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throughput requirements and thermal mass of the product design. Board separation may be as small as a few inches, but the effects of board loading and spacing need to be determined empirically and checked to detect any impact on the process time-temperature profile. Any assessment of new equipment ought to include load testing to ensure that the oven can handle anticipated process throughput and capacity. The oven s profile needs to be examined before, during, and after loading of the board train and compared to the performance with the same oven settings for a single board. 47.3.3.5 Ovens and RoHS. The onset of the Restriction of Hazardous Substances (RoHS) legislation and the move to Pb-free reflow has implications for reflow equipment. When using ovens set up for Sn-Pb soldering, there are five areas that the process engineer must pay attention to when making the move to Pb-free reflow. 47.3.3.5.1 Heater Robustness. Check with the reflow oven manufacturer to ensure that the heater and fan assemblies (heater modules) will be compatible with the rigors of the higher oven temperatures associated with Pb-free reflow. Although an oven may be able to reach the higher temperatures, the heater modules may degrade or fail as a result of running close to their maximum rated output. 47.3.3.5.2 Over-Temperature Sensors. Most good reflow ovens are equipped with bi-metallic switches or other over-temperature sensors to prevent catastrophic overheating of heater modules induced by a broken or faulty thermocouple or failing thermal control circuitry. When an oven is set up for Sn-Pb soldering, lower temperature bi-metallic switches are incorporated than when an oven is set up for Pb-free soldering. The lower temperature bi-metallic switches may trip the oven heater circuitry when used with the higher temperatures necessary for achieving Pb-free reflow. This will be most apparent in the highest temperature zone. Check with reflow equipment manufacturer that the bi-metallic switches in an older oven will be compatible with the higher-temperature regimes of Pb-free soldering. 47.3.3.5.3 Firmware. In some older reflow ovens, the computer control heater firmware does not allow the heater modules to be set high enough for Pb-free reflow. If the rest of the oven is compatible for Pb-free soldering, check that heater modules are settable for the higher peak temperatures required of Pb-free soldering. A firmware upgrade may be necessary. 47.3.3.5.4 Seals and Others. Check with the reflow oven manufacturer that soft seals and other oven components in older reflow equipment will be compatible with the higher temperatures of Pb-free soldering. 47.3.3.5.5 Vent Stack. Since vent gases are much hotter when running with most Pb-free solders (due to the higher melting point or melting range of these solders), ensure that all elements of the venting system are compatible with this increase in temperature. This is particularly necessary closest to the oven itself, where vent stack gases are hottest. Check flexible vent ducts, duct seals, flexible vent stack couplings, and stack monitors (manometers, velocimeters, etc.) to ensure that they are compatible or not overheating. 47.3.4 Elements of Reflow The reflow time-temperature profile is of greatest importance in the oven soldering process. It is the relationship of temperature with respect to time required to bring a PCB assembly to solder liquidus and back to solidus before exiting the oven. 47.3.4.1 Profile Dependencies. The solder paste composition, circuit board lay-up (number of layers, board material), component types, component count, and the number of components per unit area on the board will dictate or influence reflow profile characteristics. Oven performance such as heating characteristics (number of heater zones and responsiveness of each module) will dominate the process and profile. Although the requirements of the in use determine each profile, how well the profile is maintained depends on the materials to be reflowed, the heating characteristics, repeatability health of process equipment, and the attention to detail by the process engineer.
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