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FIGURE 41.6 Various conformal coating defects. (a) Coating on connector pins (b) Cracked or crazed coating (c) Delaminated or blistered (d) Uncoated areas (e) Excess coating drips and runs (f) Excess coating bridging flat pack leads (g) Solvent runoff from rework affecting surrounding coating (h) Overheated, burned coating from rework (i) No buffer coating applied to Glass parts when used with hard coating at cold (j) Dewetting; coating beading up instead of wetting to board (k) Excess coating interfering with movable items (l) Excess coating in masked areas (m) Excess bubbles from trapped solvents (n) Insufficient coverage on corners and edges (o) No coating applied under parts (p) Uncured coating under parts.
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CONFORMAL COATING
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Mask Removal Mask materials should be removed carefully; to prevent peeling, it may be desirable to score or cut the coating at the edge of the mask so that the coating tears along the correct line. Ensure that the mask is removed entirely and that no residue has been left behind on the board. Latex mask that has been overheated will be sticky and difficult to remove completely, as will overheated masking tapes.
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Since the different varieties of available coatings vary widely in their properties, removal methods must be evaluated and developed on practice boards first before being used on deliverable CCAs. The coating can then be removed as easily as possible, with the least risk to the CCA. Several methods to remove conformal coating are:
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Using a solvent to loosen or dissolve the coating Using a hot soldering iron or hot-air nozzle to solder through the coating while simultaneously removing the offending electrical part Mechanically cutting, abrading, or picking away the coating Etching the coating away using rarefied gas plasma (typically for XY coating only)
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Solvent The easiest coatings to remove are acrylics, since they do not react when they are applied. For local coating removal, the area to be repaired can be cotton swabbed several times with the proper solvent. Care must be taken to keep the solvent only in areas that are to have the coating removed. The entire board may be stripped of coating with a solvent soak. This is most useful on acrylic coatings, but is also possible for some urethanes and silicones, which swell and loosen when soaked. Note that this process may damage the components or solder joints on the board, which will be stressed as the expanding coating pushes up the components. The solvent may attack the components and PWB itself; epoxy coatings cannot be removed with solvent or chemical strippers, since many parts and the PWB are also made of epoxy.
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Thermal Thin coatings may be loosened from solder joints with a soldering iron or a hot-air reflow tool, while the faulty part is being desoldered. The area is then cleaned of charred and or damaged coating, and the repair completed. Although this method is simple, it usually produces toxic gases, and must be performed with adequate ventilation.The decomposed coating is also difficult to clean off of the board and soldering iron.
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Mechanical Mechanical means such as scraping and picking are necessary to remove all coatings, even if the bulk has been removed via one of the preceding methods. Softer coatings such as UR or SR can be scraped away with a wood implement, so as not to cause damage. A soft rotary tool may be used for larger areas. The board may be heated slightly to make the job easier. For harder coatings, a hot knife is used to cut through the material.
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A microabrader can also be used to abrade the material away. The surrounding board areas must be protected from contamination by the abrasion media. 41.6.4 Plasma Etch An extended plasma etch will remove XY coatings from large areas, since the plasma erodes the surface evenly. Since the plasma will chemically change the surface (leaving behind oxides, reduction products, and ash), compatibility of the plasma-stripped surface with the new coating must be verified.
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