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TABLE 7.9 Tensile and Elongation Properties of Grade 3 Copper Foil Property Tensile strength @ 23 C: kpsi MPa Elongation % @ 23 C Tensile strength @ 180 C: kpsi MPa Elongation % @ 180 C
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TABLE 7.10 Foil Profile Criteria Max. Foil Profile (Microns) N/A 10.2 5.1 N/A Max. Foil Profile (m Inches) N/A 400 200 N/A
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Foil Profile Type S Standard L Low profile V Very low profile X No treatment or roughness
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form trapezoidal circuit traces increases since there is more time for lateral etching of the conductor. This has obvious implications for manufacturing fine-line circuits in high-yield and controlling impedance properties. Low-profile and very-low-profile characteristics are included in the IPC-4562 specification and are summarized in Table 7.10. Figures 7.23 and 7.24 give an example of profile differences between a standard and low-profile copper foil. In addition, as circuit operating frequencies increase, roughness of the copper foil can also impact signal attenuation. At higher frequencies, more of the electrical signal is conducted near the surface of the conductor. A rougher profile results in a longer path for the signal to travel, which also results in greater attenuation, or loss. As a result, high-performance materials require foils with low profiles that have adequate adhesion to the high-performance resin systems. Subsequent to the manufacturing of the base copper foil, a variety of surface treatments are typically applied, and these too will vary depending on the usage environments. These treatments fall into four categories.
FIGURE 7.23 Cross section and the matte side of standard Grade 1 foil. (Courtesy of Gould Electronics)
PRINTED CIRCUITS HANDBOOK
FIGURE 7.24 Cross section and the matte side of low-profile Grade 1 foil. (Courtesy of Gould Electronics)
7.6.1.1 Bonding Treatments or Nodularization. This treatment increases the surface area of the foil by plating copper or copper-oxide nodules to the surface of the foil. The increased surface area results in increased foil to resin bond strengths. The thickness of this treatment is relatively small, but can be tailored for adhesion to high-performance resin systems such as polyimides, cyanate esters, and BT. The matte side images in Figs. 7.23 and 7.24 include these nodules. 7.6.1.2 Thermal Barriers. A coating of zinc, nickel, or brass is usually applied over the nodules. This coating can prevent thermal or chemical degradation of the foil to resin bond during manufacture of the laminate, the printed circuit, and the circuit assembly. These coatings typically measure several hundred angstroms in thickness and vary in color due to the specific metal-alloy used, although most treatments are brown, gray, or a yellow mustard color. 7.6.1.3 Passivation and Antioxidant Coatings. In contrast to the other coatings, these treatments are virtually always applied to both sides of the foil. Although many of these treatments are chromium-based, organic coatings can also be utilized. The primary purpose of these treatments is to prevent oxidation of the copper foil during storage and lamination. These coatings are usually less than 100 angstroms thick and are typically removed by the cleaning, etching, or scrubbing processes normally used at the start of printed circuit manufacturing processes. 7.6.1.4 Coupling Agents. The use of coupling agents, primarily silanes such as those used to promote fiberglass to resin adhesion, can also be used on copper foils. These coupling agents can improve the chemical bond between the foil and the resin system and can also be used to help prevent oxidation or contamination.
Drum Side Treated Foils (DSTF) or Reverse Treated Foils (RTF) Drum side treated (DSTFoil ) or reverse treated foil (RTF) is also an electrodeposited copper foil, but the treatments are coated onto the smooth drum side of the foil rather than the matte side, as with conventional electrodeposited foil (see Figs. 7.25 and 7.26). This results in a verylow-profile surface bonded to the laminate, with the rough matte side facing out. The low
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