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Generating QR Code ISO/IEC18004 in Software MANUFACTURING OF FLEXIBLE CIRCUITS

MANUFACTURING OF FLEXIBLE CIRCUITS
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Surface Cleaning A pre-cleaning process is required to remove the stains and oxidations on the surface of the copper foils prior to the coating of photo resist materials. Several adhesiveless laminates have extremely shiny copper surface, therefore the chemical cleaning has an important function in making a better affinity with the etching resist, especially for the fine trace etching. A mild chemical cleaning process, such as organic acid solution, should be applied for thin flexible materials for eliminating serious mechanical damages. Soft scrubbing or soft brushing must be used when a mechanical process is necessary to remove tough stains or oxidation on the copper surface. A severe mechanical brushing will produce mechanical stress on the thin materials and will cause the loss of dimensional uniformity. A soft brushing process on a belt conveyor has been developed to minimize mechanical damage to flexible materials, This process works only for one side of the laminates, therefore a two-step process is required for the double-side laminates.
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Resist Coating The same etching resist inks used for rigid circuit boards and screen printers are available for flexible circuits. These inks allow for relatively rough pattern etching with large volume. Also, similar dry films and laminators, designed for rigid boards, could be used for flexible circuits. RTR is can be available adding rolled loader and unloader. However, flexible dry films with a high etching yield should be selected. A tenting method with relatively thick dry films is used for the double-side circuits with standard size through holes. A thinner dry film is recommended for the single-side circuits, especially for fine patterns. Dry films 15 or 20 mm thick can generate 30- to 40-mm lines/spaces on 12-mm-thick copper foils with a high yield. A liquid photo resist should be used for very-high-density traces with pitches smaller than 40 mm.
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Pattern Generation Similar exposure equipment is available for flexible circuits. A collimated light source machine is recommended for high-density traces with pitches smaller than 50 mm to achieve a high yield. An appropriate matching tool for flexible materials should be developed in order to achieve good pattern alignment with high productivity. Suitable auto alignment systems with CCD cameras have been introduced to minimize the pattern shift from the via holes generated previously. Because of the dimensional changes in the previous mechanical and wet processes, appropriate dimensional corrections are required for the photo masks. A glass mask is required for tracers finer than 50 microns pitches instead of polyester base film masks. A set of reliable mask holder is required to keep the heavy glass masks in the machines. An exact alignment between top mask and bottom mask is required for the high density double-side flexible circuits. Sometimes, partial dimensional corrections are required to adjust the distortions of the thin flexible materials. A higher alignment accuracy than +/ 10 microns is required for the finer pitched than 50 microns. The easiest way for the dimensional correction is to reduce the panel sizes. But it reduces the process productivity.An alternative method is a step-and-repeat imaging with a small exposure area on a large panel. It is possible to make a corrected photo mask for the imaging process in order to minimize the misalignment. Unfortunately, the distortion of the flexible laminate is unstable, sometimes, it needs to generate the corrected masks for each job lot. It asks the material to stay beside the exposure machine until the right mask is ready. Laser direct imaging equipment (LDI) is capable of making the dimensional corrections for the serious distortions of the unstable flexible materials promptly. It provides a high productivity for the prototype or middle volume productions. On the other hand, it is not very capable for traces finer than 25 microns lines and spaces. Lower throughput compared to traditional exposure machines, especially for double-side imaging, is the barrier for the volume productions.
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