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Print & etch Subtractive Rigid Graphic DSB Additive MLB SSB Organic base Flex Subtractive DSB MLB PTH Non Print & etch Non PTH Pattern plating PTH DSB RigiFlex Subtractive MLB PWB Rigid Discrete wire Flex RigiFlex Subtractive Inorganic base Graphic Rigid Additive DSB Pattern plating DSB Wirewrap Multiwire PTH SSB Panel plating Panel plating PTH PTH Panel plating DSB MLB Non PTH PTH PTH Pattern plating Panel plating Pattern plating
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Classification of printed wiring boards.
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TYPES OF PRINTED WIRING BOARDS
Column 5 shows the classification of PWBs by the number of conductor layers. Column 6 shows the classification of PWBs by the existence or absence of plated-throughholes (PTHs). Column 7 shows the classification of PWBs by production method.
ORGANIC AND NONORGANIC SUBSTRATES
One of the major issues that has arisen with the ever-higher speed and functionality of components used in computers and telecommunications is the availability of materials for the PWB substrate that are compatible with these product and process needs. This includes the stresses on substrate material created by more and longer exposure to soldering temperatures during the assembly process, as well as the need to match the coefficient of thermal expansion for components and substrate. The resultant search has found new materials, both organic and nonorganic based. The details of these materials are explained in Chaps. 6 through 11, but this outlines the basic character of the two types of substrate.
Organic Substrates Organic substrates consist of layers of paper impregnated with phenolic resin or layers of woven or nonwoven glass cloth impregnated with epoxy resin, polyimide, cyanate ester, BT resin, etc. The usage of these substrates depends on the physical characteristics required by the application of the PWB, such as operating temperature, frequency, or mechanical strength.
Nonorganic Substrates Nonorganic substrates consist mainly of ceramic and metallic materials such as aluminum, soft iron, and copper-invar-copper. The usage of these substrates is usually dictated by the need of heat dissipation, except for the case of soft iron, which provides the flux path for flexible disk motor drives.
GRAPHICAL AND DISCRETE-WIRE BOARDS
Printed wiring boards may be classified into two basic categories, based on the way they are manufactured: 1. Graphical 2. Discrete-wire
5.4.1 Graphical Interconnection Board A graphical PWB is the standard PWB and the type that is usually thought of when PWBs are discussed. In this case, the image of the master circuit pattern is formed photographically on a photosensitive material, such as treated glass plate or plastic film. The image is then transferred to the circuit board by screening or photoprinting the artwork generated from
PRINTED CIRCUITS HANDBOOK
the master. Due to the speed and economy of making master artwork by laser plotters, this master can also be the working artwork. Direct laser imaging of the resist on the PWB can also be used. In this case, the conductor image is made by the laser plotter, on the photoresistive material, which is laminated to the board, without going through the intermediate step of creating a phototool. This tends to be somewhat slower than using working artwork as the tool and is not generally applied to mass production. Work continues on faster resists, as well as exposure systems, and this method will undoubtedly continue to emerge.
Discrete-Wire Boards Discrete-wire boards do not involve an imaging process for the formation of signal conductors. Rather, conductors are formed directly onto the wiring board with insulated copper wire. Wire-wrap and Multiwire are the best known discrete-wire interconnection technologies. Because of the allowance of wire crossings, a single layer of wiring can match multiple conductor layers in the graphically produced boards, thus offering very high wiring density. However, the wiring process is sequential in nature and the productivity of discrete-wiring technology is not suitable for mass production. Despite this weakness, discrete-wiring boards are in use for some very high density packaging applications. See Fig. 5.2 for an example of a discrete-wiring board.
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