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For solder cup terminations, the wire should be fully inserted to the bottom of the cup and solder fill must be greater than 75 percent of the milled edge.
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52.7 PCBA LAMINATE CONDITION, CLEANLINESS, AND MARKING REQUIREMENTS
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52.7.1 Laminate Conditions Laminate defect conditions may be caused by the laminator, PCB fabricator, or assembly of the PCB. The major laminate conditions seen are measling, crazing, blistering, delamination, weave exposure, and haloing. 52.7.1.1 Measling and Crazing. Measling is an internal condition occurring in laminated base material in which the glass fibers are separated from the resin at the weave intersections. This condition manifests itself in the form of white spots or crosses below the surface of the base material and is usually related to thermally induced stress. Crazing is an internal condition occurring in laminated base material in which the glass fibers are separated from the resin at the weave intersections. This condition manifests itself in the form of connected white spots or crosses below the surface of the base material and is usually related to mechanically induced stress (see Fig. 52.34).
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FIGURE 52.34 Crazing in base laminate. Crazing exceeds 50 percent of the physical space between internal conductors. (IPC)
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Measling or crazing that occurs as a result of an inherent weakness in the laminate is a warning of a potentially more serious problem. If measling or crazing occurs in the assembly process, it usually will not propagate further. Measling is considered a defect for Classes 2 and 3 if the measle condition extends more than 50 percent of the span between internal conductors. The concern is in regard to the ability of the laminate to maintain dielectric integrity after exposure to high humidity and active chemistries and environments. By the time that a PCB enters an assembly process, the operator who observes measling or crazing cannot determine the source of the problem. This fact places even more importance
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ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
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on getting high-quality PCBs from suppliers. This can be done through increased receiving inspection, source inspections, or a comprehensive qualification program and partnership with suppliers. In such a program, process control is exercised in the PCB fabrication, and parametric data from the supplier are sent to the buyer to review for compliance with requirements. This kind of information can also be used to justify a dock-to-stock program if desired. 52.7.1.2 Blistering and Delamination. Blistering is a localized swelling and separation between any of the layers of the base material or between the material and the metal cladding. Delamination is a separation between any of the layers of the base material or between the base material and the metal cladding. In contrast to measles that do not propagate, blisters and delamination conditions can increase in size with use. Blistering and delamination cannot exceed 25 percent of the distance between PTHs or subsurface conductors (see Fig. 52.35).
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FIGURE 52.35 Example of blister in base material. (IPC)
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52.7.1.3 Weave Exposure. Weave exposure is a surface condition of base material in which the unbroken fibers of woven glass cloth are not completely covered by resin. Weave exposure is acceptable if it does not reduce dielectric spacing below the minimum electrical clearance. 52.7.1.4 Haloing and Edge Delamination. Haloing occurs on or below the surface of the base material, appearing as a light area around holes or other machined areas.This condition is acceptable if the penetration of the haloing or edge delamination does not reduce edge spacing more than 50 percent of that specified in the drawing or other documentation or 2.5 mm maximum.
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PCBA Cleanliness Board cleanliness is needed to ensure sufficient removal of contaminants that could affect functionality at present or in the future. Some contaminants can actually promote growth of undesirable substances on the PCBA that can cause shorting or corrosion that would affect the PCBA s electrical functional integrity and dielectric properties over a period of time. These contaminants can be in the form of surface dendrites, internal conductive anodic filaments, and so on.
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