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No visible residue from cleanable or any activated fluxes is allowed. Production operations may not be required to remove cleanable residues if qualification testing is performed that demonstrates no need for cleaning the assembly. No-clean or low-residue flux chemistries may be allowed during the soldering process. However, it is critical that the cleanliness of the elements such as the bare boards and components be specified, controlled, and closely monitored; otherwise, the contaminant build-up can far exceed allowable limits for the end item s functional performance. For processes utilizing potentially corrosive rosin based fluxes, simple test options to determine cleanliness such as resistance of solvent extract (ROSE) tests can be used. Other more significant tests may be required to determine the residue properties of organic residue fluxes, such as those commonly used during hot air solder leveling (HASL) of boards. The most common of these are ion chromatography tests that can characterize the residuals and their potential hazards to the product. In the event of test failure, immediate process corrections for the cleaning process or elimination of the source of residues must be accomplished before any additional product is assembled. Particulate matter such as dirt, lint, dross, lead clippings, and such is not acceptable on PCBAs. Metallic areas or hardware on the PCBAs may not exhibit any crystalline white deposits, colored residues, or rusty appearance.
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PCBA Marking Acceptability Marking provides both product identification and traceability. It aids in assembly, in-process control, and field repairs. The methods and materials used in marking must serve the intended purposes and must be readable, durable, and compatible with the manufacturing processes as well as the end use of the product. Fabrication and assembly engineering drawings should be the controlling documents for the locations and types of markings on PCBAs. Marking on components and fabricated parts should withstand all tests, cleaning, and assembly processes to which the item is subjected and must remain legible. Acceptability of marking is based on whether it is legible. If a marking is legible and cannot be confused with another letter or number, it is acceptable. Components and fabricated parts do not have to be installed so that reference designators are visible after installation. Missing, incomplete, or illegible characters in markings are unacceptable.
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52.8 PCBA COATINGS
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It should be noted that not all PCBA designs use conformal coating; however, when used, conformal coating must meet the following acceptability criteria. All PCBAs that utilize top- or bottom-layer etch (trace) runs have a solder mask over them if a solder wave or static solder bath process is used to solder components onto the PCB. Without the solder mask, the solder would bridge between many solder wettable surfaces, causing short circuits.
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Conformal Coating Conformal coating is an insulating protective covering that conforms to the configuration of the objects coated when it is applied to a completed PCBA. The purpose of conformal coating is to provide a temporary barrier to environmental exposure of chemicals, humidity, and condensation. It is also a barrier from surface contact of contaminants caused by handling, and can provide physical support for components from shock and vibration. It is not, however, a hermetic seal and is eventually permeable. To be most effective, conformal coatings should
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ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
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be homogeneous and transparent. Most coatings will contain an ultraviolet (UV) tracer to make inspection easier through the use of a black light. The conformal coating should be properly cured and not exhibit tackiness. Defects associated with conformal coating are as follows:
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Applied where not required Not applied where required Bridging of conductors due to: Mealing (adhesion) Voids Dewetting Cracks Ripples Orange peel/fisheye Inclusions Discoloration Incompletely cured Wicking into connectors or mating surfaces
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Conformal coating thickness requirements for five types of coatings are listed in Table 52.7. The thickness is commonly measured on a coupon that has been processed with the assembly.
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TABLE 52.7 Coating Thickness Type AR ER UR SR XY Material Acrylic Resin Epoxy Resin Urethane Resin Silicone Resin Paraxylyene Resin Thickness 0.03 0.13 mm (0.00118-0.00512 in.) 0.03 0.13 mm (0.00118-0.00512 in.) 0.03 0.13 mm (0.00118-0.00512 in.) 0.05 0.21 mm (0.00197-0.00827 in.) 0.01 0.05 mm (0.00039-0.00197 in.)
Solder Resist Solder resist or solder mask is a heat-resistant film coating used to provide mechanical shielding during soldering operations. Solder resist material may be applied as a liquid or a dry film. Solder resist would be ineffective and considered a defect when there are blisters, scratches, or voids that bridge noncommon circuits, or if the exposure has the potential to allow solder bridges. It could be considered a process indication if blisters or flaking expose bare copper.
SOLDERLESS WRAPPING OF WIRE TO POSTS (WIRE WRAP)
Many applications of wire wrap are still utilized in equipment design, and standards of acceptance should be consistent. Standards of acceptance in this area are shown in IPC-A-610 and in other standards.
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