barcode scanner input asp.net PRINTED CIRCUITS HANDBOOK in Software

Make Quick Response Code in Software PRINTED CIRCUITS HANDBOOK

PRINTED CIRCUITS HANDBOOK
QR Code Decoder In None
Using Barcode Control SDK for Software Control to generate, create, read, scan barcode image in Software applications.
Print QR Code 2d Barcode In None
Using Barcode maker for Software Control to generate, create Denso QR Bar Code image in Software applications.
of Cu can dissolve from the knee of the PTH. Nickel barrier plating minimizes this effect because Ni dissolves far more slowly in eutectic Sn-Pb solder than Cu does. Use of Au plating can embrittle the eutectic Sn-Pb solder most commonly used in electronic assembly. Gold plating of various thicknesses is used for a variety of reasons, including as a solderability preservative over nickel plating, for connector contacts, and to provide wirebondable pads. Reliability problems can arise because Au has a high solubility in eutectic SnPb solders at reflow temperatures and dissolves extremely rapidly. In most cases, the Au finish on a PCB or component termination will be completely dissolved into the solder. In a wavesoldering process, the Au will be washed into the bath, requiring monitoring and bath changes to maintain the Au concentration at a low level that does not affect the process. However, in a reflow process, this Au remains in the finished solder joint. To avoid embrittlement of the solder by the AuSn4 and AuSn2 intermetallics that can form, the Au concentration should be kept below a critical level that most authors set at 3 to 5 percent by weight.35,36 For most components used today, a nominal 5- in (0.1-mm) thickness Au flash to preserve solderability is harmless. However, if thicker Au plating (e.g., for connector contacts or wire bonding) is used, if the component lead pitch is less than 0.5 mm, or if the component lead terminations are also Au-plated, care should be taken to ensure that the Au concentration remains below the 3 to 5 percent by weight limit. For some applications in which use of thick Au is unavoidable, 50In-50Pb solder, in which Au dissolves very slowly, has been used to get around this problem.37 Selective thick Au plating is another option. The Au concentration in the finished reflowed solder joint can be estimated using the following equation: Wt. % Au = (Au volume) [(Au volume) + (solder volume)(rsolder/Au)]
QR Code ISO/IEC18004 Recognizer In None
Using Barcode decoder for Software Control to read, scan read, scan image in Software applications.
Quick Response Code Creator In Visual C#.NET
Using Barcode encoder for .NET framework Control to generate, create QR image in VS .NET applications.
where solder/Au is the ratio of the density of the solder to the density of Au (0.4552 for 63Sn37Pb solder). If the Au is less than 1 m thick, it is usually valid to assume that all of the Au on the joined surfaces has dissolved into the joint. The solder volume should include any solder plated on either the component or board termination as well as that applied by stencil printing. It is common to specify only a minimum Au plating thickness; it is important to use a representative value to calculate the expected Au content in the solder joint.
Drawing QR Code In .NET
Using Barcode encoder for ASP.NET Control to generate, create QR Code ISO/IEC18004 image in ASP.NET applications.
Painting QR In .NET Framework
Using Barcode encoder for VS .NET Control to generate, create QR-Code image in VS .NET applications.
Interconnect Material 57.5.2.1 Eutectic Sn-Pb Solder. Eutectic Sn-Pb solder, 63Sn-37Pb, and near-eutectic SnPb solders, including 60Sn-40Pb and 62Sn-36Pb-2Ag, are used in the overwhelming majority of soldered electronic assemblies. From a reliability perspective, the most important characteristics of these solders are their susceptibility to creep and fatigue because ambient temperatures are so close to the metal temperature of the solder, their ability to dissolve common termination metals rapidly and in large amounts, and their tendency to form thick intermetallic layers with termination metals. Although solder joint thermal fatigue is a major source of PCA field failures, the industry has used the same solder alloy for several decades. At present, there is no generally agreed-on alternative to eutectic Sn-Pb solder that has improved fatigue resistance as well as the favorable processing characteristics of eutectic Sn-Pb solder. However, there has been a tremendous surge in research into alternative solders, especially Pb-free solders, in the last decade and one can expect improved alloys in the future. There is some evidence that solders containing 2 percent Ag have improved properties in thermal cycling to high temperatures. Many common termination metals dissolve rapidly in eutectic Sn-Pb solder, including Ag, Au, and Cu.36 The dissolved metals can alter the properties of the solder. Reliability can also be impacted if the termination metal is dissolved entirely, the most notable case being Ag (or AgPd with less than 33 percent Pd) terminations on ceramic resistors and capacitors. If the entire
Encode QR-Code In Visual Basic .NET
Using Barcode creator for .NET Control to generate, create Quick Response Code image in .NET framework applications.
Code 128 Code Set A Printer In None
Using Barcode encoder for Software Control to generate, create Code 128 Code Set B image in Software applications.
Generating EAN128 In None
Using Barcode creation for Software Control to generate, create GS1-128 image in Software applications.
Making Barcode In None
Using Barcode generator for Software Control to generate, create bar code image in Software applications.
UPC-A Supplement 2 Encoder In None
Using Barcode creation for Software Control to generate, create UPC Code image in Software applications.
Barcode Maker In None
Using Barcode drawer for Software Control to generate, create barcode image in Software applications.
Generate Leitcode In None
Using Barcode printer for Software Control to generate, create Leitcode image in Software applications.
UCC-128 Encoder In None
Using Barcode drawer for Excel Control to generate, create GS1 128 image in Microsoft Excel applications.
Create Matrix Barcode In VB.NET
Using Barcode maker for .NET Control to generate, create 2D Barcode image in .NET framework applications.
Data Matrix Maker In Objective-C
Using Barcode creator for iPhone Control to generate, create Data Matrix image in iPhone applications.
Print Barcode In Visual Basic .NET
Using Barcode printer for VS .NET Control to generate, create barcode image in .NET framework applications.
Create GS1 - 13 In VS .NET
Using Barcode maker for .NET framework Control to generate, create EAN-13 Supplement 5 image in .NET framework applications.
Code 39 Creator In Java
Using Barcode maker for Java Control to generate, create Code39 image in Java applications.
Code-128 Drawer In Java
Using Barcode generator for Java Control to generate, create Code-128 image in Java applications.
Copyright © OnBarcode.com . All rights reserved.