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SURFACE-MOUNT PROCESS
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IPC-SC-60: Post Solder Solvent Cleaning Handbook IPC-SA-61: Post Solder Semi Aqueous Cleaning Handbook IPC-AC-62: Post Solder Aqueous Cleaning Handbook IPC-CH-65: Guidelines for Cleaning of Printed Boards and Assemblies IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards
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RELIABILITY
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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-SM-785: Guidelines for Accelerated Surface Mount Attachment Reliability Testing IPC-9151: Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database JEDEC JESD 22-A113: Preconditioning Of Nonhermetic Surface Mount Devices Prior to Reliability Testing JEDEC JESD 22-B113: Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
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NUMERICAL CONTROL STANDARDS
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IPC-2511: Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology IPC-2512: Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description IPC-2513: Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description IPC-2514: Sectional Requirements for Implementation of Printed Board Manufacturing Data Description IPC-2515: Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description IPC-2516: Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description IPC-2517: Sectional Requirements for Implementation of Assembly Circuit Testing Data Description IPC-2518: Sectional Requirements for Implementation of Bill of Material Product Data Description EIA-267-C: Axis and Motion Nomenclature for Numerically Controlled Machines EIA-274-D: Interchangeable Variable Block Data Contouring, Format for Positioning and Contouring/Positioning Numerically Controlled Machines EIA-358-C: ANSI X3.4 American National Standard Code for Information Interchange for Numerical Machine Control Perforated Tape
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SUMMARY OF STANDARDS
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EIA-408: Interface between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Binary Data Interchange EIA-431: Electrical Interface between Numerical Control and Machine Tools EIA-441: Operator Interface Function of Numerical Controls EIA-484-A: Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission EIA-494-B: 32 Bit Binary CL (BCL) and 7 Bit ASCII CL (ACL) Exchange Input Format for Numerically Controlled Machines
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TEST METHODS
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EIA-469-C: Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors EIA-638: Surface Mount Solderability Test EIA IS 46: Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components IPC-9502: PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components IPC-9503: Moisture Sensitivity Classification for Non-IC Components IPC-9504: Assembly Process Simulation for Evaluation of Non-IC Components IPC-9701: Qualification and Performance Test Methods for Surface Mount Solder Attachments IPC-9850: Surface Mount Equipment Performance Characterization IPC/JEDEC-9702: Monotonic Bend Characterization of Board-Level Interconnects IPC/JPCA-6801:Terms & Definitions,Test Methods, and Design Examples for Build-Up/High Density Interconnection IPC-TM-650: Test Methods Manual JEDEC Standard 22 Series: Test Methods JEDEC JESD 22-A111: Evaluation Procedure for Determining Capability to Bottom Side Board Attach By Full Body Solder Immersion of Small Surface Mount Solid State Devices JEDEC JESD 22-A112: Test Method A112, Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices JEDEC JESD 22-B105-B: Test Method Lead Integrity JEDEC JESD 22-B106: Test Method B106c, Resistance to Soldering Temperature for Through-Hole Mounted Devices JEDEC JESD 22-B108: Coplanarity Test for Surface-Mount Semiconductor Devices JEDEC JESD 22-B117: BGA Ball Shear JEDEC JESD 51-8: Integrated Circuit Thermal Test Method Environmental Conditions Junction-to-Board JESD 22-B108: Coplanarity Test for Surface Mount Semiconductor Devices
A.10
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REPAIR
IPC-7711A/7721A: Rework, Repair and Modification of Electronic Assemblies
TERMS AND DEFINITIONS
IPC-T-50F: Terms and Definitions for Interconnecting and Packaging Electronic Circuits JEDEC JESD 12-1: Terms and Definitions for Gate Arrays and Cell-Based Integrated Circuits JEDEC JESD 77: Terms, Definitions and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices JEDEC JESD 99: Terms, Definitions, and Letter Symbols for Microelectronic Devices JEDEC JESD 100: Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits JEDEC JEP 99: Glossary of Microelectronic Terms, Definitions, Symbology
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