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Pb-free soldering would be most significant in this circumstance. It is necessary to verify that a longer hand-soldering time or a higher tip temperature does not cause thermal damage to the component in question or cause the reflow of nearby solder joints. It should be noted that irrespective of whether manual assembly is performed on only stuffed boards that will be subsequently soldered or on circuit boards that have already been soldered, the units have a higher value to them because of this processing, which is performed beforehand. Therefore, any damage (handling, ESD, thermal, etc.) will result in a significantly higher yield loss to production volumes as well as higher costs associated with the repair or scrapping of damaged circuit boards. Therefore, manual assembly steps must be given due consideration during product design and process development activities.
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40.4.3 Automated Assembly The automated assembly of odd-form components uses the same placement equipment as is used for other components, but with special tooling or a dedicated machine (cell), which is already set up with the required tooling and component feeder systems, that can be introduced into the assembly process. The latter equipment typically places more than one type of odd-form component for increased versatility. For example, the close-up photograph in Fig. 40.25 shows the type of gripper tooling that can place different component packages (to within its design limits, of course). After accuracy and component-type requirements are met, speed is the critical performance metric for oddform placement machines. Odd-form component placement is nearly always a bottleneck or slow point in the line; therefore, minimizing assembly time devoted to odd-form components will speed up the entire process flow. There are both advantages and disadvantages to the automated assembly of odd-form components. Advantages include the following: consistent as well as higher quality and faster throughput result from eliminating manual processes. Automated assembly saves floor space, as machines typFIGURE 40.25 Odd-form component placement ically take up less area than operator work benches. machine having a flexible servo-driven gripper tooling Solder that can place a wide range of different component condispensing is integrated into the placement figurations. (Courtesy of Universal Instruments.) process flow, minimizing related defects. Automated assembly complements an overall, computer-integrated manufacturing infrastructure already in place with the other assembly steps that, in turn, facilitate process flow, quality control, and product changeover. Automation eliminates operator-related health and safety issues (fumes, repetitive tasks, etc).
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The disadvantages of automation include the following:
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Capital equipment costs can be high for machines, dedicated tooling, and plant modifications. Prepackaging components are required for automated feeders. Equipment changeover for different product lines is somewhat slower due to the need for special component packaging and/or feeders. Higher production volumes can generate a greater quantity of defective product before a process problem is identified.
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40.4.3.1 Component Packaging Formats. Odd-form components come in a variety of sizes, geometries, and I/O configurations that determine the ease with which the component can be automated into the assembly process line. Another important variable is the component placement machine. Typical component packaging formats for the placement machine include tape and reel (radial and axial leaded), extruded tube, tray, continuous strip, and bulk containers. Each of these formats has benefits and drawbacks, as noted in the following subsections. Industry specifications have standardized nearly all of these packaging schemes. For example, there is EIA-468-B for radial devices and EIA-296-E for axial components. 40.4.3.1.1 Tape and Reel. Tape and reel allows for the delivery of parts to the circuit board at very rapid rates. See Fig. 40.26. Tapes are available generally in three formats: flatcarrier tape, deep-pocket tape, and semi-deep-pocket tape. Flat-carrier tape is the traditional method of carrying both odd-form (as well as form-fit) radial and axial components. It is inexpensive and can provide a large quantity of parts for rapid placement rates. Deep-pocket and semi-deep-pocket tapes provide room for the larger component bodies. The packaging of multiple parts having a similar pitch is possible with semi-deep-pocket tape; the particular advantage is to conserve feeder space, particularly when only a few of each type of component are required on the circuit board.
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