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Several general issues regarding fluxes must be considered before selecting one for a process and product.
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Solder Paste Misprint Cleaning When solder paste is printed in a manufacturing setting, occasionally the paste deposit is misprinted or smeared, requiring that it be removed before reprinting. Although this is not truly a fluxing issue, it does have ramifications to the process and reliability and is an important flux chemistry related topic. Here are some guidelines for accomplishing this.
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Aqueous-Clean Solder Paste Misprint Cleaning A standard aqueous board cleaner or an aqueous stencil washer can be used for solder paste removal. Here are some simple guidelines:
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Ensure that all parts on the board are compatible with aqueous cleaning. Some surfacemount switches may not be compatible and may need to be removed from the board or masked in some way to prevent water or flux residue leakage. If SMD placement has begun, remove any high-value components from the paste on the side that is misprinted or smudged. Do not wipe solder paste off the board, as this will force paste into vias, PTHs, and solder mask clearance areas. Once reflowed, any solder residues may interfere with PTH component insertion or press-fit operations. If tape is used to mask gold fingers or other features, remove it before the commencing misprint cleaning to avoid entrapping solder beads or paste residue beneath the tape. Allow the paste to wash off during the aqueous cleaning process using a standard aqueous cleaning machine or an aqueous-based stencil washing machine Direct immersion of the board should be avoided. Immersion may result in water and diluted flux residues leaking into already mounted switches even into switches that are specified as hermetically sealed and water-wash compatible. Do not use solvents other than water to clean the board. Do not use a saponifer or solvent other than water unless the flux chemistry has been tested and qualified for compatibility and unless saponification or other solvent is in use with standard post-solder board cleaning. Do not use ultrasonic cleaners. Even random-frequency/random-amplitude ultrasonic cleaners may impact certain devices that may be already mounted on the board (e.g., on the secondary side). Crystal oscillators are notoriously sensitive to ultrasonic cleaning. Other components have been known to fail as a result of ultrasonic agitation and the consequential damage to internal bonds or die attach. After cleaning, use a microscope with as high a magnification as is needed to see individual solder spheres from the paste. Ensure that solder spheres are not present, or, if they are, ensure compliance with the workmanship standard in use. Also ensure that paste beads are not agglomerated in plated through holes. Generally a 30 stereo zoom microscope with good lighting is recommended for this inspection. If excess solder beads are still apparent, the board should be recleaned. Try rotating the board 90 or 180 for the repeat cleaning cycle.
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No-Clean Solder Paste Misprint Cleaning Cleaning boards printed with no-clean paste requires a little more care, but many of the same rules apply as for cleaning a water-soluble printed board:
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If placement has begun, remove any high value components from the side that is misprinted or smudged. If tape is used to mask gold fingers or other features, remove it before commencing misprint cleaning to avoid entrapping solder beads or paste residue beneath the tape. Do not wipe solder paste off the board. Instead, allow the paste to melt off in a stream of solvent recommended for the solder paste in the stencil washer or board washer. The solder paste vendor can provide a list of recommended cleaning solutions. Rely on the solvent in stencil or board cleaner to wash off the printed solder paste instead of trying to wipe it off.
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