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67.9.2 IPC
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IPC-FC-231C: Flexible bare dielectrics for use in flexible printed wiring IPC-FC-232C: Specification for adhesive coated dielectric films for use as cover sheets for flexible printed wiring IPC-FC-234: Pressure sensitive adhesives assembly guidelines for single-sided and double-sided printed circuits IPC-FC-241C: Flexible metal-clad dielectrics for use in fabrication of flexible printed wiring IPC-RF-245: Performance specification for rigid-flex printed boards IPC-D-249: Design standard for flexible single and double-sided printed boards IPC-FC-250A: Specification for single and double-sided flexible printed wiring IPC-FA-251: Guidelines for assembly of single and double-sided flex circuits IPC-6013A: Qualification and performance specification for flexible printed boards
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JIS-C 5016: Test methods for flexible printed wiring boards JIS-C 5017: Flexible printed wiring boards, single-sided and double-sided JIS-C 6471: Test methods for copper-clad laminates of flexible printed wiring boards JIS-C 6472: Copper-clad laminates for flexible printed wiring boards (polyester film, polyimide film)
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JPCA-BM 01: Copper-clad laminates of flexible printed circuits, polyester films, and polyimide films JPCA-FC 01: Single-sided flexible printed circuits JPCA-FC 02: Double-sided flexible printed circuits JPCA-FC 03: Visual defect criteria for flexible printed circuits
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MIL-STD-2118: Flexible and rigid-flex printed-wiring for electronic equipment MIL-C-28809: Circuit card assemblies, rigid, flexible and rigid-flex MIL-P-50884C: Printed wiring, flexible and rigid-flex
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APPENDIX
SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS
David W. Bergman
(IPC)-Association Connecting Electronics Industries, Bannockburn, Illinois
The following documents center on surface-mount technology. These documents have been developed by standards organizations in the United States and internationally. The letters in each document designation indicate the organization that has responsibility for the document: ECA: Documents prepared by the Electronic Components, Assemblies, Equipment and Supplies Association (ECA) of the Electronic Industries Alliance (EIA). DoD: Documents prepared by the Department of Defense. IEC: Documents prepared by the IEC International Electrotechnical Commission. IECQ: Documents prepared for Quality Assessment System for Electronic Components supported through the IEC. IPC: Documents prepared by the IPC Association Connecting Electronics Industries. JEDEC: Documents of the Solid State Technology Association of the Electronic Industries Alliance (EIA). JESD: Standards prepared by JEDEC. J-STD: Joint industry standards (standards followed by more than one association). MIL: Documents prepared by the military. SMC: Documents published by the Surface Mount Council.
SURFACE MOUNT COUNCIL PUBLICATIONS
SMC-TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology SMC-WP-001: Soldering Capability SMC-WP-002: An Assessment of the Use of Lead in Electronic Assemblies
Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
PRINTED CIRCUITS HANDBOOK
SMC-WP-003: Chip Mounting Technology SMC-WP-004: Design for Excellence SMC-WP-005: PWB Surface Finishes
COMPONENTS, GENERAL
EIA-186-E: Standard Test Methods for Passive Electronic Component Parts General Instructions and Index EIA-481-2-A: Embossed Carrier Taping of Surface Mount Components for Automatic Handling (16, 24, 32, 44, and 56 mm) EIA-944: Surface Mount Ferrite Chip Bead Qualification Specification EIA-945: Surface Mount Inductor Qualification Specification EIA/IS-47: Contact Termination Finish Standard for Surface Mount Devices EIA/IS-760: Surface Mount Wirewound Inductor Qualification Specification EIA-PDP-100: Registered and Standard Mechanical Outlines for Electronic Parts EIA-JEP-95: JEDEC Registered and Standard Outlines for Solid State and Related Products EIA-JESD30B: Descriptive Designation System for Semiconductor Device Packages JESD-625A: Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
PASSIVE COMPONENTS
Capacitors ECA SP 4984: Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode EIA-198-E: Ceramic Dielectric Capacitors Classes I, II, III, and IV EIA-469-C: Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors EIA-479A: Film-Paper, Film Dielectric Capacitors for 50/60 Hz Voltage Doubler Power Supplies EIA-535: Series of Detail Specifications on Fixed Tantalum Capacitors EIA-595: Visual and Mechanical Inspection Multilayer Ceramic Chip Capacitors EIA/IS-35: Two-Pin Dual In-Line Capacitors EIA/IS-36: Chip Capacitors, Multi-Layer (Ceramic Dielectric) EIA/IS-37: Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors) EIA/IS-717: Surface Mount Tantalum Capacitor Qualification Specification IEC-384-3: Sectional Specification, Tantalum Chip Capacitors IEC-384-10: Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors IECQ Draft: Blank Detail Specification, Fixed Multilayer Ceramic Chip Capacitors IECQ-PQC-31: Sectional Specification, Fixed Tantalum Chip Capacitors with Solid Electrolyte IECQ-PQC-32: Blank Detail Specification, Fixed Tantalum Chip Capacitor
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