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TABLE 52.1 Dimensional Criteria for Chip Components, Rectangular or Square End Components One-, Three-, or Five-Side Terminations Feature Maximum Side Overhang End Overhang Minimum End Joint Width Minimum Side Joint Length Maximum Fillet Height Dim. A B C D E Class 1 Class 2 Class 3 25% (W) or 25% (P), whichever is lessa 75% (W) or 75% (P), whichever is lessb
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50% (W) or 50% (P) whichever is lessa Not permitted 50% (W) or 50% (P), whichever is lessb Wetting is evident The maximum fillet may overhang the land and/or extend onto the top of the end-cap metallization; however, the solder does not extend further onto the top of the component body Wetting is evident on the vertical surface(s) of the component terminationc
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Minimum Fillet Height
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(G) + 25% (H) or (G) + 0.5 mm (0.02 in.), whichever is lessc
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Solder Thickness Termination Height Minimum End Overlap Width of Land Termination Width Width to Height Ratio End Cap and Land Wetting Minimum End Overlap Maximum Side Overhang End Overhang Maximum Component Size Termination Faces
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Wetting is evident Unspecified dimension, determined by design Required Unspecified dimension, determined by design Unspecified dimension, determined by design Side mounting/billboardingd,e Does not exceed 2:1 100% wetting land to end metallization contact areas 100% Not permitted Not permitted No limits 1206 Three or more faces
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Notes: a Does not violate minimum electrical clearance. b C is measured from the narrowest side of the solder fillet. c Designs with via in pad may preclude meeting these criteria. Solder acceptance criteria should be defined by the user and the manufacturer. d These criteria are for chip components that may flip (rotate) onto the narrow edge during assembly. e These criteria may not be acceptable for certain high-frequency or high-vibration applications.
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FIGURE 52.18 Cylindrical end cap (MELF) termination. J represents the overlap between component termination and land, R is length of component termination. (IPC)
52.4.2.4 Flat Ribbon, L, and Gull-Wing Leads. Side overhang is acceptable up to one-half (one quarter for Class 3) of the width of the component lead. Lead toe overhang is acceptable for all classes provided it does not violate minimum electrical clearance. The end-joint solder width is acceptable for Class 2 with a minimum solder-joint length of one-half (three-quarters for Class 3) of the component lead width. The lead-side solder-joint minimum length is one-time the lead width for Class 1. It must be three times the width when the lead length is greater than three times its width. If the lead length is less than three times its width, the side joint width must be equal to the length. For Classes 2 and 3, the maximum solder fillet height on components such as small-outline integrated circuits (SOICs) or small-outline transistors (SOTs) may touch the package body or end seal, but not that of ceramic or metallic components. The minimum solder heel fillet height must cover one-half of the lead thickness for Class 2 and must be equal to the lead thickness for Class 3 (see Table 52.4).
ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
TABLE 52.2 Dimensional Criteria: Cylindrical End-Cap MELF Termination Feature Maximum Side Overhang End Overhang Minimum End Joint Widthb Minimum Side Joint Length Maximum Fillet Height Dim. A B C D E Class 1 Class 2
Class 3
Minimum Fillet Height (End and Side)
Solder Thickness Minimum End Overlap Land Width Termination/Plating Length Land Length Termination Diameter
G J P R S W
25% (W) or 25% (P), whichever is less Not permitted Wetting is evident 50% (W) or 50% (P), whichever is less Wetting is evidentc 50% (R) or 50% (S), 75% (R) or 75% (S), whichever is lessc whichever is lessc The maximum fillet may overhang the land or extend onto the top of the component termination; however, the solder does not extend further onto the component body Wetting is evident on the vertical (G) + 25% (W) or surface(s) of the component (G) + 1.0 mm terminationd (0.0394 in.), whichever is lessd Wetting is evident Wetting is evidentc 50% (R)c 75% (R)c Unspecified dimension, determined by design Unspecified dimension, determined by design Unspecified dimension, determined by design Unspecified dimension, determined by design
Notes: a Does not violate minimum electrical clearance. b C is measured from the narrowest side of the solder fillet. c Does not apply to components with end-only terminations. d Designs with via in pad may preclude meeting those criteria. Solder acceptance criteria should be defined by the user and the manufacturer.
TABLE 52.3 Dimensional Criteria: Castellated Terminations Feature Maximum Side Overhang End Overhang Minimum End Joint Width Minimum Side Joint Length Maximum Fillet Height Minimum Fillet Height Solder Thickness Castellation Height Land Length Castellation Width Dim. A B C D E F G H S W Class 1 Class 2 Class 3 25% (W)a 75% (W) Depth of castellation (G) + 50% (H)
50% (W)a Not permitted 50% (W) wetting is evident Depth of castellation G+H wetting is evident (G) + 25% (H)
Wetting is evident. Unspecified dimension, determined by design Unspecified dimension, determined by design Unspecified dimension, determined by design
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