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HIGH-DENSITY FLEXIBLE CIRCUITS
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Serious progress in the density of flexible circuits was made during the second half of the 1990s, owing to the extreme miniaturization of electronic products. These products incorporate a new technical concept in the design of the circuits. They have a much higher density than traditional flexible circuits, with dimensions for traces, spaces, and via holes equivalent to those of rigid high-density interconnect (HDI) boards. (Details are described in the on Special Construction of Flexible Circuits.) They also have supplemental constructions on the circuit to allow higher termination capabilities. This type of construction is called an HDI flexible circuit (that is, a flexible circuit for high-density interconnects).
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Specifications Table 61.3 shows typical requirements for interconnection in the end product, and the preferred specification of circuit parameters for the use of high-density flexible circuits.
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TABLE 61.3 Common New Requirements for High-Density Flexible Circuits Requirements for end use High-density wiring Thin and light High-density SMT High-density connection Direct bonding Chip-on-flex, flip-chip High reliability for vibration For mechanical shock For wide-range heat cycle For salty moistures Preferred specification for flexible circuits Pitches smaller than 150 mm, via holes smaller than 150 mm in diameter Base 25 mm or thinner, conductor thinner than 12 mm Small opening on coverlay, tin or lead-free plating High dimensional accuracy (<0.3 mm diameter) High-density flying lead, pitch <100 mm High-density microbump array, pitch <100 mm High bond strength of conductors High bond strength between layers High heat resistance High insulation resistance
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Portable electronic products are exposed to more severe conditions than ever before. As a result, they need higher reliability for the circuits as listed in Table 61.3. In the case of portable telephones, they are often carried in the owner s pocket, where they may be exposed to a variety of conditions, including continuous vibration, mechanical shock, temperature, humidity, pocket lint, and even perspiration. Other portable electronic products, such as digital cameras, PDAs, and notebook computers, could be exposed to similar conditions.
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Applications Due to usage and assembly technologies, many applications require increased performance for high-density flexible circuits. The manufacturing processes for these circuits must adapt to new requirements imposed by additional process conditions.Table 61.4 lists major applications and the associated advantages of using high-density flexible circuits for a given purpose.
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TABLE 61.4 Major Applications of High-Density Flexible Circuits Applications Wireless suspension of disk drives Reasons to use high-density flexible circuits High-density wiring in a small space Flexible, thin, light, 3-D wiring Direct connection to magnetic heads High-density wiring in a small space Flexible, thin, light, 3-D wiring Repeated reparability High-density wiring in a small space Thin, light, 3-D wiring High-density wiring in a small space Flexible, thin, light, 3-D wiring Chip-on-flex capability High-density connection High-density wiring in a small space Flexible, thin, light, 3-D wiring Direct connection to ultrasound device High-density wiring in a small space Flexible, thin, light, 3-D wiring surface-mount technology (SMT) and COF capability High-density wiring in a small space Flexible, thin, 3-D wiring Direct connection to printer head device
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Ultrasound probes
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Without high-density flexible circuits, these applications could not achieve miniaturization or support valuable new functions. For example, specially developed high-density flexible circuits can provide highly reliable connections at a low cost for new tiny magnetic heads of hard disk drives with a vertical recording system. Chip-scale package (CSP) technologies can be developed with high-density flexible circuits. Driver integrated circuits (ICs) for flat panel displays in personal computers and large flat panel TVs are assembled with a set of chip-on-flex (COF) substrates. Due to the limited space within the camera bodies, small liquid crystal display (LCD) monitors for video cameras and digital cameras are assembled using long-tailed high-density flexible circuits. The wiring of the next generation of portable electronics cannot be completed without high-density flexible circuits.
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