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Draw QR Code ISO/IEC18004 in Software Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.

Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
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Assembly inspection (Cont.): Three-dimensional screened paste, 53.14 53.16 Visual, 53.1, 53.2, 53.8 53.12 Assembly process, 40.3 40.66 Accuracy, 41.33, 41.34 Automated soldering, 40.10 40.16 Axial lead component, 40.11 Cells, 40.8, 40.9 Component packages, 40.10 40.13 Conformal coating, 40.64 40.66, 41.1 41.17 Design for, 40.6, 40.7 Dual-inline pin (DIP), 40.10 Flux issues, 432, 43.4 Hand soldering, 40.9, 40.10 Insertion (through-hole), 40.5 40.16 Insertion technology, 40.10 40.13 Lines, 40.8, 40.9 Machine selection criteria, 40.54 40.57 Network communication, 40.53, 40.54 Odd-form components, 40.42 40.48 Process, 40.7, 40.8 Process categories, 40.4 Radial lead component, 40.12 Repair and rework, 40.57 40.64 RoHS issues, 40.4, 40.6, 41.5 RoHS issues with, 40.6, 40.7 Surface-Mount technology, 40.16 40.42 Underfill, 40.64 40.66 See also Conformal coating, Soldering techniques, Surface-mount assembly Assembly reliability, 57.1 57.48, 58.10 58.30 Accelerated testing, 57.36 57.39 Acceptance testing, 57.39 57.45 Assembly process effects, 57.23 57.27 Assembly reliability test, 57.42 57.45 Board reliability test, 57.39 57.42 Burn-in, 57.36 57.39 Component failure mechanisms, 57.18, 54.19 Component to PWB, 58.1 58.30 Design for, 57.19 Design variables, 58.1 58.30 Estimating for lead-free, 59.1 59.35 Fabrication process effects, 57.20 57.23 Failure mechanisms, 57.4 57.19 Component, 57.18, 57.19 Electrochemical, 57.9 57.13, 57.18 Mechanically induced, 57.9, 57.17, 57.18 Thermally driven, 57.5 57.9, 57.13 57.17 Fundamentals of, 57.1 57.3 Lead-free, 58.1 58.30, 59.1 59.35 Material selection, and, 57.27 57.36 Components, 57.33 57.36 Conformal coating, 57.36 Interconnect method, 57.32, 57.33 PWB, 57.27 53.32 Rework effects, 57.26, 57.27 Testing for, 57.4 Thermal tests, 57.36 57.42 See also Component to PWB reliability Assembly, planning for, 19.1 19.25 Autorouters, for HDI, 21.11
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B2it, 23.13 23.14 Ball grid array (BGA), 3.10, 3.11 Bare board acceptability, 51.3 51.34. See also Fabricated board acceptability Bare board test equipment, 38.1 38.24 Dedicated Fixture, 38.1 38.3 Fixture software, 38.24 Fixture, make or buy, 38.21, 38.22 Flying probe system, 38.3, 38.17 38.19 Probes, 38.2, 38.3 Selection of, 38.21 System alternatives, 38.1 38.3 Test department planning, 38.22, 38.23 Universal grid systems, 38.3 38.17 Design of, 38.4, 38.5 Dual-side issues, 38.15 38.17 Exclusion mask for, 38.5 Fixture design examples, 38.12 38.14 Pin translator fixtures, 38.5 3.15 Press units, 38.17 Verification, 38.21, 38.22 Repair, 38.21, 38.22 Bare board test methods, 37.1 37.20 Bare board test methods Adjacency analysis, 37.12, 37.13 Basic methods, 37.2 37.9 Combined test methods, 37.19, 37.20 Data driven testing, 37.14 37.16 Data extraction methods, 37.14 37.16 Data extraction outputs, 37.17, 37.18 Data formats, 37.17, 37.18 Data preparation, 37.13 37.19 DC continuity, 37.2 37.5 DC isolation, 37.5 37.9 Embedded component, 37.10 Fixture preparation, 37.13 37.19 Fixture set up, 37.18, 37.19 Fixture software, 37.14 Flexible circuits, 61.3 61.5 Flying probe, 37.11 37.13 Gerber format, 37.17 HDI special testing methods, 39.1 39.7 Hi-pot testing, 37.9, 37.10 Indirect measurement, 37.11, 37.12 Integrated sequential testing, 37.20 Non-electrical test, 37.1, 37.2, 40.6, 40.7 Automatic optical inspection, 37.1, 37.2 Visual, 37.1 Self learning, 37.13 Special methods, 37.9 37.13 Split net testing, 37.19 Time domain reflectometry (TDR), 37.10, 37.11 See also HDI bare board testing, Inspection Bare board testing objectives and definitions, 36.1 36.7, 38.1 38.20, 39.1 39.22, 40.1 40.7 Automatic optical inspection, 39 Definitions, 36.4 36.7 Equipment, 39.1 39.22 Faults, 36.4 36.9 HDI impact, 36.1, 36.2, 40.1 40.7 Objectives, 36.1 36.4 Process monitor, as, 36.4
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Repair, 39.19, 39.20 Standards, 36.3 Test department planning, 39.20 39.22 Test methods, 38.1 38.20 Test specification, 36.3 Verification, 39.19, 39.20 See also Assembled board testing Base material. See Laminate Bismaleimide Triazine (BT), 7.6 Blind via Lamination, 27.39 Laser formed, 22.10, 22.11 Rigid/flexible circuits, in, 60.6, 60.7 Black pad, 32.20, 32.21 Boundary scan test, 54.6 54.11 Brazing, 44.10 Buried via Lamination, 27.39 Stack-up, 27.14 27.16 CAD Tools, 14.7, 14.8 CAE Tools, 14.6, 14.7 CAM tools, 14.9 Chip on Board (COB), 4.15, 4.16 Chip Scale Packaging (CSP), 4.7, 4.8 Circuit density. See Design, Planning for Cleaning assemblies, 46.7 46.10. See also Fluxes, cleaning CO2 laser, 23.32 23.33 Component attachment, 13.14, 13.15 Component libraries, 14.3 Component Package, types, 3.1 3.22, 4.1 4.20, 13.15 13.18. See also Advanced Component Package Component standards, A.1 A.10 Component, packaging for assembly, 40.28 40.32 Component to PWB reliability, 58.1 58.30, 59.1 59.35 Black pad, 58.19, 58.20 Board stiffness, 58.9 Component density, 58.7 58.10 Electrical test, 58.22, 58.23 Estimating Lead-free reliability, 59.1 59.35 Heat spreader, 58.35 Heatsink design, 58.15, 58.16 Kirkendall voids, 58.17 58.22 Lead-free impact, 58.10, 58.11 Low-k dielectrics, 58.29, 58.30 Package design, 58.23 58.30 Packaging challenges, 58.2 58.5 Pad design, 58.14, 58.15 Product environment, 58.5 58.7 Solder joint geometry, 58.11 58.13 Solder joint reliability, 59.1 59.35 Surface finish affect on, 58.16 58.22 Underfill, 58.27 Warpage, 58.10 See also Solder joint reliability Conductive anodic filament (CAF), 9.15 9.22, 56.1 56.15 Electrochemical migration, 56.7 56.10 Test for CAF resistant materials, 56.14 Manufacturing tolerances, 56.14
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Solder flux effects, 56.12 Humidity, 56.12, 56.13 Substrate, 56.11 Voltage, 56.11, 56.12 Testing for, 9.17 9.21 Computer Aided Manufacturing (CAM), 20.1 Conductor width, density, effect on, 2.18 2.21 Conformal coating, 41.1 41.17 Application processes, 41.7 41.11 Applications for, 41.1 Cure, 41.11, 41.12 Design for, 41.14 41.17 Inspection, 41.11, 41.12 Preparation for, 41.6, 41.7 Repair, 41.13, 41.14 Types of, 41.2, 41.6 Controlled Impedance, 27.20, 27.21. See also Signal integrity Copper electroplating, 29.6 29.15 Acid copper sulfate, 29.12 29.15 Solutions, 29.14, 29.17 Operation, 29.14, 29.15 Troubleshooting, 29.15, 29.18 Additives, 29.7 29.9 Brightener, 29.9, 29.19 Carrier/suppressor, 29.8, 29.9 Chemically mediated, 29.11 Current density, 29.14, Levelers, 29.10 Low current, 29.10, 29.11 Pulse plating, 29.11 29.13 Thickness distribution, 29.7 Uniform plating factors, 29.13 Copper foil, 7.18 7.25 Adhesion promotion, 27.49, 27.50 Double-treated, 7.25 Electrodeposited, 7.18 7.22 Grades, 7.18 HTE (High Temperature Elongation), 7.20, 9.2 High performance resin, and, 9.4 Low profile, 9.2, 9.3 Oxide, 11.3 Current carrying capacity, 16.1 16.22 Peel strength, 8.8 8.11, 12.6, 12.7 Pit and dent values, 6.17 Profile, 7.21 Resin coated copper (RCC), 9.13, 9.14 Reverse treated, 7.22, 7.23, 9.2, 9.3, 9.12 Resistivity, 7.24 Roughness, 9.4, 9.7 Skin depth versus frequency, 9.4, 9.5 Surface quality, 6.15, 6.17 Tensile and elongation, 7.20, 7.21 Thickness, 6.16 Thin foil, 9.3, 9.4 Treatments, 7.22 Wrought annealed, 7.24 See also Current Carrying Capacity Crazing, 52.32 CTE (Coefficient of Thermal Expansion), 8.1 8.4, 12.16 12.18, 27.7
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