barcode reading using c#.net TERMINATION OF FLEXIBLE CIRCUITS in Software

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TERMINATION OF FLEXIBLE CIRCUITS
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Because of the nature of their use, there are a limited number of locations where imaging devices such as LCDs and CCDs can be placed in electronic products. As a result, there are fewer choices for wiring materials other than flexible circuits. Newer imaging devices have numerous pixels in a limited area, which requires more connections with smaller pitches. In addition, it is often important to place the driver integrated circuit (IC) close to the device. Therefore, a flexible circuit is required for both wiring and chip-on-flex (COF). A large LCD, typically used in a personal computer and flat-panel TV, often needs several tape-automated bonding (TAB) circuits to create the wiring between a rigid board and the LCD device. A flat-panel display can be wired by a single high-density flexible circuit, which reduces the cost of the entire package. It is common for a flexible circuit to be connected to other circuit boards. However, more traces and a higher density of the connections are then required. The basic design of the end products automatically determines the placement of specialty components such as keyboards, switches, antennas, actuators, printer heads, sensors, microphones, speakers, and buzzers in small electronic applications. Although these components do not require numerous wires, they do need high-density connections due to the extreme miniaturization of portable electronic products.
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Nonpermanent or Permanent Termination The permanence of a termination is determined by connection repeatability. For example, if connections are changed regularly, a nonpermanent termination should be utilized. Due to the number of reconnections, inkjet printers and electrical test probes should have nonpermanent terminations. Conversely, if a connection is to remain relatively constant, a permanent termination method should be employed. Termination method capabilities are profiled in Table 64.4.
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TABLE 64.4 Capabilities of Termination Permanent or nonpermanent Permanent Permanent Permanent Permanent Permanent Non-permanent Non-permanent Non-permanent Non-permanent Non-permanent
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Methods SMT soldering SMT wire bonding Solder fusing ACM connection Direct bonding Pressure contacts Dimple contacts FFC connectors Pair connectors Film connectors
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Termination density 350 mm pitch (2-D) 150 mm pitch (4 directions) 150 mm pitch 30 mm pitch (100 contacts in 1 mm2) 50 mm pitch (1- or 2-D) 20 contacts in 1 cm2 (1- or 2-D) 20 contacts in 1 cm2 (1- or 2-D) 300 mm pitch (1-D, 1 line) 500 mm pitch (1-D, 2 line) 100 mm pitch (2-D, 100 contacts in 1)
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Termination Density To design a suitable termination solution with flexible substrates, one must consider the density and the number of terminations. An overview of each method s termination density is profiled in Table 64.4. Due to higher connection reliability, a contact array can produce more connections than a contact line in the same space with a larger pad pitch. Numerous wires must fit together in a limited space.
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Wiring of Imaging Devices A high-density flex circuit could be the best solution for the wiring of a small imaging device module designed for consumer electronics. In general, these devices have hundreds of pads that need to be connected with COF for the driver IC close to the device. The flex circuit usually requires a long tail to be connected to the other device. Only a high-density flex circuit can satisfy all the requirements as a single circuit.There are several choices in the design of the constructions of the COF area and the bonding area. An adhesiveless clad laminate having a stable substrate with polyimide resin is required to create a high connection yield for a highresolution device. An anisotropic conductive material (ACM) connection is a low-risk solution because of the low processing temperature. A direct bonding process with fine flying leads can provide reliable connections for COF and wiring with the imaging device Due to increased temperature, the design requires a higher dimension control.
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