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29. Bieler, T. R., Jiang, H., Lehman, L. P., Kirkpatrick, T., Cotts, E. J., Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints, Electronic Components and Technology Conference, 2006, pp. 1462 1467. 30. Darveaux, Robert, Shear Deformation of Lead Free Solder Joints, Electronic Components and Technology Conference, 2005, pp. 882 893. 31. Hua, Fay, Aspandiar, Raiyo, Rothman, Tim, Anderson, Cameron, Clemons, Greg, and Klier, Mimi, Solder Joint Reliability of Sn-Ag-Cu Bga Components Attached with Eutectic Pb-Sn Solder Paste, Journal of SMT, Vol. 16, No. 1, 2003, pp. 34 42. 32. Nelson, Dave, Pallavicini, Hector, Zhang, Qian, Friesen, Paul, and Dasgupta, Abhijit, Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments, Journal of SMT, Vol. 17, No. 1, 2004, pp. 17 24. 33. Miner, M. A., Cumulative Damage in Fatigue, Journal of Applied Mechanics, Vol. 12, Transactions of the ASME, Vol. 67, 1945, pp. A159 A164. 34. Hoffmeyer, M., Farooq, M., Reliability and Microstructural Assessment of Hybrid CBGA Assemblies , paper presented at the 39th International Symposium on Microelectronics, IMAPS 2006, San Diego, October 8 12, 2006. 35. IPC/JEDEC-9702, IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects, June 2004. 36. IPC/JEDEC-9704, Printed Wiring Board Strain Gage Test Guideline, June 2005. 37. Nakamura, Tomoko, Miyamoto, Yoshimasa, Hosoi, Yoshihiro, and Newman, Keith, Solder Joint Integrity of Various Surface Finished Build-Up Flip Chip Packages by 4-Point Monotonic Bending Test, Electronics Packaging Technology Conference, 2005, pp. 465 470. 38. JEDEC Standard, JESD22-B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006. 39. Kim, I., and Lee, S-B, Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads, International Symposium on Electronics Materials and Packaging, EMAP2005, December 11 14, 2005, Tokyo Institute of Technology, Tokyo, Japan, pp. 27 32. 40. JEDEC Standard, JESD22-B110A, Subassembly Mechanical Shock November 2004. 41. JEDEC Standard, JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003. 42. JEDEC Standard, JESD22-B117A, Solder Ball Shear, October 2006. 43. Newman, Keith, BGA Brittle Fracture: Alternative Solder Joint Integrity Test Methods, Electronic Components and Technology Conference, 2005, pp. 1194 1201. 44. Ou, Shengquan, Xu, Yuhuan, Tu, K. N., Alam, M. O., and Chan, Y. C., Micro-Impact Test on LeadFree BGA Balls on Au/Electrolytic Ni/Cu Bond Pad, Electronic Components and Technology Conference, 2005, pp. 467 471. 45. Hassell, Patrick B., Advanced Warpage Characterization: Location and Type of Displacement Can Be Equally as Important as Magnitude, The Proceedings of Pan Pacific Microelectronics Symposium Conference, February 2001. 46. Riebling, J. C., and Brillhart, M. V., FEA Reliability Assessment Methodology Investigation to Improve Prediction Accuracy, SMTA International, 2000. 47. Lau, John H., Shangguan, Dongkai, Lau, Dennis C. Y., Kung, Terry T. W., and Lee, S. W. Ricky, Thermal-Fatigue Life Prediction Equation for Wafer-Level Chip Scale Package (WLCSP) Lead-Free Solder Joints on Lead-Free Printed Circuit Board (PCB), Electronic Components and Technology Conference, 2004, pp. 1563 1569. 48. Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B., and Reichl, H., Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation, Electronic Components and Technology Conference, 2003, pp. 603 610. 49. Syed, Ahmer, Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints, Electronic Components and Technology Conference, 2004, pp. 737 746. Corrected version available online at http://www.amkor. com/products/notes_papers/asyed_ ectc2004_corrected.pdf.
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50. Zhang, Qian, Dasgupta, Abhijit, and Haswell, Peter, Viscoplastic Constitutive Properties and Energy-Partitioning Model of Lead-Free Sn3.9Ag0.6Cu Solder Alloy, Electronic Components and Technology Conference, 2003, pp. 1862 1868. 51. Stoeckl, Stephan, Yeo, Alfred, Lee, Charles, and Pape, Heinz, Impact of Fatigue Modeling on 2d Level Joint Reliability of BGA Packages with SnAgCu Solder Bails, Electronics Packaging Technology Conference, 2005, pp. 857 862. 52. Ahmad, Mudasir, Teng, Sue, and Xue, Jie, Effect of Underfill Material Properties on Low k Dielectric, First and Second Level Interconnect Reliability, paper presented at the IMAPS Conference on Device Packaging, Scottsdale, AZ, 2006.
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