barcode reading using c#.net FIGURE 65.10 Design of bookbinder construction of multilayer rigid/flex circuit. in Software

Draw QR Code ISO/IEC18004 in Software FIGURE 65.10 Design of bookbinder construction of multilayer rigid/flex circuit.

FIGURE 65.10 Design of bookbinder construction of multilayer rigid/flex circuit.
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MULTILAYER FLEX AND RIGID/FLEX
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High Density Multi-layer Rigid/Flex for Industrial Use High-density designs with fine traces and micro via holes for rigid/flex are not recommended for use in aerospace applications because they are not reliable enough under extreme conditions. Only traditional soldering processes are used for the terminations of the rigid/flex. On the other hand, recent designs for industrial and medical applications have been using both high density and high reliabilities, therefore, new design concepts and termination technologies have been designed to meet this need. Smaller trace pitches than 100 microns and smaller via-hole diameters than 100 microns have been introduced for the high density multilayer rigid/flex. To achieve the new design concepts, 25 micron or thinner polyimide films were introduced without adhesive layers for the thin copper laminates, mostly 18 microns or less. Several laser processes are used to generate small via FIGURE 65.11 Micro blind via hole on a multilayer rigid/flexible circuit made by a build-up process using holes, especially with blind via holes of the resin-coated foil. The hole diameter is 150 micrometer. build-up process. (Fig. 65.11) (Source: Photo Machining.) Several high density, but reliable termination technologies such as Ball Grid Array (BGA) and Flip Chip Bonding have been introduced for the high density rigid/flex.
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Build-Up Process and Blind Via Holes To build the high-density rigid/flex, the build-up process with blind via holes has been introduced as the new standard manufacturing process. Similar build-up processes are used with multilayer rigid and rigid/flex circuits; however, instead of the traditional manufacturing process used for multilayer rigid/flex circuits, more layers are built on the rigid part with resincoated foils. Figure 65.12 shows a cross section of a blind micro via hole in a multilayer rigid/flexible circuit made by a buildup process with adhesiveless copper laminate and prepreg sheet. Holes smaller than 100 micron diameters were drilled by carbon dioxide laser and a thin copper plating was plated in the via hole conductors. Figure 65.13 also shows a
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FIGURE 65.12 Micro-blind via hole on a multilayer rigid/flexible circuit made by a build-up process using adhesiveless laminate prepreg. (Source: Photo Machining.)
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FIGURE 65.13 Micro blind vias on two sides of a multilayer rigid/ flexible cirucuit.
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PRINTED CIRCUITS HANDBOOK
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micro-blind via hole in a multilayer rigid/flexible circuit, made by a build-up process using an adhesiveless laminate, but with prepreg sheet and with hole diameter of 150 mm
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High-Density Multilayer Rigid/Flex for Consumer Use Consumer applications, such as digital cameras and cellular phones, often require high-density rigid/flex to complete complicated wiring and packaging in small spaces. They often use traces finer than 75 mm and blind via holes smaller than 150 mm in diameter with high-density SMT. Many small chip components are mounted on the rigid part of the circuits and the traces are connected to other circuits by soldering to have relatively large current capacities (See Fig. 65.14 for example of multilayer flexible circuit used in cellular phones. Figure 65.15 shows another examples of rigid/flex applied for an LCD display module of a cellular phone. High density SMT including flip chip mounting of controller IC and small CMOS camera were conducted on a small rigid part of the rigid/flex. One of the flex parts was connected to the glass substrate of the LCD by ACF (Anisotropic Conductive Film) connection with 150 microns pitch. Another side of the flexible parts was to be inserted to the FFC connectors with 0.5 mm pitch.
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FIGURE 65.14 Multilayer flexible board for cellular phone application.
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FIGURE 65.15 Rigid/flexible circuit for LCD driver.
Many technologies have been developed to satisfy these requirements. The use of a buildup process technology could be one of the solutions. The specialty of the consumer application is the large volume with extremely low cost, therefore a new design concept and manufacturing processes have been required.
Design Concept of Rigid/Flex for Consumer Use To eliminate the conflicts of the requirements between high density and low cost, new design concepts for the consumer rigid/flex have been developed. The basic design concepts are listed in Table 65.2. Generally, thinner materials have been selected compared to those for aerospace and industrial use in order to reduce the total thickness significantly. Copper plating for the via hole connections should be less than 15 microns, but the high reliabilities should be kept. Polyimide films or adhesiveless copper laminates can be used as the cap layer instead of thick glass epoxy materials for reducing the thickness of the rigid/area that is sometimes called multi-layer flex. The total thickness of the 6 layer rigid part for SMT can be less than 400 microns. The numbers of the conductor layers should be 10 or fewer microns to keep total thickness small and reduce the manufacturing cost. Finer traces than 100 microns pitches should be
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