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GLOSSARY
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LAMINATE VOID:
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Absence of epoxy resin in any cross-sectional area which should normally contain epoxy resin. LAND: See terminal area. LANDLESS HOLE: A plated-through hole without a terminal area. LASER PHOTOPLOTTER (LASER PHOTO GENERATOR, OR LPG): A device that exposes photosensitive material, usually a silver halide or diazo material, subsequently used as the master for creating the circuit image in production. LAYBACK: A geometric drill bit defect of the cutting edges. LAYER-TO-LAYER SPACING: The thickness of dielectric material between adjacent layers of conductive circuitry. LAY-UP: The process of registering and stacking layers of a multilayer board in preparation for the laminating cycle. LCCC: Leadless ceramic chip carrier. LEAD-FREE: Referring to solder alloys made without lead, to conform with the requirements of the European Union directive on the Restriction of Hazard Substances (RoHS) the most important of which, to the printed circuit industry, is lead. Often used to refer to any process that is designed to be compatible with lead-free alloys. LEADED CHIP CARRIER: A chip carrier (either plastic or ceramic) with compliant leads from terminations. LEADLESS CHIP CARRIER: A chip carrier (usually ceramic) with integral metallized terminations and no compliant external leads. LEGEND: A format of lettering or symbols on the printed board, for example, part number, component locations, or patterns. LOOSE FIBERS: Supporting fibers in the substrate of the laminate which are not held in place by surrounding resin. MAJOR WEAVE DIRECTION: The continuous-length direction of a roll of woven glass fabric. MARGIN RELIEF: The area of a drill bit next to the cutting edge is removed so that it does not rub against the hole as the drill revolves. MASTER DRAWING: A document that shows the dimensional limits or grid locations applicable to any or all parts of a printed wiring or printed circuit base. It includes the arrangement of conductive or nonconductive patterns or elements; size, type, and location of holes; and any other information necessary to characterize the complete fabricated product. MEASLING: Discrete white spots or crosses below the surface of the base laminate that reflect a separation of fibers in the glass cloth at the weave intersection. MICROSTRIP: A type of transmission line configuration which consists of a conductor over a parallel ground plane separated by a dielectric. MICROVIA: Usually defined as a conductive hole with a diameter of 0.006 in or less that connects layers of a multilayer PWB. Often used to refer to any small-geometry connecting hole the creation of which is beyond the practical capabilities of traditional mechanical drilling processes. MINOR WEAVE DIRECTION: The width direction of a roll of woven glass fabric. MIXED ASSEMBLY: A printed wiring assembly that combines through-hole components and surface mounted components on the same board. MODULUS OF ELASTICITY: The ratio of stress to strain in a material that is elastically deformed. MOISTURE RESISTANCE: The ability of a material not to absorb moisture either from air or when immersed in water. MOUNTING HOLE: A hole used for the mechanical mounting of a printed board or for the mechanical attachment of components to a printed board. MULTILAYER BOARD: A product consisting of layers of electrical conductors separated from each other by insulating supports and fabricated into a solid mass. Interlayer connections are used to establish continuity between various conductor patterns. MULTIPLE-IMAGE PRODUCTION MASTER: A production master used to produce two or more products simultaneously. NAILHEADING: A flared condition of internal conductors.
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GLOSSARY
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Numerically controlled. Usually refers to a machine tool, in this case a drilling machine. The most basic type is one in which a mechanical guide locates the positions of the holes. NC machines are usually controlled by punched tape. NEMA STANDARDS: Property values adopted as standard by the National Electrical Manufacturers Association. NOBLE ELEMENTS: Elements that either do not oxidize or oxidize with difficulty; examples are gold and platinum. OILCANNING: The movement of entry material in the z direction during drilling in concert with the movement of the pressure foot. ORGANIC: Composed of matter originating in plant or animal life or composed of chemicals of hydrocarbon origin, either natural or synthetic. PAD: See terminal area. PADS ONLY:A multilayer construction with all circuit traces on inner layers and the component terminal area only on the surface of the board. This construction adds two layers but may avoid the need for a subsequent solder resist, and since inner layers usually are easier to form, this construction may lead to higher overall yields. PH: A measure of the acid or alkaline condition of a solution. A pH of 7 is neutral (distilled water); pH values below 7 represent increasing acidity as they go toward 0; and pH values above 7 represent increasing alkalinity as they go toward the maximum value of 14. PHOTOMASTER: An accurately scaled copy of the artwork master used in the photo fabrication cycle to facilitate photo processing steps. PHOTOPOLYMER: A polymer that changes characteristics when exposed to light of a given frequency. PINHOLES: Small imperfections which penetrate entirely through the conductor. PINK RING: The appearance of a halo of copper around the hole of a multilayer. PWB PITS: Small imperfections which do not penetrate entirely through the printed circuit. PLASTICIZER: Material added to resins to make them softer and more flexible when cured. PLASTIC LEADED CHIP CARRIER (PLCC): A chip carrier packaged in plastic, usually terminating in compliant leads (originally J style) on all four sides. PLATED-THROUGH HOLE: A hole in which electrical connection is made between printed wiring board layers with conductive patterns by the deposition of metal on the wall of the hole.(See PTH.) PLATING VOID: The area of absence of a specific metal from a specific cross-sectional area: (1) When the plated-through hole is viewed as cross-sectioned through the vertical plane, it is a product of the average thickness of the plated metal times the thickness of the board itself as measured from the outermost surfaces of the base copper on external layers. (2) When the plated-through hole is viewed as cross-sectioned through the horizontal plane (annular method), it is the difference between the area of the hole and the area of the outside diameter of the through-hole plating. PLOWING: Furrows in the hole wall due to drilling. POLYMER: A high-molecular-weight compound made up of repeated small chemical units. For practical purposes, a polymer is a plastic. The small chemical unit is called a mer, and when the polymer or mer is cross-linked between different chemical units (e.g., styrene-polyester), the polymer is called a copolymer. A monomer is any single chemical from which the mer or polymer or copolymer is formed. POLYMERIZE: To unite chemically two or more monomers or polymers of the same kind to form a molecule with higher molecular weight. POTLIFE: The time during which a liquid resin remains workable as a liquid after catalysts, curing agents, promoter, etc., are, added. It is roughly equivalent to gel time. POWER FACTOR: The cosine of the angle between the applied voltage and the resulting current. PRECISION: The ability to repeatedly place the hole at any location. PREPRODUCTION TEST BOARD: A test board (as detailed in IPC-ML-950) the purpose of which is to determine whether, prior to the production of finished boards, the contractor has the capability of producing a multilayer board satisfactorily.
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