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CW Scanning In sharp contrast to single-point laser soldering, this technique relies on a larger, defocused moving beam to accomplish the heating. The beam may be many times the size of the narrowest lead or pad dimensions. In this technique, the laser beam generally spills over onto the substrate material, irradiating the lead, pad, or lead-pad combinations as well as interpad board surfaces. Because a larger beam diameter is used, a long focal-length lens and generous delivered laser spot size can be employed. This results in a wide process window in terms of final beam diameter and working distance of lens to the circuit board surface. The laser spot is moved at a rate such that the beam exposure to the board is below the laser damage threshold limit. It heats the lead-pad combination, the solder flux, and the board sufficiently to cause the solder to change state. A variation of this technique utilizes orthogonally mounted galvanometers to move an Nd:YAG laser beam around the periphery of a surface-mount device sitting atop solder lands on a circuit board. The beam is driven at high velocity repetitively around the surface-mount device until all leads are heated to the point of solder liquidus. As the beam is turned off, the solder solidifies and solder joints result. This same galvanometer-driven technique has gained commercial acceptance as a BGA rework tool.A slightly defocused laser beam is aimed at the body of the BGA. The beam is rapidly moved around the package body at a rate below the laser damage threshold of the packaging material. With each pass, the component heats up a little more, eventually melting the BGA solder joints. The package is removed with an automated vacuum pickup tool while the solder is still molten. A new BGA can be attached using this same technique. This method can be applied to any type of rework, although component leads and pads would be targeted rather than the body, as was the case for the BGA.
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Multiple-Beam Laser Soldering One of the attractions of working with a laser is the fact that its beam can be split for multiple use within one station or even shared between two or more stations. The split can be accomplished by the use of bifurcated fibers or beam splitting mirrors. The beam of a single laser cavity can be duplexed to solder two sides of a surface-mount component simultaneously. It is entirely possible to share a common beam between two or more laser soldering stations either simultaneously or in a time-shared manner.
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47.8 TOOLING AND THE NEED FOR COPLANARITY AND INTIMATE CONTACT
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In all modes of laser bonding, the component leads must be in contact with solder lands on the PCB to accomplish joint formation. It is therefore necessary, in most cases, to use a specialized hold-down tool to ensure that leads contact pads. This detracts from the ideal of noncontact laser bonding. Several techniques have been developed and reported. One such method uses a transparent hold-down medium such as glass, quartz, or transparent high-temperature plastics. There are several significant problems associated with this approach, which can result in an inconsistent soldering process. First, these materials are rigid, making it impossible to hold a lead down to a low-lying pad abutted by normal height pads or, conversely, a high pad abutting lower pads (see Fig. 47.35). During the soldering cycle, the glass can accumulate spattered flux and flux by-products that may change the delivered laser beam intensity, adding variability to the process. Comb or pin arrays have been applied that match the lead configuration of a package. This type of fixture is expensive and easily damaged, especially if the soldering flux glues the comb teeth to the bonded component lead. Probably the most common method for rigid-leaded
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