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FIGURE 40.26 Radial components packaged in tapes that would come off of reels. (Courtesy of Universal Instruments.)
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Several drawbacks are associated with tape carriers. For example, tall or heavy parts may change position or break the cover of deep-pocket tape carriers. The potential consequence is that the tape and/or components will jam or damage the feeder mechanism of the placement machine, thereby interrupting the assembly process. 40.4.3.1.2 Extruded Tube. Extruded tube is a commonly used format for odd-form components. See Fig. 40.27. Components such as D-Sub connectors, phone jacks, transformers, relays, and shrouded headers are typically supplied in tube packaging. Recently, component manufacturers have begun to supply long connectors such as single inline memory modules (SIMMs), DIMMs, and other designs of long-aspect ratios in edge-stacked tubes. Tube packaging is particularly beneficial for protecting the component at a reasonable cost. Also, tubes are less likely than tape to cause problems feeding components into the placement machine. Of course, it is necessary to verify that the tube geometry is compatible with the feeder mechanism on the placement machine. The tube material should be sufficiently thick so as not to bend readily. Bending of tubes is the primary cause for the jamming of devices inside
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Components Packaged in Extruded Tubes
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FIGURE 40.27 Components in tube packaging. (Courtesy of Universal Instruments.)
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of them during the feeding process. Moreover, heavy components packaged in thin cross-sectional tubes may actually interfere with adjacent tubes when stacked in the automated feeder. 40.4.3.1.3 Matrix Trays. Matrix (or waffle) trays are an inexpensive means to supply components that are generally too large or heavy for tube or tape packaging and must be individually separated from one another. See Fig. 40.28. An important consideration is that the trays themselves may not be a suitable starting point for the automated placement processes especially for very small components. First of all, the components have too much room to move about in each bin to establish coordinates for initiating the pickup and insertion process. Also, component leads are not always oriented correctly in the insertion plane.
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FIGURE 40.28 Components packaged in matrix trays. (Courtesy of Sandia National Laboratories.)
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Several potential issues may need to be considered when choosing trays. Trays lack the rigidity required by many assembly machines for part pickup. Also, trays hold a more limited quantity of parts to the placement machine, and thus require more operator changeout during assembly. There are no standards for vacuum-formed trays that are used for odd-form components. Lastly, trays simply take up a greater amount of feeder space in a placement machine and on the floor.
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40.4.3.1.4 Continuous Strip. Continuous strip packaging is designed for high-volume automation applications of odd-form components.This technique eliminates the need for separate component packaging formats because the individual parts are all attached in sequence to a single metal or plastic strip as part of the assembly process. The parts are located with a specified pitch that can be accommodated by the placement machine. Some components that are packaged in this manner include headers, battery clips, transformers, and motor brushes. Either the metallic part (e.g., brushes) or the leads that are part of the component can be stamped from a continuous strip of metal or thermosetting plastic. This type of packaging provides high levels of online parts inventory. However, such strips are application-specific and may carry a higher cost to automate due to the need for specially designed feed mechanisms. 40.4.3.1.5 Bulk. Bulk packaging eliminates the expense of component packaging altogether by simply placing the devices in a large container. A significant number of odd-form components are shipped in this format. Of course, the component manufacturer has likely established the cost/benefit of the fallout of parts due to handling and shipping damage versus the cost of added packaging by one of the previously mentioned formats. On the other hand, the degree of part damage may not be acceptable to the circuit board assembly house because of increased downtime due to machine jams and part replacement. Bulk packaging is the most difficult packaging format to automate for odd-form components. Generally, bulk components require a specially designed bowl feeder to supply parts to the machine with some degree of consistent orientation, which increases cost and process implementation lead times. Also, the unusual configuration of bowl feeders may require a dedicated placement machine (cell) that may have a significant idle time. The feeders usually take up considerable space and are not easily retooled for product changeover. The placement machine must have then the versatility to orient each part consistently from a haphazard pile of devices so that the pickup device can obtain each unit and correctly place it on the circuit board. In spite of these numerous drawbacks, bulk packaging is a cost-effective approach for odd-form components in numerous product applications. 40.4.3.2 Equipment. Advances continue to be made in the capabilities of odd-form assembly equipment. Early vintage, single-task robotic systems are giving way to machines that perform all of the alignment and functions of modern placement equipment, and which can be integrated into existing assembly lines. New machines are designed for speed and the flexibility to handle different odd-form component geometries as well as a variety of circuit board configurations. Typically, automated odd-form component placement machines use an overhead gantrystyle positioning system and vision and optics systems underneath the head. The emphasis is on placement accuracy given the high component density of surface-mount boards and, in some applications, the use of solder paste-in-hole printing methods for a 100 percent reflow soldering process. The component must be placed accurately into the solder paste the first time so that the solder paste is not disturbed, which can result in potential defects. Interchangeable grippers and vacuum pickups as well as improved component feeding mechanisms provide greater flexibility for different product types, faster placement rates, and minimum equipment downtime.
Cleaning The cleaning of assemblies having odd-form components, like the placement of those devices themselves, can occur at one of several points along the assembly process. If the components are placed prior to the principal soldering step, then they will be cleaned along with the rest of the circuit board. The higher temperatures of a Pb-free solder process can make this cleaning step somewhat more difficult, depending on the tenacity of the flux residues. On the other hand, when the odd-form devices are soldered to the circuit board after the primary soldering process has taken place, the subsequent cleaning procedure must take into
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