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50.4.7 Fastening So many mechanical designs are available that listing any particular method for LGA assembly is impractical. Some rely on spring clips whereas others use traditional screw fasteners, as shown previously. If held by four screws, as often is the case, then a tire lug torque pattern should be employed to ensure even tightening (see Fig. 50.7). Slow and even tightening is important to avoid damage to either the LGA IC device or the LGA socket and to ensure proper compression for reliable electrical contact. The number of revolutions per fastener depends on the pitch of the screw and socket requirements. Ideally, a four-headed torque driver assembly should FIGURE 50.7 Manual torque pattern for be used with each head rotating at the same speed even fastening of the LGA. Each fastener and a calibrated slip-clutch on each driver to prevent should receive the same number of turns or partial turns to ensure even seating of the overtightening of the stack. LGA stack. A tooling plate with strategically located board supports should be created to hold the PCA during LGA stack assembly in order to minimize board flexure and to prevent damage to soldered parts on the PCA.
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LGA Socket Rework and Reuse Ease of IC replacement for upgrade or repair is one of the most important benefits of using pressure interconnect technology. Most LGA sockets are designed for multiple reuses. Check with socket manufacturer for the number of reuse cycles; some are specified for as many as 20. Reliability and reuse depend on a number of factors, including mechanical robustness of the socket, thermal exposure, proper assembly, and contamination from process chemicals such as flux, flux cleaners, alcohol, and so on. Note that there are usually no reuse limits on other parts of the system (LGA IC, printed circuit assembly, bolster plate, heatsink, or pressure plate), but these should be inspected to ensure that contact platings are in good condition and that mechanical fasteners are not showing signs of mechanical wear out. When removing the LGA IC package component or the socket itself, ensure that the socket contacts have not stuck to either the IC or to the PWB lands. If there is contact sticking, the contacts can be bent, broken, or pulled out of the socket. Any of these will compromise interconnect integrity. Sticking is most prevalent with filled-polymer or Fuzz Button style contacts, although there can be enough adhesion of plated spring contacts to LGA IC or PWB-plated lands to result in damage to the fragile socket contacts. It is also important to remove the LGA IC package straight out of the socket to avoid damage to the LGA socket if it is to be reused.
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If soldered joints on the PCA need to be reworked in the vicinity of the LGA stack, use a thermal profile board, perform a mock repair, and measure the thermal effect on the socket. Ensure that the LGA IC and socket temperatures are maintained within their respective manufacturer s thermal guidelines. Also make certain that process chemicals, flux, cleaners, and such do not run under the LGA socket.
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Traces Beneath LGA Elements It is advisable to keep active traces off the surface of the PWB where they could get crushed by the bolster plate or the socket. Since the bolster plate is flat and large, the forces are spread out. The molded socket frame exerts a more concentrated force on the PWB surface due to its narrow outline and could compress any surface traces running beneath it.
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Clearance for Tall Components The pressure plate or heatsink usually overhangs the LGA IC package. For this reason, tall components should be kept outside of the pressure plate/heatsink footprint to prevent mechanical interference with the LGA stack.
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Components Under Bolster As previously mentioned, it is unwise to put components under the bolster plate. If components are required in this area, then the bolster plate should be relieved to allow clearance of these components. This may require the use of an extra-thick bolster plate to preserve its stiffness after relief machining.
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