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In addition to good design, proper assembly strategy and precise assembly are crucial to LGA interconnect reliability. The following steps should help the engineer to achieve good results, but as stated previously, if the design is flawed, interconnect reliability will be as well.
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Order of Assembly LGA-mounted component assembly should be done after all other soldering, press-fit, and mechanical assembly steps are completed. Most LGA sockets are not rated for high-temperature excursions. The stress of other assembly may be enough to interfere with good LGA interconnection.
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Gold pads on the PWB must remain as clean as possible free of solder, flux deposits, chemicals, and contaminations. Once assembled, all chemicals must be kept away from the LGA socket. The heat of rework can also cause interposer damage or LGA device failure, so rework is best completed, where feasible, before LGA assembly. 50.4.2 Prior to PWB Processing A high-temperature masking tape can be used to cover LGA lands on the PWB. This will protect it from flux residue, spattered solder, and so on. The tape should be capable of sustaining multiple reflow cycles. A polyimide tape with acrylic adhesive is recommended to minimize tape adhesive residue. Silicone-based adhesives have been found to leave residues that can interfere with electrical interconnect. Since silicone is largely insoluble in most common solvents, attempts to clean any residue will be futile. 50.4.3 PWB and LGA Land Cleaning It is good practice to clean LGA pads on the IC and the PWB prior to application of the socket. Even if a masking tape is used, there is the opportunity for materials to condense under the tape. A wipe with isopropyl alcohol, methanol, or Vertrel-based cleaners is useful for normal flux condensates and other process residues. Do not flood the area with solvent. Instead, use a solvent-saturated lint-free wipe or sponge. Be aware that even lint-free materials can snag on PWB pads, edges, and drilled holes and may leave fibers or debris. Tests should be made to find the most appropriate and abrasion-resistant cleaning material. Ensure that the cleaned lands are perfectly dry before assembly. A Vertrel-based cleaners is ideal for this due to its low, sub room-temperature boiling point. It can cause some local moisture condensation during the boiling process, which may leave a slight, localized, innocuous discoloration on land surfaces. 50.4.4 LGA Socket Cleaning Although it is important for the socket to be clean, never wipe it to clean as it may damage the fragile contacts. Even the use of compressed air to remove dust may dislodge or damage a contact. It is best to work with the socket supplier to ensure that interposers arrive clean and ready for use. 50.4.5 Inspection Inspect LGA pads on the PWB and on the LGA prior to assembly. Inspect both sides of the interposer to ensure that contacts are present and in good condition. 50.4.6 Socket Application It is important to seat the socket onto the PWB such that it is maintained parallel to the PWB. Applying it at an angle can cause damage to the delicate contacts of the socket and compromise contact reliability. The same can be said about sliding the socket on the board; it is likely to result in socket contact damage. The socket must be oriented properly on the board so that the contact pattern of the socket matches the land pattern on the PWB. There are molded guide pins on the socket that help with this, with one peg larger than the other to match a similar drill pattern in the PWB. The socket usually has a missing corner contact to match the LGA IC package and corresponding LGA land pattern on the PCA. It is important not to drop the LGA IC package on the socket, as doing so could damage delicate socket contacts.
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