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If there is no functional reason to remove the connection during normal operation, a permanent connection is recommended because of the small mounting space and lower costs. Examples of this type of connection include:
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General soldering Through-hole leaded components General SMT components Solder fusing Wirebonding Direct bonding ACM connection Flip-chip connection NCP connection
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Soldering Soldering is still the most popular and common termination technology for flexible circuits. All kinds of solder and termination materials and equipment are available with suitable tooling guides. Usually, the soldering parts of the flexible circuits have stiffeners on the bottom side of the flexible substrates to make them tough enough to handle high-temperature soldering. However, the other parts of the circuits are still fragile, and appropriate frames or carrier boards have to be prepared to make the flexible circuits stable during the assembling processes, including screen printing, SMT mounting, solder reflow, and cleaning. If adhesiveless laminates are used as the major materials, high temperatures can be used with lead-free soldering. In the case of SMT assembling, the flexible circuit should be fixed on a carrier frame. This allows it to be processed by the same mounting and soldering equipment as used for rigid boards.
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Through-Hole Leaded Components Often, through-hole leaded electronic components are necessary for specific applications. Processes similar to those used for single-sided rigid boards are used to attach the components to the flexible material. However, because through-hole leaded components require
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TERMINATION OF FLEXIBLE CIRCUITS
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FIGURE 64.1 Examples of direct soldering of flexible circuits (a) Without stiffener, (b) With stiffener.
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clinching of the leads and are heavier than SMT components, special fixtures and control are required when placing them on a fragile flexible circuit. This is to minimize mechanical stresses, especially when components are connected by soldering, as shown in Fig. 64.1 (a) and (b). A complicated stiffener system is required for the double-sided assembly of the leaded components on the flexible circuits. 64.3.3 SMT General Issues Most SMT technologies can be used for flexible circuits without significant alteration, as shown in Fig. 64.2. In general, the same circuit design rules can be applied to SMT for a high-density
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FIGURE 64.2
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SMT soldering of high density flexible circuits.
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PRINTED CIRCUITS HANDBOOK
flexible circuit. A suitable thin stiffener sheet such as 125 mm thick polyimide film should be bonded to support SMT components. Figure 64.3 shows the case of the ball grid array (BGA) component with a thin polyimide stiffener. Adhesiveless copper-clad laminates need to be used as the raw material to withstand the high temperatures of typical lead-free soldering processes. A flexible photoimageable solder mask needs to be applied to cover the fine traces. A special dynamic flexible-grade Flexible Substrate Stiffener photoimageable coverlay should be used if the flexible FIGURE 64.3 Mounting of BGA device on flexible circuit. circuit has a portion of repeated flexing. A stiffener of suitable thickness needs to be bonded on the back side of an SMT area of a thin, single-sided flexible circuit. A thicker substrate layer should be used for double-sided assembly. An appropriately designed stiffener board can increase assembly productivity without a big cost increase. A larger stiffener board and adhesive sheets are punched beforehand for the preparation of the assembling processes. The stiffener board has extra frame space that contains appropriate guide holes for the convenience of part mounting and soldering. The flexible circuits fixed on the stiffener boards can be managed the same as rigid printed circuit boards in the assembling processes. A standard mounting machine places small SMT components without additional tooling. In addition, the same high-temperature soldering equipment used for reflow soldering in an SMT line can be used here. In-circuit tests are conducted with an aluminum board. As the final process of the assembly, unnecessary parts of the stiffener boards are cut off and the whole circuit is folded to make a part of the module casing. An appropriate seal is made with the other casing parts to protect the module from the outside stress.
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