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Strive for the shortest possible length of thermocouple wire pair that is practical for the application. Long, large diameter wire may conduct heat away from the solder joint to be measured, altering its true heating nature. 47.3.10.3.4 Securing Thermocouples: Thermally Conductive Adhesives. If an adhesive is to be used to hold a thermocouple bead, its thermal conductivity must be taken into account. Most thermally conductive adhesives are not nearly as conductive as metal or solder. The best are filled with high thermal conductivity materials such as aluminum, boron nitride, or other
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thermally conductive ceramics. If the thermal conductivity is not high enough, a false thermocouple reading will result. Thermally conductive adhesives are meant to be applied thinly and conductivity depends on bond-line thickness. It is wise to baseline a conductive adhesive against a soldered thermocouple to ensure that it is not insulating and affecting measurement results. Also ensure that it survives multiple reflow cycles and still maintains it thermal conductivity. Were the adhesive to release the thermocouple bead during the process, then measurement data would be useless. Many adhesives will not tolerate the high-temperature environment of soldering or the continuous thermal cycling encountered in trying to adjust a soldering profile. This is especially true with the onset of Pb-free soldering and the higher soldering temperatures associated with the move away from lead-bearing alloys. High-conductivity adhesives are also expensive. 47.3.10.3.5 Securing Thermocouples: Adhesive Tapes. Tape should be avoided for holding the thermocouple bead to the board as it is known to be an unreliable technique. Problems arise as the tape heats up and stretches, expands, or even releases from the board, allowing the thermocouple bead to float off its measurement target. The tape also shields the thermocouple and target solder joint from the oven ambient, which is contrary to the task at hand measuring the effect of the oven environment on the intended solder-joint location. 47.3.8.3.6 Securing Thermocouples: High-Temperature Solder. Best practice is to use a high-temperature solder to secure the thermocouple bead to its measurement site. The bead is not really soldered, as the K-type thermocouple wire is not easily wettable. Instead, the solder bead is positioned under a component lead, and the lead is soldered with the high-temperature alloy, merely encasing the bead in the solder. The chosen high-temperature solder should have melting range or melting point well above the intended peak reflow temperature. An alloy such as 10Sn/Pb (melting range near 300 C) is appropriate as SAC solder melts in the vicinity of 220 C and the peak soldering temperature is generally less than 255 C. Before applying the high-temperature solder, it is advisable to use a fluxed copper wicking braid to remove any solder associated with normal manufacturing assembly of the board, such as SAC or Sn/Pb, as these may depress the melting range of the high-temperature solder. 47.3.10.3.7 Profile Board Components. The profile board can be populated with dummy or electrically failed or reject components. The board can be used over and over and should be saved. Once the oven profile has been established and data recorded, a quick check of the oven with the profile board before a soldering run is useful to ensure that the oven is working properly and reproducibly. 47.3.10.4 Profile Board Spacing. In ovens with pin-chain conveyors, it is common practice to place the profile logging device (reflow tracker) on a dummy board that is trailed behind the profile board. The distance between the profile board and the dummy board or data tracker carrier should be at least one board length. Thermocouple wire length beyond the thermal profile board should slightly longer than one board length (see Fig. 47.14).
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FIGURE 47.14 The thermal profile board should be kept a distance of about one board length from any dummy board or carrier for the data tracker. This enables the heaters to function properly for a board of a given thermal mass.
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