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When inspecting PCBs, the requirements can be separated into externally observable attributes (those where acceptability can be determined from the outside of the PCB) and internally observable attributes (those that require microsectioning to determine acceptability). The actual requirements vary by specification, but the requirements stated in this chapter generally follow IPC document guidelines.
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Externally Observable Attributes Visual examination for applicable attributes is typically conducted at 3 diopters (~1.75 magnification). If it is not possible to determine whether the condition is acceptable at this magnification, progressively higher magnifications should be used to confirm acceptability. Dimensional requirements such as conductor spacing or width may require different magnifications and devices with measurement scales or reticules as part of the inspection tool to allow accurate measurement(s) of the specified dimensions. The PCB users may also specify other magnifications and inspection tools. Note that the use of higher magnifications for visual-type attributes can produce false results due to illumination and attribute contour effects. Visual inspection criteria are difficult to define grammatically.An effective way to define visual inspection criteria is to use line illustrations and/or photographs. The IPC utilized this method in the publication IPC-A-600, Acceptability of Printed Boards, to visually standardize the many individual interpretations to specifications on printed boards. Of the different types of inspections specified, surface visual inspection is the least expensive.Visual inspection is performed on 100 percent of the PCBs or on a sampling based on an established sampling plan. Inspection for visual imperfections, following a sampling plan, is done on the premise that the PCBs were 100 percent visually screened during the fabrication process. Externally observable imperfections can be divided into 10 groups:
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Surface imperfections in the insulating material such as burrs, nicks, scratches, gouges, cut fibers, weave exposure, and voids Subsurface imperfections such as foreign inclusions, measling/crazing, delamination, pink ring, and base material voids Conductive pattern imperfections such as loss of adhesion, reduction of conductor width or thickness due to nicks, pinholes, scratches, surface plating, or coating imperfections Hole characteristics such as diameter, misregistration, foreign material inclusions, and plating or coating imperfections Marking imperfections affecting such characteristics as location, size, readability, and accuracy Solder resist surface coating, coverlayer, and coverfilm imperfections such as misregistration, blisters, bubbles, separations, adhesive squeeze out, delamination, adhesion, physical damage, and thickness Flawed dimensional characteristics affecting such characteristics as PCB size and thickness, hole size, pattern accuracy and registration, conductor width and spacing, and annular ring (dimensional inspection is usually performed using a sampling plan) An unclean PCB surface due to such materials as ionic and organic contaminates Poor Solderability of the PCB including wetting, de-wetting, and non-wetting Electrical discontinuity, circuit shorts, and if required, impedance
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51.11.1.1 Surface Imperfections in the Insulating Material. Surface imperfections include burrs, nicks, scratches, gouges, cut fibers, weave exposure, and voids. The imperfections, when minor, are normally considered to be cosmetic issues, and usually have little or no effect on functionality. However, they can be detrimental to function in the edge board contact area and if they reduce the insulating properties of the material below acceptability limits. 51.11.1.2 Subsurface Imperfections. Subsurface imperfections are those that are visible from the surface of the PCB but are below the surface of the PCB. (see Fig. 51.4) 51.11.1.2.1 Inclusion. An inclusion is a foreign particle, metallic or nonmetallic, in a conductive layer, plating, or base material. Inclusions in the conductive pattern, depending on degree and material, can affect plating adhesion or circuit resistance. Inclusions in the base material are put into the categories of translucent/nonmetallic and opaque/metallic. Translucent particles are acceptable. Opaque particles are acceptable as long as they do not reduce the minimum conductor spacing below the minimum requirement.
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