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joints are also possible and provide greater insight into process parameters. For instance, the variation of heel fillet heights and void volume across an assembly provides insight into the oven temperature profile and spatial distribution. The variation of average solder thickness provides insight into squeegee speed and pressure and stencil cleanliness. And the pin-to-pad offsets measure the component placement accuracy.
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Types of Inspection Systems Inspection systems normally are dedicated to one type of measurement capability: solder paste, pre-reflow, or post-reflow inspection. For example, systems for solder paste measurements do not normally also make component placement measurements. The cost of combining different measurement capabilities into one system would typically make that system prohibitively expensive. More importantly, to reduce manufacturing costs, manufacturers want to implement linear, sequential production lines where an assembly always flows in one direction and goes through each machine only once per assembly side. So automated inspection systems fall into three major categories:
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Those that make three-dimensional solder paste measurements Those that make quantitative pre-reflow two-dimensional solder paste and/or component placement measurements Those that make post-reflow solder joint measurements and attribute component measurements
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For all three types, the automated inspection system compares the measurements taken against a specified conformance range to accept or reject automatically a solder paste brick, component placement, or solder joint as being within specification.
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53.8 THREE-DIMENSIONAL AUTOMATED SOLDER PASTE INSPECTION
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53.8.1 Operating Principles Automated inspection systems designed for 3-D solder paste measurements use structured light sources and cameras or digital light-emitting diode (LED) sensors to generate threedimensional images of solder paste depositions. The structured light is normally some variation of a sheet of light or a laser line or spot. As Fig. 53.9 shows, the structured light sweeps across a solder paste brick, creating discontinuities and other features in the image that are calibrated to actual physical dimensions, such as height and area. In essence, the proportional nature of the deflection and height is turned into usable measurement results. 53.8.1.1 View Magnification. To achieve adequate accuracy, only a small portion of the assembly, called a view, is imaged at a single time. Magnification increases and digital quantization error decreases as the size of the view decreases. Views normally vary in size from 10 to 25 mm in diameter. So the automated inspection system may use more than 100 views to cover a typical assembly. The system moves the assembly or the image sensor on a positioning stage from view to view.The sum of move time plus image acquisition time normally makes up most of the total inspection time for a particular assembly. 53.8.1.2 System Throughput. The test speed for solder paste inspection systems varies anywhere from 2 to 22 cm2/sec. The high end of this speed range can be fast enough to keep
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Solder paste dimensional measurements
FIGURE 53.9 Schematic of automated inspection system for solder paste measurement. The camera or LED sensor obtains images with discontinuities in the laser line scan; the image-processing software finds these discontinuities, measures them, and calibrates them to real physical dimensions.
up with many automated printed circuit production lines. But for the slower systems, or even for the fastest systems on very-high-volume production lines, manufacturers inspect a specific subset of paste depositions on every assembly coming down the production line.
Applications Automated solder paste inspection systems typically reside in the fastest speed ranges on the system throughput scale and therefore are utilized as process control tools in addition to defect detectors. Manufacturers typically use these systems to monitor the process by tracking the key quantitative solder paste measurements, normally height and volume, against control limits. The systems then alarm any condition where control limits are exceeded or definite drifts are detected, allowing the manufacturer to assess the production line and monitor or choose to take action until appropriate adjustments have been made. (The alarm generated by the system is normally an obvious flashing message on a computer monitor.) Because the paste printing process step causes a large percentage of all production defects, tight production control of this process step using quantitative measurements can significantly lower the process defect rate. In fact, automated solder paste inspection systems have been linked through software to paste printing systems, allowing not only process control, but also closed-loop feedback for semiautomatic adjustment of paste printing parameters based on the paste measurements.
Advantages and Disadvantages Automated 3-D inspection of solder paste depositions has the following major advantages:
Real-time process control of paste printing to lower defect rates and rework costs Quantitative measurements, including volume, to help permanently eliminate the causes of paste defects
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