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POST-REFLOW AUTOMATED INSPECTION
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Solder joints have much more complex shapes than do solder paste depositions and components, so taking measurements of solder joints normally requires more complex imaging techniques than does measuring solder paste and components. Automated inspection systems for solder joints have used a variety of imaging technologies, including optical and x-ray imaging, thermography, cooling profiles of laser-heated solder joints, and ultrasonic imaging. But three technologies have dominated in these systems:
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Optical imaging using multiple light sources and cameras Transmission x-ray imaging Cross-sectional x-ray imaging
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Post-Reflow AOI Systems 53.10.1.1 Operating Principles. Post-reflow AOI systems for solder joints are similar to, but more complex than, those for component placement. (Note that these systems also detect component defects such as missing, misaligned, or misoriented components, but their complex design is required for solder joint inspection.) Multicolor, multi-angled light sources are normally required to provide enough information in the images to allow sophisticated image-processing algorithms to detect the required features in the images accurately. If the light source is not multicolored or multi-angled, then many different cameras are usually used instead, each camera mounted at a different angle relative to the board being inspected. The multiple light sources and cameras create and detect shadows from various angles to detect features of solder joints of all types oriented in different directions on the printed circuit assembly. These optical systems often use higher magnification, particularly for the smallest passive components and fine-pitch components, and therefore capture a smaller portion of the assembly at any one time. The smaller views allow more image pixels per solder joint feature, allowing more accurate image processing and corresponding defect calls. The use of smaller views renders the throughput of these systems slower than that of component placement inspection systems. However, in general these systems are faster than 3-D solder paste measurement systems. Their throughput typically falls in the range of 10 to 40 cm2/sec. The systems image-processing software uses sophisticated algorithms to extract specific features of solder joints, such as edges and areas of the solder joint in a specific range of angles relative to the board. Analysis of these extracted features then determines whether a defect exists or not. Defects detected include absence of solder, bridges, and grossly insufficient or excessive solder. These systems typically do not make quantitative measurements. 53.10.1.2 Application. These post-reflow AOI systems generate only attribute data. For instance, these systems detect the existence of a solder bridge between two joints or the absence or presence of a toe fillet on solder joints. But they do not measure the height of the heel fillet or the amount of solder in the solder joint. These systems typically do not measure how far a component is misaligned from its proper placement, but instead simply determine whether or not the component is misaligned more than a predetermined amount. These attribute data are not as useful for process control, and thus manufacturers use these systems strictly to detect defects. Normally these systems do, however, warn of a condition where the same defect has occurred several times consecutively or within a specific number of assemblies, indicating that some part of the process needs adjustment. Post-reflow AOI systems cannot inspect hidden solder joints, such as those for ball grid arrays, pin grid arrays, and in some cases J-leaded devices, and can have high false accept or reject rates for some component types, such as fine-pitch components at or below 0.5 mm pitch or small outline transistor (SOT) devices. If tall components are placed on the board very close to smaller components, post-reflow AOI systems can also have difficulty inspecting these smaller components. 53.10.1.3 Advantages and Disadvantages. the following advantages:
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