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Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
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personal computers (PCs) in use today. They must be built small enough to fit in a pocket and be shock-resistant. The ever-increasing demand for product performance drives increases in component density, the number of I/Os, increased board layers, and finer printed wiring board conductor trace spacing in order to make electrical routing possible. Higher density boards and higher layer counts result in more thermally massive assemblies, which are more difficult to solder during surface mounting and doubly difficult to assemble during wave soldering. When both surface mounting and wave soldering are used on the same assembly, it is referred to as mixed-mount technology. The proliferation of press-fit connections (force fitting compliant electrical contacts into a circuit board s plated through-holes) has alleviated some of the problems of mixed-mount assembly and has been driven largely by the difficulties faced in wave soldering large and thick circuit boards. See Chap. 49 in this book for an introduction to press-fit technology. Land grid arrays (LGAs) with separable pressure interconnect has become more prevalent especially for highend motherboards for computing and telecommunications. LGA incorporation on a board has influence on layout and implications for soldering. This will be discussed in Chap. 50. In the fifth edition of this handbook, there was a separate chapter on Pb-free soldering. Since Pb-free is now the primary focus of electronics manufacturing, its impact has been incorporated into the text of this chapter, which previously concentrated only on Sn-Pb soldering. The reader should understand that Sn-Pb soldering is still important, as many types of electronic assemblies will still be manufactured with lead-based solders until the year 2010 as per the new EU Restriction of Hazardous Substances (RoHS) legislation. Also, there may be problems associated with mixing Pb-free solders with leaded (Pb d) packages and Pb-free packages with Pb d solder. Since the latest EU legislative initiatives have profound effects on every aspect of electronics manufacturing, it is necessary to understand the impacts before delving into the technology of soldering.
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44.2 ELEMENTS OF A SOLDER JOINT
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There are three important constituents of a solder joint: the two materials or surfaces to be joined and the solder itself. Each has its own set of attributes and variables that contribute to the ease and quality of soldering. A delicate balance of material conditions and process parameters determine the solder joint appearance, resultant strength, and reliability of the soldered assembly. The composition of the solder, the surface finish on lead, pad or plated through-hole (PTH), environmental factors, chemical implications, and thermal conditions all impact the soldering process. Each will be discussed.
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44.3 COMMON METAL-JOINING METHODS
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Welding, brazing, and soldering are the three most widely used metal-joining techniques. Although this section does not provide a rigorous review of welding and brazing, a cursory comparison of these metal-joining processes is useful in setting the stage for an in-depth discussion of circuit board soldering. Welding involves heating of two similar or dissimilar abutting metals to the point that they fuse into one another. Unlike brazing and soldering, there is considerable depth to the metallurgical changes at their interface that take place in the metals being joined during welding. Sometimes a filler metal is applied to lower the melting temperature of the weldment metals or for desired mechanical properties of the finished bond. As in brazing and soldering, sometimes chemical treatment is required to help dissolve surface oxides and also a cover gas may be applied to retard oxidation during the high temperatures of the bonding process. There are three distinguishing characteristics that differentiate welding from brazing and soldering: the temperature of the bonding process, the depth of material dissolution from the bonding surfaces, and the reliance on surficial wetting and spreading of the filler material.
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