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Following are the addresses of the IPC and EIA, as well as other sources for documents shown in this SMT listing: IPC Association Connecting Electronics Industries 3000 Lakeside Drive #309S Bannockburn, IL 60015-1249 Electronic Industries Alliance (EIA) 2500 Wilson Boulevard Arlington, VA 22201-3834 Phone: (703) 907-7500 Global Engineering Documents (Part of IHS) 15 Inverness Way East Englewood, CO 80112 Phone: (800) 854-7179 Military documents are available from the following address: Standardization Documents Order Desk Building 4D, 700 Robbins Avenue Philadelphia, PA 19111-5094 Central office address of the IEC is as follows: International Electrotechnical Commission (IEC) 3 Rue de Varembe 1211 Geneva 20, Switzerland IEC documents are available from the following address: American National Standards Institute (ANSI) 11 West 42nd Street New York, NY 10036
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chemical that is used to speed up a reaction or cure, as cobalt naphthenate is used to accelerate the reaction of certain polyester resins. It is often used along with a catalyst, hardener, or curing agent. The term accelerator is often used interchangeably with the term promoter. ACCURACY: The ability to place the hole at the targeted location. ADDITIVE PROCESS: A process for obtaining conductive patterns by the selective deposition of conductive material on an unclad base material. ADHESIVE: Broadly, any substance used in promoting and maintaining a bond between two materials. AGING: The change in properties of a material with time under specific conditions. ANNULAR RING: The circular strip of conductive material that completely surrounds a hole. ARC RESISTANCE: The time required for an arc to establish a conductive path in a material. ARTWORK MASTER: An accurately scaled configuration used to produce the production master. BACKUP MATERIAL: A material placed on the bottom of a laminate stack in which the drill terminates its drilling stroke. BASE MATERIAL: The insulating material upon which the printed wiring pattern may be formed. BASE MATERIAL THICKNESS: The thickness of the base material excluding metal foil cladding or material deposited on the surface. BLIND VIA: Conductive surface hole that connects an outerlayer with an innerlayer of a multilayer PWB without penetrating the entire board. BLISTERING: Localized swelling and separation between any of the layers of the base laminate or between the laminate and the metal cladding. BONDING LAYER: An adhesive layer used in bonding other discrete layers during lamination. BOND STRENGTH: The force per unit area required to separate two adjacent layers by a force perpendicular to the board surface; usually refers to the interface between copper and base material. BOW: A laminate defect in which deviation from planarity results in a smooth arc. B-STAGE: An intermediate stage in the curing of a thermosetting resin. In it a resin can be heated and caused to flow, thereby allowing final curing in the desired shape. B-STAGE LOT: The product from a single mix of B-stage ingredients. B-STAGE RESIN: A resin in an intermediate stage of a thermosetting reaction.The material softens when heated and swells when in contact with certain liquids, but it may not entirely fuse or dissolve. BURIED VIA: Conductive surface hole that connects one innerlayer to another innerlayer of a multilayer PWB without having a direct connection to either the top or bottom surface layer. BURR: A ridge left on the outside copper surfaces after drilling. CAPACITANCE: The property of a system of conductors and dielectrics which permits the storage of electricity when potential difference exists between the conductors.
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*Some terms may not be included in the glossary as they are treated in detail in the text. Please also see the index and subject chapters.
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Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
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The electrical interaction between two conductors caused by the capacitance between the conductors. CARBIDE: Tungsten carbide, formula WC. The hard, refractory material forming the drill bits used in PWB drillings. CATALYST: A chemical that causes or speeds up the cure of a resin but does not become a chemical part of the final product. CERAMIC LEADED CHIP CARRIER (CLCC): A chip carrier made from ceramic (usually a 90 96% alumina or beryllia base) and with compliant leads for terminations. CHIP CARRIER (CC): An integrated circuit package, usually square, with a chip cavity in the center; its connections are usually on all four sides. (See leaded chip carrier and leadless chip carrier.) CHIP LOAD (CL): The movement of the drill downward per revolution; usually given in mils (thousandths of an inch) per revolution. CHLORINATED HYDROCARBON: An organic compound having chlorine atoms in its chemical structure. Trichloroethylene, methyl chloroform, and methylene chloride are chlorinated hydrocarbons. CIRCUIT: The interconnection of a number of electrical devices in one or more closed paths to perform a desired electrical or electronic function. CLAD: A condition of the base material, to which a relatively thin layer or sheet of metal foil (cladding) has been bonded on one or both of its sides. The result is called a metal-clad base material. CNC: Computer numerically controlled. Refers to a machine with a computer which stores the numerical information about location, drill size, and machine parameters, regulating the machine to carry out that information. COAT: To cover with a finishing, protecting, or enclosing layer of any compound. COLD FLOW: The continuing dimensional change that follows initial instantaneous deformation in a nonrigid material under static load. Also called creep. COLLIMATION: The degree of parallelism of light rays from a given source. A light source with good collimation produces parallel light rays, whereas a poor light source produces divergent, nonparallel light rays. COMPONENT HOLE: A hole used for the attachment and electrical connection of a component termination, including pin or wire, to the printed board. COMPONENT SIDE: The side of the printed board on which most of the components will be mounted. COMPOUND: A combination of elements in a stable molecular arrangement. CONDUCTIVE FOIL: The conductive material that covers one side or both sides of the base material and is intended for forming the conductive pattern. CONDUCTIVE PATTERN: The configuration or design of the electrically conductive material on the base material. CONDUCTOR LAYER 1: The first layer having a conductive pattern, of a multilayer board, on or adjacent to the component side of the board. CONDUCTOR SPACING: The distance between adjacent edges (not centerline to centerline) of conductors on a single layer of a printed board. CONDUCTOR THICKNESS: The thickness of the copper conductor exclusive of coatings or other metals. CONDUCTOR WIDTH: The width of the conductor viewed from vertically above, that is, perpendicularly to the printed board. CONFORMAL COATING: An insulating protective coating which conforms to the configuration of the object coated and is applied on the completed printed board assembly. CONNECTOR AREA: The portion of the printed board that is used for providing external (input output) electrical connections. CONTACT BONDING ADHESIVE: An adhesive (particularly of the nonvulcanizing natural rubber type) that bonds to itself on contact, although solvent evaporation has left it dry to the touch. CONTROLLED IMPEDANCE: The matching of substrate material properties with trace dimensions and locations to create a specific electric impedance as seen by a signal on the trace.
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