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INDEX
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Current carrying capacity, 16.1 16.22 Baseline charts, 16.10 16.19 Board material, 16.13 Charts, 16.4 16.22 Charts, how to use, 16.6 16.8 Conductor sizing charts described, 16.1, 16.2 Copper planes, 16.13 Copper thickness, 16.20, 16.21 Copper weight, 16.13 Microvias, 16.19 Odd-shaped geometries, 16.19, 16.20 Single plane, 16.13 16.16 Trace sizing, 16.8 16.10 Cyanate ester, 6.4, 27.12, 27.13 Deionized (DI) water, 28.4, 28.5 Dendrites, 32.21, 32.22 Design. See also specific issue Flexible circuits, 57.1 57.15. HDI boards, 22.1 22.22 Multilayer issues, 17.1 17.21. Parameters, 15.1 15.18 Process, 14.1 14.12 See also Design of Flexible Circuits, Multilayers Design for Manufacturing (DFM), 19.1 19.18, 20.28, 20.29. See also Design, planning for; Assembly, planning for; PWB fabrication, planning for Design parameters, 15.1 15.17 Board deflection, 15.14, 15.15 Current leakage, 15.5, 15.6 Dimensioning, 15.10, 15.11 Electromagnetic compatibility, 15.3, 15.4 Grounding, 15.6 15.9 Leakage voltage, 15.5, 15.6 Mechanical requirements, 15.9 15.16 Mounting, 15.11, 15.12 Noise budget, 15.4 Reinforcement, 15.17 Resonance, 15.15 15.17 Shock, 15.12 15.14 Signal integrity, 15.1 15.3 Thermal performance, 17.1 17.18 Vibration, 15.12 15.14 Voltage distribution, 15.6 15.9 See also Thermal performance Design process, 14.1 14.12 Inputs to, 14.11 Libraries, components, 14.3 Partitioning, 14.2 Routing, 14.4 Simulation, 14.3, 14.6 Steps, 14.2 System specification, 14.1, 14.2 Design rule check, 19.11 19.18 Design rules, example, 19.12 19.18 Design standards, A1 A7 Design tools, 14.5 14.11 Interfacing, 14.11 Selecting, 14.9 14.11 Types of, 14.5 14.9
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Design, planning for, 19.1 19.27 Assembly trade-offs, 19.24 19.27 Concepts, 19.3, 19.4 Cost prediction, 19.1, 19.2 Density Equation, 19.10, 19.11 Complexity index, 19.18 19.21 Design input, 19.10 19.18 Design process, 19.4, 19.5 Design review, 19.4 19.10 Design rule check, 19.11 19.18 Design rules selection, 19.12 Figure of merit, 19.8 19.11 Fabrication trade-offs, 19.17 19.24 General elements, 19.2, 19.3 Initial design analysis, 19.1 19.10 IPC-2221, 27.17 Layout efficiency, 19.12 New product, 19.4 19.10 Panelization, 19.9, 19.10, 19.22, 19.23 Prediction, non-metrics, 19.8 Prediction metrics, 19.6, 19.7 Producibility, 19.4, 19.6 Product definition, 19.5 Trade-offs, 19.10 19.17 Wiring capacity, 19.12 Wiring demand, 19.11 19.12 Wiring demand model, 19.13 19.17 Yield prediction, 19.20 19.22 Die bonding, 13.17, 13.18 Dielectric constant, 9.8, 9 11, 12.16, 27.5, 27.6 Signal velocity, 13.5 Tests for, 12.16 versus Frequency, 13.5 Dielectric loss, 27.6 Differential scanning calorimetry (DSC), 8.3, 8.4, 12.11 12.13, 27.6, 27.7 Direct chip attach (DCA), 3.12, 3.13 Chip on Board (COB), 3.21 3.23 Flip chip bonding, 3.21 Methodologies, 3.12 3.15 Tape Automated Bonding (TAB), 3.21 Wire bonding, 3.20 Direct laser imaging, 5.4 Direct metallization, 30.1 30.11 Carbon/Graphite systems, 30.4 30.6, 30.9 Comparative steps, 30.8 Conductive polymer systems, 30.6, 30.7, 30.10 Horizontal process, 30.10 Other methods, 30.7, 30.8 Palladium based, 30.2 30.4, 30.9 Process issues, 30.11 Technologies, 30.1, 302 Dissipation factor, 8.8, 9.10, 9.11, 27.3. See also Laminate DMA (Dynamic mechanical analysis), 8.3, 8.4, 12.10 12.14, 27.7 Documentation, fabrication, 20.1 20.32. See also PWB fabrication documentation Double-sided boards, 5.7, 5.8 Drill bits, 24.5 24.8 Defects in, 24.7, 24.8 Geometric attributes, 24.5 24.7
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INDEX
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HDI issues, 25.3, 25.4 Hits per tool, 24.17 Inspection of, 24.5 Materials, 24.5 Multilayer specific, 27.32, 27.33 New, 24.7 Repointed, 24.7, 24.8 Drilling machines, 24.11 24.15 Air, 24.11, 24.12 Collet maintenance, 24.12, 24.13 Measurements, 24.13, 24.14 Mechanical factors, 24.14 Spindles, 24.12 24.16 Surfaces, 24.14, 24.15 Tooling, 24.12 Vacuum, 24.12 Drilling Processes, 24.3 24.22 Backup material, 24.8, 24.10 Chip load, 24.16, 25.9 Cost, 24.20 24.22 Drill bit rings, 24.8, 24.9 Drill bits, 24.5 24.8, 25.6, 25.7 Drill room, 25.6 Entry material, 24.9 High Density Interconnect Drilling, 25.1 25.9 Hits per tool, 24.17 Hole defects, 24.19, 24.20 Hole quality, 24.18 24.20 Inspection, 24.20 Laminate in, 24.4, 24.5 Machines, 24.11 24.15 Materials for, 24.4 24.11 Methods, 24.15 24.18 Retract rate, 24.16, 25.9, 25.10 Spindle speed, 24.13, 24.14, 25.8, 25.9 Spindle runout, 25.8 Stack clearance, 24.17, 24.18 Stack height, 24.18 Surface speed, 24.15, 24.16, 25.9, 25.10 Tooling pins, 24.10, 24.11 Vacuum, 25.6 See also HDI Drilling Dual-in-line package (DIP), 3.6 Dynamic mechanical analysis (DMA), 8.3, 8.4, 12.10 12.14, 27.7 Electroless copper, PTH process, 28.7 28.10 Electroless copper plating, 31.1 31.15 Additive process, 31.2 AP-II, 31.5, 31.6 Catalytic, 31.2 31.5 CC-4, 31.2 31.5 Chemistry, 31.9 31.12 Deposit reliability, 31.11 Environmental issues, 31.12 Foil process, 31.6, 31.7 Fully electroless plate, 31.1 31.15 Issues, 31.12 31.14 Molded circuits, 31.12, 31.13 Noncatalyic, 31.5, 31.6 Panel plating, 31.7, 31.8 Partly additive, 31.8, 31.9
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Pattern platting, 31.2 31.5 Photochemical imaging, 31.12 Pre-electroplate deposit, 28.7 28.10 Electromotive compatibility (EMC) Design parameters, 15.3, 15.4 Electronic packages, ICs, 2.10 2.13, 3.1 3.20, 4.1 4.14 Electronic packaging, 2.3 2.8 Advanced, 4.1 4.20 Density, 2.14 2.20, 3.2 3.5 Issues and concerns, 3.4, 3.5 Optical component packaging, 3.18 3.21 Passive device integration, 3.23 3.25 Systems requirements, 3.5 Typical structures, 2.7 See also Advanced packaging Electroplating, 29.1 29.31 High aspect ratio, 29.2 29.4 Basics, 29.1, 29.2 Copper electroplating, 29.6 29.19 Deposition rates, 29.2 Electrodeposit properties, 29.2 Gold electroplating, 29.25 29.28 Horizontal, 29.4 29.6 Hull cell, 29.30 Laboratory process control, 29.29 29.31 Microvia plating, 29.2 29.4 Nickel electroplating, 29.23 29.25 Pattern versus panel, 29.6 Platinum metals, 29.28 Pulse plating, 29.11, 29.13 Solder (Tin-lead), 29.19 29.21 Tin, 29.21, 29.23 See also Copper Electroplating Embedded components, 21.1 21.10 Active components, 21.8 Applications, 21.2, 21.3 Capacitors, 13.21, 13.22, 21.4 21.10 Definitions, 21.1, 21.2 Designing for, 21.3 21.6 Fabricated board test, 37.10 Fabrication of, 21.7 21.10 Inductors, 21.6 Materials, 13.21, 13.22, 21.6 21.10 Resistors, 13.21, 21.3, 21.4, 21.6 21.10 Tooling, critical, 20.32 Environmental issues, 60.1 60.32. See also Waste minimization and treatment Epoxy resin systems, 7.1 7.12 Bismaleimide Triazine (BT), 7.6 Blends, 7.5, 7.6 Definition of, 7.2, 7.3 Difunctional, 7.3, 7.4 Multifunctional, 7.4, 7.5 Tetrafunctional, 7.4, 7.5 ESD Handling, 52.7 52.9 Etching, 34.1 34.21 Aluminum, 34.19, 34.20 Equipment, 34.26 34.29 Etch factor, 34.23, 34.24 Fine line, 34.24 34.26
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