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1. Boddy, P. J., et al., Accelerated Life Testing of Flexible Printed Circuits: Part I: Test Program and Typical Results, IEEE Reliability Physics Symposium Proceedings, Vol. 14, 1976, pp. 108 113. 2. Delaney, R. H., and Lahti, J. N., Accelerated Life Testing of Flexible Printed Circuits: Part II Failure Modes in Flexible Printed Circuits Coated with UV-Cured Resins, IEEE Reliability Physics Symposium Proceedings, Vol. 14, 1976, pp. 114 117. 1976 IEEE. Reprinted with permission. 3. Der Marderosian, A., Raw Material Evaluation through Moisture Resistance Testing, paper presented at in IPC 1976 Fall Meeting, San Francisco, IPC-TP-125. 4. Lando, D. J., Mitchell, J. P., and Welsher, T. L., Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention, IEEE Reliability Physics Symposium Proceedings, Vol. 17, 1979, p. 51 63. 5. Welsher, T. L., Mitchell, J. P., and Lando, D. J., CAF in Composite Printed Circuit Substrates: Characterization, Modeling and a Resistant Material, IEEE Reliability Physics Symposium Proceedings, Vol. 18, 1980, pp. 235 237. 6. Ready, W. J., and Turbini, L. J., The Effect of Flux Chemistry, Applied Voltage, Conductor Spacing, and Temperature on Conductive Anodic Filament Formation, Journal of Electronic Materials, Vol. 31, No. 11, 2002, pp. 1208 1224. 7. Linde, D. R. (ed.), Handbook of Chemistry and Physics, 80th ed., CRC Press, 1999. 8. Rudra, B., Pecht, M., and Jennings, D., Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates, IEEE Transactions on Components, Packaging and Manufacturing Techniques Part B, Vol. 17, No. 3, 1994, pp. 269 276. 9. Ready, W. J., Factors Which Enhance Conductive Anodic Filament (CAF) Formation, Master Thesis in Materials Science and Engineering, Georgia Institute of Technology, 1997. 10. Lahti, J. N., Delaney, R. N., and Hines, J. N., The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging, IEEE Reliability Physics Symposium, Proceedings, Vol. 17, 1979, p. 39. 11. Turbini, L. J., Bent, W. R., and Ready, W. J., Impact of Higher Melting Lead-Free Solders on Reliability of Printed Wiring Assemblies, Journal of Surface Mount Technology, Vol. 13, No. 4, 2000, pp. 10 14. 12. Zado, F. M., Effects of Non-Ionic Water Soluble Flux Residues, Western Electric Engineer, No. 1, 1983, pp. 41 48. 13. Brous, J., Electrochemical Migration and Flux Residues: Causes and Detection, Proceedings of NEPCON West 1992, pp. 386 393. 14. Brous, J., Water Soluble Flux and Its Effect on PC Board Insulation Resistance, Electronic Packaging and Production, Vol. 21, No. 7, 1981, p. 80. 15. Jachim, J. A., Freeman, G. B., Turbini, L. J., Use of Surface Insulation Resistance and Contact Angle Measurements to Characterize the Interactions of Three Water Soluble Fluxes with FR-4 Substrates, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 20, No. 4, 1997, pp. 443 451. 16. Ready, W. J., Turbini, L. J., Stock, S. R., and Smith, B. A., Conductive Anodic Filament Enhancement in the Presence of a Polyglycol-Containing Flux, IEEE International Reliability Physics Symposium Proceedings, Dallas, 1996, pp. 267 272. 17. Augis, J. A., DeNure, D. G., LuValle, M. J., Mitchell, J. P., Pinnel, M. R., and Welsher, T. L., A Humidity Threshold for Conductive Anodic Filaments in Epoxy Glass Printed Wiring Board, Proceedings of 3rd International SAMPE Electronics Conference, 1989, pp. 1023 1030. 18. Sauter, K., Electrochemical Migration Testing Results: Evaluating PWB Design, Manufacturing Process, and Laminate Material Impacts on CAF Resistance, Proceedings IPC Printed Circuits Expo 2002, Long Beach, CA, 2002, EX02-S08-4. 19. IPC-TM-2.6.25 (IPC Test Method), Conductive Anodic Filament (CAF) Resistance. 20. Parry, G., Cooke, P., Caputo, A., and Turbini, L. J. The Effect of Manufacturing Parameters on Board Design on CAF Evaluation, Proceedings of the International Conference on Lead-free Soldering, Toronto, 2005.
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