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FIGURE 51.30 Interconnection separation, vertical microsection. (Courtesy of Microtek Laboratories.)
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51.11.2.5.10 Material Fill of Blind and Buried Vias. When blind or buried vias are present in a PCB, it is important that they be microsectioned and evaluated in addition to any through holes evaluated. Buried vias are typically filled with resin, and this resin should fill a minimum of 60 percent of each buried via.
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51.12 RELIABILITY INSPECTION USING ACCELERATED ENVIRONMENTAL EXPOSURE
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Reliability inspection consists of performing specific tests to ensure that the PCB will function under the influence of the climatic and/or mechanical forces to which it will be subjected during use. Environmental tests are performed on preproduction PCBs or specifically designed test coupons to verify design adequacy and manufacturing process control. Specific tests are sometimes specified as part of the PCB acceptance procedure to expose a prospective failure situation. Specific environmental testing, as part of the acceptance procedure, is prevalent in high-reliability programs. Note that it is recommended that a simulation of the cycles required for component assembly and rework be performed as a preconditioning prior to environmental exposure. Test results then relate to the actual condition of the PCB after assembly. Specific test methods for performing these tests can be found in IPC-TM-650. 51.12.1 Thermal Shock The thermal shock test is particularly efficient in identifying (1) PCB designs with areas of high mechanical stress and (2) the resistance of the PCB to exposure of high- and lowtemperature extremes. This test is periodically required in IPC-6012 for product acceptance and is also used for PCB supplier qualification inspection. A thermal shock is induced on a PCB by exposure to severe and rapid differences in temperature. The test is usually performed by transferring the PCB from one temperature extreme (e.g., 125 C) to the other (e.g., 55 C) rapidly, usually in less than 2 min.A resistance difference in excess of 10 percent between the 1st and 100th cycles is considered nonconforming, but requirements in the thousands of cycles are sometimes specified for high-reliability PCBs. The thermal shock test can produce cracking of plating in the holes and base material de-lamination (refer to IPC-TM-650, method 2.6.7.2, for the procedure). Note that continuous electrical monitoring during thermal shock cycling will detect intermittent electrical circuits that may not be detected with periodic measurement techniques. Intermittent circuits usually occur at the high-temperature extreme.
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FIGURE 51.31 Laboratories.)
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Basic SIR test pattern. (Courtesy of Microtek
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Surface Insulation Resistance (SIR) SIR testing evaluates the electrical resistance between two surface electrical conductors separated by dielectric material. This test detects the bulk conductivity and electrical leakage through surface electrolytic contaminants when the samples are exposed to a high-humidity environment. The test conditions are a relative humidity of 85 to 92 percent at a temperature range of 35 to 45 C without the use of an electrical forcing potential. (See Fig. 51.31 for example of a SIR test pattern.)
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51.12.3 Moisture and Insulation Resistance (MIR) This is an accelerated method of testing the PCB for the deteriorative effects of condensing high humidity and heat conditions typical of tropical environments. The test conditions are a relative humidity of 90 to 98 percent at a cycling temperature range of 25 to 65 C with a forcing voltage potential of 10 to 100 VDC applied to the test circuit(s). After the required test cycles are completed, the PCB is subjected to insulation resistance testing. Test specimens should exhibit no blistering, measling, warp, or delamination after the moisture resistance test.
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51.12.4 Dielectric Withstanding Voltage This test is used to verify that the component part can operate safely at its rated voltage and withstand momentary overpotentials due to switching, surges, and similar phenomena. It also serves to determine whether insulating materials and spacings on the PCB are adequate. The test is performed on either an actual PCB or a test coupon. Voltage is applied between mutually insulated conductors on the specimen or between insulated conductors and power/ ground planes. The voltage is increased at a uniform rate until the specified value is reached. The voltage is held for 30 sec. at the specified value and then reduced at a uniform rate. Visual examination of the specimen is performed during the test for evidence of flashover or breakdown between contacts. The test can be either destructive or nondestructive, depending on the degree of overpotential used.
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