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27. G. T. Paul, Cracked Innerlayer Foil in High Density Multilayer Printed Wiring Boards, Proceedings of Printed Circuit Fabrication West Coast Technical Seminar, San Jose, Aug. 29 31, 1983. 28. M. W. Gray, Inner Layer or Post Cracking on Multilayer Printed Circuit Boards, Circuit World, vol. 15, no. 2, pp. 22 29, 1989. 29. L. Mayer and S. Barbieri, Characteristics of Acid Copper Sulfate Deposits for Printed Wiring Board Applications, Plating and Surface Finishing, March 1981, pp. 46 49. 30. J. L. Marshall, L. A. Foster, and J. A. Sees, Interfaces and Intermetallics, in The Mechanics of Solder Alloy Interconnects, D. R. Frear, H. Morgan, S. Burchett, and J. Lau (eds.), op. cit., pp. 42 86. 31. M. Economou, Rework System Selection, SMT, February 1994, pp. 60 66. 32. J. Lau, S. Leung, R. Subrahmanyan, D. Rice, S. Erasmus, and C. Y. Li, Effects of Rework on the Reliability of Pin Grid Array Interconnects, Circuit World, vol. 17, no. 4, pp. 5 10, 1991. 33. F. L. Gray, Thermal Expansion Properties, in ASM Electronic Materials Handbook, Vol. 1: Packaging, op. cit. 34. P. M. Hall, Thermal Expansivity and Thermal Stress in Multilayered Structures, in Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau (ed), op. cit., pp. 78 94. 35. J. Glazer, P. A. Kramer, and J. W. Morris, Jr., The Effect of Gold on the Reliability of Fine Pitch Surface Mount Solder Joints, Circuit World, vol. 18, 1992, pp. 41 46. 36. G. Humpston and D. M. Jacobson, Principles of Soldering and Brazing, ASM International, Materials Park, Ohio, 1993, Chap. 3. 37. F. G. Yost, Soldering to Gold Films, Gold Bulletin, vol. 10, 1977, pp. 94 100. 38. J. Glazer, Metallurgy of Low Temperature Lead-free Solders: A Literature Review, International Materials Review, vol. 40, 1995, pp. 65 93. 39. H. L. Hvims, Adhesives as Solder Replacement for SMT, vols. I and II, Danish Electronics, Light and Acoutics, Hoersholm, Denmark, January 1994. 40. A. Emerick, J. Ellerson, J. McCreary, R. Noreika, C. Woychik, and P. Viswanadham, Enhancement of TSOP Solder Joint Reliability Using Encapsulation, Proceedings of the 43d Electronic Components and Technology Conference, IEEE-CHMT, 1993, pp. 187 192. 41. P. Tobias and D. Trindade, Applied Reliability, Van Nostrand Reinhold, New York, 1986. 42. ASTM D 257-78, Standard Test Methods for DC Resistance or Conductance of Insulating Materials. 43. Military specification for Printed Wiring Boards. 44. Military standard test method for Electronic and Electrical Component Parts. 45. P. J. Boddy, R. H. Delaney, J. N. Lahti, E. F. Landry, and R. C. Restrick, Accelerated Life Testing of Flexible Printed Circuits: Part I and II, 14th Annual Proceedings of the IEEE Reliability Physics Symposium, Las Vegas, Nev., April 20 22, 1976. 46. K.-L. B. Wun, M. Ostrander, and J. Baker, How Clean is Clean in PCA, Proceedings of Surface Mount International, San Jose, Calif., 1991, pp. 408 418. 47. K. C. Norris and A. H. Landzberg, IBM Journal of Research and Development, vol. 13, 1969, p. 266. 48. For example, see J. H. Lau, Surface Mount Solder Joints Under Thermal, Mechanical, and Vibration Conditions, in The Mechanics of Solder Alloy Interconnects, D. R. Frear, H. Morgan, S. Burchett, and J. Lau (eds.), op. cit., pp. 361 415. 49. E. B. Hakim, Acceleration Factors for Plastic Encapsulated Semiconductors, Solid State Technology, Dec. 1991, pp. 108 109.
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ASM Electronic Materials Handbook, Vol. 1: Packaging, ASM International, Materials Park, Ohio, 1989. Frear, D. R., H. Morgan, S. Burchett, and J. Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1994. IPC-A-600D, Acceptability of Printed Boards, August 1989.
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IPC-A-610A, Acceptability of Electronic Assemblies, Feb. 1990. IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies, to be issued. IPC-SM-785, Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments, Nov. 1992. de Kluizenaar, E. E., Reliability of Soldered Joints: A Description of the State of the Art, Soldering and Surface Mount Technology, Part I: no. 4, pp. 27 38; Part II: no. 5, pp. 56 66; Part III: no. 6, pp. 18 27, 1990. Lau, J. H. (ed.), Solder Joint Reliability, Van Nostrand Reinhold, New York, 1991. Lau, J. H. (ed.), Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, 1993. Lea, C., A Scientific Guide to Surface Mount Technology, Electrochemical Publications, Ayr, Scotland, 1988. Tummala, R. and E. J. Rymaszewski (ed.), Microelectronic Packaging Handbook, Van Nostrand Reinhold, New York, 1989.
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