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Do not use water to clean a no-clean soldered board unless the solder paste manufacturer recommends it, as it may result in a sticky, white residue on top of flux residues. This may impact electrical surface insulation resistance and corrosion. Do not use saponified water with no-clean unless the process has been tested for materials compatibility and subsequent corrosion. Surface insulation resistance (SIR) testing and electrochemical migration (ECM) testing are in order. Direct immersion should be avoided. Immersion can cause cleaning solvents and diluted flux residues to enter switch and other components. This, in turn, can result in an electrical short internal to the switch (from cleaning solvent conductivity), an open (from insulating flux residue), or corrosion (also from flux residue). Do not use ultrasonic cleaning. Even random-frequency or random-amplitude ultrasonic cleaners may impact certain devices that may be already mounted on the board (e.g., on the secondary side). Crystal oscillators are notoriously sensitive to ultrasonic cleaning. Other components have been known to fail as a result of ultrasonic agitation, which can damage or weaken internal bonds or die attach. After cleaning, use a microscope with as high a magnification as is needed to inspect for individual solder spheres from the paste. Ensure that solder spheres are not present; if they are, they should be in compliance with the workmanship standard. Also ensure that paste beads are not agglomerated in plated through holes, as they may interfere with PTH component insertion or press-fit operation. Generally a 30 stereo zoom microscope with good lighting is recommended for this inspection. If excess solder beads are still apparent, the board should be recleaned. Try rotating the board 90 or 180 for the repeat cleaning cycle.
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Do Not Use Aqueous Cleaning on No-Clean Repaired Assemblies Very often, completed boards that are prepared with a water-clean flux formulation are repaired using no-clean flux. This strategy precludes the need for another wash cycle. In another situation, there may be parts that are on the board or associated with an assembly that are not compatible with a wash cycle (electromagnetic interference [EMI] shields, enclosure pieces, etc.); in such cases, a no-clean repair is necessary. However, once a board is repaired with a no-clean flux, it is important not to subject the board to an aqueous cleaning process for the reasons previously described. Conversely, aqueous cleaning must be used if a water-wash flux chemistry is chosen for repair.
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Test for Flux Compatibility Certain no-clean fluxes are not compatible with each other. Their chemical interaction could result in corrosion on the PCA. To avoid corrosion issues, solder paste flux, wave solder flux, and repair flux should be tested separately and in combination for SIR and ECM with the board surface finish.
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Ensuring Full Flux Activation As mentioned previously, it is important to heat the flux sufficiently to activate it (make it chemically reactive) and to burn off the activators by the end of the soldering process. This is true even of no-clean solder chemistries. If an unactivated, insufficiently heated no-clean solder flux is left on a board, the weak organic acids in the flux residue could cause long-term corrosion. Usually temperatures between 80 and 150 C (depending on the flux composition) are sufficient to activate a flux fully.Avoid pooling flux.To minimize the possibility of corrosion,
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dispense liquid flux sparingly by using ultrafine artist paint brushes or fine-tipped, ESD-safe felt fluxing pens or a pick. Of course, the best practice will preclude the use of liquid fluxes. Instead, dispense paste flux with an ultrafine artist paint brush or pick, or use no-clean flux core solder wire to minimize flux deposition and for the best chance of reaching flux activation temperature. 46.7.7 Localized Solvent Cleaning To remove excess flux on a board, cleaning solvents can be used locally. Sometimes these solvents are formulated specifically for flux cleaning and are sold as such. Sometimes pure chemical solvents, such as alcohols, are used. Very often solvents and flux cleaners leave gummy residues on the board. They can also dissolve the no-clean flux residue and redistribute it, leaving a messy-looking assembly. The dissolved residues can find their way into board mounted connectors via capillarity or direct dripping. This can result in electrically insulating flux residues on connector contacts or on board-edge gold fingers. Both can lead to interconnect electrical opens. Methanol is a better cleaner than isopropyl alcohol (IPA) due to lower water content and it dries much quicker and more thoroughly than the latter. Care must be taken with methanol as it is flammable and its fumes are toxic. This is often true of other commercially available flux cleaners. Although sometimes flux cleaning is necessary or useful, it is best to avoid the need for cleaning by minimizing the flux dispensed and dispensing the flux only to the lead or leads to be repaired. Training, skill, patience, and practice are required for accurate flux dispensing and soldering.
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