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1. IPC/JEDEC J-STD-033, Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices.
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Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
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49.1 INTRODUCTION
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Electronic connectors are attached to printed circuit boards in four ways (see Fig. 49.1):
Oven reflow surface-mount technology (SMT) soldering Wave soldering (for solder-tail components) Pressure interconnect, a solderless method relying on mechanical forces to hold interconnect elements together to make contact Press-fit, another mechanical, solderless method (which is the subject of this chapter)
Press-fit, also referred to as press-pin, compliant-pin, and a number of other trade names, has been in use for many years and is a proven and reliable interconnect method. Once used exclusively for passive backplanes, more recently press-fit connectors have gained in popularity and are commonly incorporated on complex motherboards and daughter-cards. Just as circuit boards have become more complex (with thicker, higher layer counts, densely routed circuit traces, and high component counts), so too have pressfit connectors. They are available with high pin density (pin pitch down to 1 mm) and pin counts in the thousands per connector and even strip-line shielding for enhanced highspeed signal performance. Press-fit connectors can be applied to either or both sides of a PCA and are repairable, although first-pass assembly yields are always near 100 percent. Press-fit is easier and more reliable than soldering and does not subject the printed circuit assembly (PCA) to additional thermal or chemical processes an advantage for reliability, and especially advantageous for today s dense circuitry. Since it requires very little energy (no soldering), minimizes materials (no solder), and calls for no chemicals for its application, it is environmentally beneficial. The press-fit process is simple in theory and generally so in practice, relying on oversized connector leads forced into in plated through-holes in the PWB. The plated through-holes in the PWB are sized specifically for the press-fit connector to be applied. As the connector pin is forced into the board, there is slight deformation to the press-fit pin and to the PTH barrel. The result is a mechanically stable, electrical contact.
Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
PRINTED CIRCUITS HANDBOOK
FIGURE 49.1 Four methods of connector attach to printed wiring boards (PWBs): (a) SMT applied by reflow soldering; (b) plated through-hole (PTH) solder-tails that are wave-soldered; (c) pressure-interconnect, which relies on mechanical forces for electrical contact; and (d) press-fit, which relies on mechanical deformation of the connector lead and PTH barrel to make intimate electrical contact.
THE RISE OF PRESS-FIT TECHNOLOGY
There is a resurgence in press-fit connector popularity driven by increasing board complexity, the component density of today s PCAs, and the appearance of backplanes populated with active components. Press-fit connectors are typically used on very thick boards that would be difficult, or impossible, to wave-solder. Elimination of wave soldering increases manufacturing yield and allows a denser component layout on the bottom side of the board, contrary to what is dictated by wave soldering. Another advantage of using press-fit connectors is that it is a means of lead (Pb) abatement since no solder is needed for press-fit installation. Given the climate of increasing importance of environmental responsibility and the potential for lead abatement legislation passing in several countries, use of press-fit components will likely increase. Since Restriction of Hazardous Substances (RoHS) legislation allows Pb for certain products such as two-processor servers and telecommunications equipment until 2010, there is no need to solder the same connectors that are press-fitted and, thus, press-fitting significantly limits the need for Pb. Connector bodies may or may not be compatible with the thermal rigors of reflow or wave, so press-fit connectors are typically applied after all mass soldering of the PCA is completed. Further, press-pin connectors are not generally soldered into place since rework would be rendered impractical. Rework of press-fit connectors will be discussed later in this chapter.
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