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ACCEPTABILITY AND QUALITY OF FABRICATED BOARDS
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FIGURE 51.1 Quailty conformance test coupons taken from IPC-2221. (Courtesy of IPC.)
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INSPECTION LOT FORMATION
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An inspection lot consists of all the PCBs fabricated from the same materials, using the same processing procedures and constructions and produced under the same conditions. Differing PCBs can be combined to form an inspection lot, but then they must all be submitted together for inspection. It is the PCB manufacturer s responsibility to maintain traceability for all the PCBs in an inspection lot along with any corresponding test coupons that were separated from the production panels. The success of inspections greatly depends on how the inspection lot is formed. The goal of forming the inspection lot for a particular attribute is to allow, if applicable, a smaller sampling of the inspection lot to be representative of the entire lot. In forming inspection lots and sampling groups, the methodology for producing the attribute and the consistency of that methodology or process must be taken into consideration. Some PCB processes are done in batch form and others are done on a panel-by-panel basis. Understanding process techniques is critical in forming inspection lots and sampling groups that are representative of the product.
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Sampling Inspection For some attributes, 100 percent inspection is not necessary or prudent. In these cases, a sampling of the PCBs from the inspection lot is allowed to represent the entire inspection lot. Most performance documents specify which attributes can use sampling inspection and to what extent sampling may be performed. There are many sampling plans available; the most widely known, and historically used, is MIL-STD-105, which describes an Acceptable Quality Level (AQL) for samples of an inspection lot. However, it allows a small amount of defective material to be considered acceptable and has typically been replaced by sample plans where defective parts that are found during inspection cause the lot to be termed nonconforming. This style of plan is defined as Defective Parts (C) Equals Zero (C = 0). If the inspection lot is
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considered nonconforming during a sampling procedure, the supplier may elect to screen 100 percent for the nonconformance, removing only the nonconforming PCBs from the inspection lot. 51.4.2 Inspection Tool Calibration It is important that the all inspections be carried out with equipment that is calibrated and traceable to internationally recognized standards. Two of the documents that govern inspection equipment and facilities are ISO-17025 and IPC-QL-651.
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51.5 INSPECTIONS CATEGORIES
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51.5.1 Materials Inspection This inspection usually consists of certifications from the material supplier, supported by data from the supplier s own inspections. The materials used must be inspected by the PCB manufacturer to ensure compliance with customer requirements. 51.5.2 Qualification Inspection The PCB supplier must provide proof to the user of its qualifications to build the product specified. The user must then review this proof in order to minimize the risk associated with buying from the PCB manufacturer. This process usually includes the PCB manufacturer supplying a self-declaration of capabilities such as those found in the IPC-1710, and then supplying some kind of physical sample or testing data to support the assertions made in the self-declaration. It is up to the PCB user to determine the level and detail of qualification required. 51.5.3 Quality Conformance Inspection These product verification inspections use specified acceptability criteria and are performed prior to shipment of the PCBs to the customers. These inspections can be defined either by industry or customer standards, or a combination of both. 51.5.4 Reliability Testing This testing consists of looking for imperfections in the PCB that may show up some time during the product s field life. They include accelerated life testing for both the interconnection and insulation attributes of the PCB. Please see Chaps. 57, 58, and 59 for a detailed discussion of reliability testing.
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51.6 ACCEPTABILITY AND QUALITY AFTER SIMULATED SOLDER CYCLE(S)
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The user expects the PCB to survive the assembly and rework process. Temperature excursions that approach or exceed the base material s glass transition temperature (Tg) can significantly affect some attributes of the PCB. For these attributes, it is important that the PCB be examined after solder cycling that simulates the type and quantity of soldering operations (rework included) that the PCB is expected to undergo during the assembly process. It is
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