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Surface finish is defined as the outerlayer metallization on a component or substrate being soldered. Both the type and quality of the surface finish have a major impact on surface solderability and on process soldering ability. Here, solderability is defined as the ability of the surface to be wetted by a solder, and the forming of an intermetallic layer between the solder
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and the base metal. Soldering ability is defined as control of the soldering process parameters, such as a heating profile that produces that wetting action. The preference is always to have a surface that exhibits good solderability that is, ease of wetting and formation of high-quality solder interconnections for all soldering processes and materials to which it might be exposed. Soldering ability is best described as the quality of a solder process such that the operating window is wide, that is, the process is not overly sensitive to minor shifts in process parameters such as time and temperature.Thus a process with good soldering ability would be easy to control and would produce high-quality interconnections given that the incoming materials have good solderability.
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Substrate Finishes The substrate surfaces of choice are usually one of the following: electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability.
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ENIG This finish is widely used because it provides a very flat surface for surface-mount component placement. It has good solderability and a long storage life but is somewhat expensive compared to other finishes. Careful control of the gold plating process during board fabrication is required to prevent a defect known as black-pad. Black-pad is caused by galvanic corrosion of the nickel layer, creating corrosion products that affect the ability of the surface to be wet with solder. If severe enough, black-pad will impact reliability of the final solder joint. ImAg Immersion silver provides a flat surface with good solderability and storage life. It is also less expensive than ENIG. However, the ImAg finish is prone to tarnish under certain atmospheric conditions; in the presence of sulfur, it forms sulfides that darken the surface and reduce solderability. OSP Organic solder preservatives are inexpensive and also provide a flat surface for surfacemount technology (SMT) placement. Storage life for OSP is less than for the metallized finishes, and multiple thermal cycles cause it to degrade. HASL One of the oldest surface finishes, HASL is based on exposing the PWB to molten solder and then removing excess solder using hot-air knives. In the lead-free world, the processing temperature is higher than for tin-lead. HASL is inexpensive, has good solderability if the solder is sufficiently thick, but has the disadvantage of not being a flat surface. ImSn This finish is similar to immersion silver in most characteristics. However, because tin tends to form metallic whiskers that can cause electrical shorts, it is not widely used.
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Component Surface Finishes Component surface finishes, like those of substrate finishes, are intended to provide good solderability. In the past, the majority of component leads had a tin-lead solder finish. This finish was either plated on the base metal of the component or was applied by dipping the leads in liquid metal. Given the push for lead-free assembly, most of these finishes containing lead are being replaced by alternatives. The main contenders in replacement of lead containing finishes are based on noble metals (e.g., palladium or gold) or some form of tin plating. Palladium finishes have been in use for many years and are a known commodity. However, as noted previously, the tendency of tin to form metallic whiskers as a result of stresses in the plated layer is a matter of serious concern for the electronics industry.
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