lead to increased levels of defects such as voids, solder balls, short-circuits due to paste slump, etc. Similarly, excessively fast cooldown rates from the higher reflow temperatures can result in board warpage and cracked passive devices. The greater need to control the Pb-free time-temperature profile favors greater control capabilities for the reflow furnace. The Pb-free solders have intrinsically poorer solderability performance than their Sn-Pb counterparts. The slower rate of wetting and spreading is not as critical of a factor in reflow surface-mount assembly as it is the faster wave- and hand-soldering processes. However, the higher surface tension of Pb-free alloys may limit the extent of solder spreading on a pad, particularly with bare Cu, leaving the corners uncoated by soldre. The choice of flux and use of alternative surface finishes can mitigate this artifact in some cases. A high surface tension also increases the likelihood of tombstoning by passive devices particularly for the smaller chip resistors and capacitors. The degree of tombstoning can vary from the device having one termination just lifting from the pad to the component standing up completely on one end.
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