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FIGURE 40.20 Turret head used to retrieve chip components from a tape and place them on the circuit board. (Photo courtesy of Universal Instruments.)
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well as an increased demand for placing bare die (flip-chip) components on more densely populated circuit boards. Equipment manufacturers and users must continually address new package configurations with different I/O geometries. 40.3.3.3.2 Gantry Systems (Active Devices). The gantry-style architecture differs from the turret because the printed circuit board is fixed in place and the moving gantry locates the
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TABLE 40.3 Capabilities of Turret Chip Placement Technology Property Part range Part capacity Placement speed Capabilities Range 0201 (English) passive chip devices to 10 mm area-array packages Several hundreds 25,000 40,000 CPH* 1. Handle both chips and small area-array packages. 2. Moving turret and PCB to increase placement speed. 3. Flexibility of using either tape or bulk part supply.
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component over the correct position (see Fig. 40.21). The part feeder is stationary. The gantry method is typically used to place larger components (e.g., SOICs, PLCCs, etc.). Several attributes of gantry technology are listed in Table 40.4. Several equipment variations can be specified to increase the variety of parts placed on the circuit board. Each gantry is made to accommodate different parts when equipped with a multispindle placement head. The placement head is positioned at each feeder location to receive a part. Then, the head moves the component to the upward-looking vision station for inspection
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FIGURE 40.21 Gantry architecture used for placing larger components such as SOICs, PLCCs, and areaarray packages. (Photo courtesy of Universal Instruments.)
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TABLE 40.4 Capabilities of Gantry Technology Property Part range Part capacity Placement speed Capabilities Range Full SMT (SOD, SOT, SOIC, PLCC, CCGA, BGA), direct-chip attach (DCA), and odd-form components. Several hundreds 5,000 15,000 CPH* 1. Oversized and odd-form parts placed with very high accuracy. 2. Moving gantry, fixed PCB and feeders. 3. Flexibility of using tape, tube, bulk, and tray part supplies.
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followed by its placement on the printed circuit board. A second option is a placement machine made with dual gantries, each placing a single component type or multiple components with the spindle head option. Several features in gantry-style equipment allow component placement speeds to approach those of turret systems in high-speed models. See Table 40.5 for the performance
TABLE 40.5 Capabilities of High-Speed Gantry Technology Property Part range Part capacity Placement speed Capabilities Range Full SMT (Passives, SOD, SOT, SOIC, PLCC, CCGA, BGA), direct-chip attach (DCA), and odd-form components. Several hundreds 15,000 21,000 CPH* 1. Oversized and odd-form parts placed with very high accuracy. 2. Oversized board capacity. 3. High volumes of tape, tube, bulk, and tray part supplies.
*CPH = components per hour
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of some dual-beam (gantry) equipment. Machine options that enhance placement speeds include tape splicing for uninterrupted machine operation and simpler bank-changing capability to allow for the rapid changeover of components between different product lines. Also, part inspection can be made using a head-mounted camera while the gantry(ies) is (are) in motion, which eliminates the time interval required for part inspection with a stationary, upwardlooking camera. Further enhancements in capabilities of component placement equipment can be realized in massively parallel architectures.The attributes of this approach are listed in Table 40.6. Multiple placement modules are capable of picking up, inspecting, and placing components at the appropriate location on the circuit board. The circuit board is stepped by an indexing conveyor to locate the placement site precisely under the overhead component.
TABLE 40.6 Capabilities of Massively Parallel Gantry Technology Property Part range Part capacity Placement speed Capabilities Range 0201 (English) passive chip devices to 25 mm area-array packages Several hundreds 60,000 100,000 CPH* 1. Chips and small area-array packages. 2. Large board size. 3. Tape part supplies in multiple bans.
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