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performance attributes are determined for a given machine, they must be integrated to predict the performance of the entire assembly line. For example, it is preferred that the throughputs of the individual machines be matched for the product application. A mismatch of machine capabilities can generate bottlenecks in the assembly process. The slowest machine or function then controls the production rate of the entire line. The obvious consequence of a bottleneck is an underutilization of the other equipment, which ultimately appears as an increase in manufacturing costs. But there are also quality control reasons to smooth out the flow of bottlenecked assembly processes. For example, if the component placement machine has a throughput of 100 circuit boards per hour, but the reflow machine can only process 90 circuit boards per hour, then printed and stuffed boards will spend time in the open factory air awaiting entry into the reflow step. The consequence is a degradation of paste properties, resulting in the increased likelihood of solderability defects and a drop in product yield. Such technical ramifications must also be addressed when considering equipment utilization for an assembly process.
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Costs There are several cost factors to consider when establishing an assembly line: the initial capital investment for the machine(s); depreciation and lifetime (obsolescence) of that equipment; operational costs such as labor rates, electricity, water, or the use of inert atmospheres; and maintenance support costs. Many of these cost factors are determined on a per product unit basis so that an estimate of potential production volumes is often required for their calculations. Many OEMs and CMS providers have had to establish their own cost models to take into account labor rates, energy costs, shipping costs, and tax structures that are specific to the assembly plant location on-shore as well as overseas. Because of the cost variables just mentioned, it is difficult to establish a universal model for these calculations. When addressing the implementation of Pb-free soldering technology, one must consider two aspects regarding equipment costs. First are the direct costs of purchasing and installing equipment that can provide a Pb-free assembly capability. Second is the cost of simply developing a Pb-free assembly line in the factory. Regarding the first point, equipment capability vis- -vis Pb-free solder pertains primarily to the soldering process, including the reflow furnace, wave-soldering machine, soldering irons, etc. Printing and placement equipment is largely unaffected by the Pb-free soldering technology. Most reflow equipment used for Sn-Pb soldering is nominally capable of also supporting Pb-free soldering for moderately complex circuit boards. Changes are simply made to the time-temperature profile of a reflow furnace. On the other hand, for more highly complex products, a replacement reflow furnace may be required that has more than the typical five to seven zones. A larger number of zones allows more flexibility and greater control over the time-temperature profile. In the case of wave soldering, the exchange of Sn-Pb solder for a Pb-free alloy may also require the replacement of the pot, impeller, and baffles to prevent excess erosion by the higher Sn solders. Last, it is expected that erosion of soldering iron tips will be greater with the Pb-free solders. Tip technology has changed little from the Ni-coated or Fe-conted Cu core construction. Therefore, it may simply be a matter of stocking extra tips for those operators using Pb-free solders. The second cost aspect addresses the manner in which a Pb-free capability is to be implemented on the factory floor. Specifically, the decision must be made whether to have separate Sn-Pb and Pb-free solder assembly lines or to mix the two technologies using the same assembly equipment. Critical factors include capital costs, factory floor space, infrastructure required to prevent inadvertent mixing of technologies, and projected product volumes. It is preferred to separate the two assembly capabilities physically. This separation is not limited to the actual machines, but also includes support functions such as solder material storage and component inventory control in order to prevent the use of the wrong solder or components and circuit boards with incorrect finishes. The extent of this separation of capabilities will determine the
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