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It is quite important for the tester to do a good job of resolving faults into defects. Using an example of solder opens on digital devices, digital in-circuit test (detailed in Sec. 55.5.2) alone may indict devices as failing when it is really more of an open solder problem. The repair technician may notice this. However, it may well be overlooked because replacing the device fixes the problem. This pollutes the information about our process, causing one to call the IC vendor with complaints when one should be examining the solder process. If tests are focused more closely on defects than on faults, then one may be able to better trust tester-derived process information. This requires test engineers to be students of their manufacturing process and available test technologies so that test techniques are kept in balance with the defects that are most important.
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Testing is a word often used in a vacuum.What are tests actually looking for The answer to this question has a huge impact on how to go about testing effectively. It makes little sense to test meticulously for problems with low likelihood of occurring, just as it makes little sense to inadequately test for likely problems. However, many of the terms used in the testing industry are overloaded such that surprisingly little agreement on their definitions may be found. Worse, this confusion is often not realized, which complicates communications between process people, test people, and equipment vendors.
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Defects, Faults, and Tests 55.3.1.1 Defects. A defect is an unacceptable deviation from a norm. As an example, a bond wire could be missing in an IC. This defect may in turn be due to a problem (the root cause ) in a wire-bonding machine, such as it misfeeding wire. Other deviations may not be considered defects, but rather acceptable variations. For example, the plastic used to encapsulate a component may have significant variations in color that are still considered acceptable. Defects require remedial action of some sort. Most often, defects lead to a repair operation that removes the defect and restores the product to acceptable status. In some cases, a defect may not be economically repairable and thus causes scrap. It is also possible that a defect will be overlooked and thus be delivered within a product to an end customer. In some cases, such as the manufacture of $2 wristwatches, some amount of defective product may be deemed acceptable. However, for many products, defects perceived by end customers can have grave economic consequences and are strenuously avoided. 55.3.1.2 Faults. A fault is a physical manifestation of a defect. (The word fault is often used synonymously with failure.) Thus a fault reveals the presence of a defect. A single defect may cause several faults (i.e., have several different manifestations), and a single fault could be the manifestation of several different defects. A defect shows up as a fault. For example, the aforementioned missing bond wire on an input to a logic gate may cause it to see a permanent logic 1 rather than a time-varying signal. Several other defects can produce this same fault behavior. For example, missing solder between the input pin and the board, an electrostatically damaged input buffer within the IC, or a broken printed circuit trace between the upstream driver and the input will all exhibit the same faulty behavior. Similarly, one defect may cause several fault manifestations. For example, an open solder joint on an input pin (particularly a reset input) may cause an IC to show incorrect results, and these incorrect results vary in time. An observed fault is not always a reliable pointer to a defect. For example, if an IC loaded onto a board has defective solder on one input pin causing an open circuit, this may appear to the IC to be a permanent, stuck-at-1 fault on that input. This faulty behavior may not be readily
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