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FIGURE 52.20 Adhesive visibly extended from under the component and visible in the terminal area. (IPC)
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not exceed 50 percent of the component diameter, and adhesion to the mounting surface must be evident (see Fig. 52.21). The adhesive must adhere to a vertically mounted axial component for 50 percent of the component length and 25 percent of its circumference, and adhesion to the mounting surface must be evident (see Fig. 52.22).
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FIGURE 52.21 Adhesive on horizontal and vertically mounted components. (1) Adhesive, (2) Top view, (3) 25 percent circumference.
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FIGURE 52.22 Adhesive on vertically mounted components. (1) Top view, (2) Adhesive. (IPC)
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ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
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52.5 COMPONENT AND PCB SOLDERABILITY REQUIREMENTS
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Component solderability, which includes the solderability of the PCB, is probably the most important single characteristic to consider when building PCBAs. To be successful in soldering PCBAs, good wetting must be achieved. It is an ongoing effort to ensure that all boards and electrical components purchased and received from suppliers maintain good solderability. The key to success in this all-important task is to have an excellent working relationship with the suppliers and manufacturers of the components to ensure good, solderable components. Until partnership relationships are achieved, there should be a sample of each lot or batch of components received that are subjected to solderability testing. This testing should be conducted in accordance with J-STD-002 and J-STD-003. These documents were written specifically to address solderability requirements for electronic assembly components and PCBs. The intent of the solderability testing is to qualify the surface to accept solder with less-than-optimum conditions. Additionally, artificial conditioning (aging) is used to simulate a normal aging period that the components might experience before use. Identification of weaker components can reduce the possibility of a solderability problem or production issues later on in the production cycle. Based on this lack of lead solderability, the components should be rejected and returned to the supplier, before they can be placed in the assembly process. Packaging and handling of components are also important to maintain good solderability since many contaminants that could affect solderability can be transferred to solderable surfaces as a result of handling by equipment or personnel or the storage environment. Storage contamination may result from airborne contaminants, moisture, temperature, and also time. As tin-lead or lead-free component lead finishes age, they can oxidize, and this oxidation will affect solderability of the component. A rule of thumb used by many companies is to suspect the solderability of components two or more years old. In some cases, this age can be tracked easily for components marked with a date code. Other components too small to mark or that for some other reason are not marked with a date code cannot be traced as easily. Often companies keep records on the date of receipt and base the age of the component on this date. Although these records may not be completely accurate, they still serve the purpose. If components are known to be over two years old, a new solderability sample may be pulled to determine whether the components are still usable before production. Often they are not usable due to oxidation, intermetalic growth, or some other contaminant that the component has been exposed to over time.
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52.6 SOLDER-RELATED DEFECTS
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All solder joints should exhibit wetting as shown by a concave meniscus between the component and PCB being soldered. The outline of the component being soldered should be easily determined. The most common solder defects produced by the soldering process are discussed in the following sections.
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PTH Solder-Joint Minimum Acceptable Conditions Table 52.6 shows the minimum acceptable PTH solder-joint criteria. Fig. 52.23 shows the basic elements of solder fill for all classes.
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