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HASL Lead-free impact of, 43.5 High Density Interconnect (HDI), 22.1 22.34 Advantages, 22.4, 22.5 Bare board testing issues, 39.1 39.7 Build-up technologies, 22.1 22.28 Characterization, 22.4 Coating methods, 22.13 22.26 Construction types, 22.8, 22.9 Cost and performance, 22.5, 22.6 Definitions, 22.1 Design of, 22.11,22,12 Design rules, 22.10, 22.11 Design tools, 22.12 Dielectric material, 22.13 22.16, 23.2 Fabrication of, 23.1 23.36 Materials, 22.13 22.16, 23.3 23.6 Materials for, 21.12 21.17 Microvia hole technologies, 22.11, 23.1 23.15 Microvia material, 22.14 22.17, 9.11, 9.12 Process factors, 23.1 Specifications, 22.6 Stack-up, types, 27.17, 27.20 Standards, 22.6, 22.7 Structures, 22.7 22.11 Via fabrication processes, 22.26 22.34, 23.3 Via filling, 22.22 22.26 versus Traditional circuit, 22.6 See also HDI Build-up Technologies, HDI Materials, Microvia hole technologies HDI bare board testing Bending bean fixtures, 39.2, 39.3 Combinational methods, 39.7 Conductive rubber fixture, 39.5 Coupled plate, 39.4, 39.5 Fine-pitch fixtures, 39.1, 39.2 Flying probe, 39.3 Noncontact test methods, 39.6, 39.7 Electron beam, 39.6 Gas plasma, 39.7 Photoelectric, 39.6, 39.7 Optical inspection, 39.5, 39.6 Scanning contact, 39.3, 39.4 HDI Technologies, 22.1 22.18 Buried Bump Interconnect, 23.26, 23.27 DVMult-PID, 23.6, 23.9 Dycostrate, 23.22 23.24 Fabrication processes, 23.3 23.31 Imprinted circuits, 23.28 23.31 Laser generated vias, 23.7 23.22 Mechanical drill, 23.22 Microfilled via technology, 22.16 MSF, 23.20 Photo defined/etched -via, 23.27, 23.28 Photo via technologies, 23.3 23.7 PALAP, 23.20 23.23 Plasma via technologies, 23.22 23.26 Plasma-Etched Redistribution Layers (PERL), 23.25, 23.26 Plasma micromilling, 23.24, 23.25 Proprietary technologies, 23.3 23.31 Screen printed via technology, 23.26, 23. 27
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Surface Laminar Circuits, 23.4 23.6 ToolFoil, 23.28 23.31 Trade-off analysis, 22.12, 22.13 Transient Liquid Phase Sintering, 22.16 22.18 Wet/dry-etched, 22.18 22.22 HDI Drilling, 25.1 25.19 Depth-controlled drilling, 25.10 Drilling parameters, 25.5 25.9 Factors affecting, 25.1 25.3 Hole quality, 25.6, 25.7 Innerlayer inspection, 25.13 25.19 High aspect ratio, 25.10 25.13 Laser hole creation, 25.2 25.5 Laser compared to mechanical, 23.2 23.5 Peck drilling, 25.11 25.13 Pulse drilling, 25.13 Spindle speed, 25.8 HDI Materials, 22.13 22.22 Coated copper foil, 22.14, 22.15 Non-glass, 22.17 Unclad, 22.15, 22.16 HDI Microvia fabrication Mechanical, 25.5, 25.13 Laser, 22.5, 22.6, 22.10 22.13, 25.2 25.5 High Density Interconnect. See HDI Hole quality, 24.18 24.20, 29.17, 29.18, 48.13, 48.19 48.21 Hot-air solder leveling (HASL), 32.1, 32.2 Hot bar soldering, 47.53 47.59 Hull cell, 29.29 IC s, 2.10 2.13, 3.1 3.20, 4.1 4.14 Imaging, 26.1 26.29 Artwork generation, 26.16 26.18 Design for, 26.27 26.29 Develop, 26.26, 26.27 Dry-film resists, 26.4 26.7 Chemistry, 26.5 26.7 Aqueous-processable, 26.5, 26.6 Semiaqueous processable, 26.6, 26.7 Solvent processable, 26.6, 26.7 Exposure, 26.16 26.26 Conventional imaging, 26.16 26.23 Direct imaging, 26.23 26.26 Control, 26.19, 26.20 Contact tools, 26.20, 26.21 Non-contact tools, 26.21 26.23 Laser direct, 26.23 26.26 Liquid photoresists, 26.7, 26.8 Photolithographic process, 26.1 Photosensitive materials, 26.2 26.4 Phototools, 26.16 26.18, 26.20 26.23 Projection printing, 26.21 26.23 Proximity printing, 26.21 Registration, 26.18, 26.19 Resist application, 26.11 26.16 Curtain coating, 26.15 Dry-film, 26.11, 26.12 Electrophoretic coating, 26.14, 26.15 Electrostatic coating, 26.14 Liquid coating, 26.12 Roller coating, 26.12 26.14
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INDEX
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Screen coating, 26.15 26.16 Spray coating, 26.14 Resist processing, 26.8 26.27 Strip, 26.27 Surface preparation, 26.9 26.11 Information formatting and exchange, 18.1 18.22 Component information, 18.21, 18.22 Component placement list, 18.17 Data exchange formats, 18.9 18.22 Data exchange process, 18.3 18.8 Design process overview, 18.1 18.3 Fabrication data exchange, 18.6, 18.7 Full design database, 18.10 Gerber format, 18.10, 18.1 Intelligent design data, 18.6 IPC-2801, 18.19 18.21 Mentor Graphic neutral file, 18.15 18.17 Netlist format, 18.14, 18.15 ODB++, 18.18, 18.19 Information transfer, 19.1 19.4 Innerlayer inspection, 25.13 25.19 Direct vision, 25.14 24.19 X-ray, 25.14 Inspection, assembly, 53.1 53.34. See also Assembly inspection Integrated circuit package, 2.10 2.13, 3.1 3.20, 4.1 4.14 Interconnectivity, 2.3 2.22. See also High Density Interconnect, and Electronic Packaging IPC Specification sheets, 12.3 Standards, all, A.l A.10 IPC-4101, 27.4 Kirkendall voids, 32.32, 45.14, 58.17 58.22 Known Good Die (KGD), 4.10, 4.11 Laminates Additives, 7.7 7.12 ANSI grades, 6.4, 6.5 Applications, choosing for, 11.6 11.14 Aramid based, 22.20 Arc resistance, 8.8 Bismaleimde Triazine (BT), 7.6, 27.14 B-stage. See Prepreg Characterization, 12.9 12.23 Characterization test plan, 12.22, 12.23 Chemical resistance, 8.12 Choosing for electrical performance, 9.26 9.26.10, 13.18 13.21 Choosing for lead-free compatibility, 10.2 10.4, 11.1 11.18 CAF Growth, 9.17 9.22 Conductive materials, 7.18 7.25 Constructions, 9.7 9.9 Copper peel strength, 8.8 8.11 Coefficient of Thermal Expansion (CTE), 8.1 8.4, 10.6, 11.2, 12.16, 12.17 Cure, degree of, 6.10 Curing agents and accelerators, 7.7 7.9 Current density, increasing, 9.2 9.7 Cyanate ester, 7.6, 27.13
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Decomposition temperature (Td), 6.12, 6.13, 8.5, 8.6, 10.6 10.11, 12.8, 12.9 Degree of cure, 6.10 Delamination, time to, 8.8, 10.14 10.16 Density, 8.8 8.10 Dielectric breakdown, 8.15 Dielectric Constant, 8.13. 9.22 9.34, 12.19 Dielectric constant tests, 12.16 Dielectric loss, 27.6 Dielectric strength, 12.20 Dimensional stability of, 9.11 913 Dissipation factor, 8.13, 9.22 9.34, 12.17 Drilling optimization, 10.6, 10.7 Dicy, 7.8 Electrical properties, 8.13 8.16 Electrical strength, 8.15 Electroless copper issues, 10.8 Enhanced electrical properties, 27.12 27.14 Enhanced mechanical properties, 27.14 Enhanced thermal properties, 27.11, 27.12 Epoxy resin systems, 7.1 7.6 Epoxy systems, 27.4 Evaluation of, 12.1 12.24 Fillers, 7.17 Flame retardants, 7.9 711 Flammability, 8.12 Flammability, 12.20 Flatness, 9.9 Flexural strength, 8.11, 9.8, 12.10 12.12 FR-4 (NEMA GRADE), 6.4, 6.13, 6.14 Grades, National Electrical Manufacturers Association (NEMA), 6.2 6.10, 12.3, 12.4 Glass transition temperature (Tg), 6.9, 6.10, 8.1 8.3, 10.5 10.7, 12.12 12.16, 27.6 27.8 IPC-4101 Specification, 6.9 Halogen free, 27.11 HDI, 22.12 22.22 Copper foil 9.2 9.4 High speed circuits, 9.23 9.26 Identification scheme, 6.14, 6.15 Industry standards, 12.2 12.4, A.l A.10 In Drilling, 24.4, 24.5 Insulation resistance, 8.14 Lead-free impact, 9.29 9.33, 10.1 10.16 Lead-free compatibility 10.2 10.18 Lead-free, laminate selection for, 11.1 11.18 Manufacturability in shop, 12.23 Manufacturing process, 6.18 6.24, 9.12 Mechanical tests, 12.9, 12.10 Metal cladding, 6.15 Microvia material, 22.14 Moisture absorption, 8.11, 8.12, 10.6, 10.14, 11.2 11.5, 12.21, 27.3 Multilayer, 27.2 27.8 Multiple ply, 9.7, 9.8 Peel strength, 8.8 8.11 Polyimide, 7.6, 7.7, 27.5 Polyphenylene oxide (PPO), 27.12 27.14 Polyphenylene ether (PPE), 7.7 Prepreg Identification scheme, 6.18 Testing, 12.19
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