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resin in the laminate. Above the Tg, the resin system in the laminate softens and allows any stored stress in the reinforcement to be released and allows the laminate to be affected by the adjacent materials and the pressure of the lamination cycle. Understanding the rheology of the resin in the prepreg is important when designing the multilayer lamination cycle. The point at which the resin begins to melt, the point at which it begins to cure, and the relationship between the heat rise and the viscosity profile of the resin are all important. With respect to viscosity, not only is the minimum viscosity achieved important, but the length of time that the resin is below a certain viscosity, allowing the resin to flow and fill the internal circuit features, is also important. With an understanding of these parameters, it is possible to design kiss cycles, or soak cycles, where pressure and temperature profiles, respectively, are designed to improve performance, including dimensional stability. In addition, although seldom done in practice, using a resin system in the prepreg materials that can be cured below the Tg of the resin system in the laminate can avoid the softening of the laminate resin system and therefore prevent much of the movement that takes place. The resistance to the use of this technique is usually driven by a desire to keep the resin system same throughout the multilayer PCB.
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One method used to increase circuit density is to use blind and buried vias. Rather than placing a via hole completely through the printed circuit board, blind and buried vias go only partly through the multilayer circuit, joining only the layers that require connection. By not extending these vias through the entire multilayer, real estate on the other layers becomes available for additional circuit routing. Buried vias are those that are not visible from the outside of the finished circuit board, and are formed in a subcomposite or copper-clad laminate. Blind vias are those that are visible from the outside of the multilayer circuit but do not go completely through it. By limiting the size of these vias, you can significantly increase interconnection density. Microvia or high-density interconnection (HDI) printed circuit designs utilize these technologies to increase circuit density. While the materials already discussed are used in blind and buried via applications using conventional processes, additional materials can be used to increase density using more specialized process techniques. The specialized processes used to form microvias include laser ablation, plasma etching, and photoimaging, with laser formation by far the most common. The resin system will generally ablate much faster in laser drilling processes. Also, plasmas are not effective in etching through fiberglass. As a result, materials that use an alternative reinforcement or do not contain an inorganic reinforcement have been developed for these applications. For blind via applications, resin-coated copper foil can be used to form the external circuit layer and dielectrics between layers 1 to 2 and n to n-1, using laser or plasma processes to form the vias. Buried vias could be formed in sequential processes. Two basic types of resin-coated copper foil are available. The first type uses one layer of partially cured resin (see Fig. 9.9).
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B-Stage resin layer Provides flow and fill of circuit details and dielectric thickness
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FIGURE 9.9 Resin-coated copper foil with a single layer of B-staged resin.
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C-Stage resin layer Provides consistent dielectric thickness control
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FIGURE 9.10
B-Stage resin layer Provides flow and fill of circuit details
Resin-coated copper foil with a C-stage and B-stage layer.
Core or multilayer buildup
Laminate
FIGURE 9.11
C-stage plus B-stage resin-coated copper foil laminated to PCB.
This resin-coated foil is then laminated to the rest of the multilayer circuit. A second type of resin-coated copper foil uses two layers of resin (see Figs. 9.10 and 9.11). The first layer is fully cured whereas the second is partially cured. This technique guarantees a minimum dielectric separation between the external foil and the circuitry on the next layer in, since the cured resin layer limits how close the internal circuit layer can get to the external foil. Another material used in HDI designs utilizes an organic reinforcement that can be laserablated or plasma-etched. The most common organic reinforcement used is aramid fiber-based. The aramid fibers are randomly oriented and formed into a sheet that is impregnated with the resin system. In this way, both copper-clad laminates and prepregs can be manufactured and used in multilayer applications. Table 9.5 shows some available thicknesses of Thermount aramid fiber reinforcement with 50 percent resin content. An additional reinforcement that can be used to make a prepreg material is expanded polytetrafluoroethylene (PTFE). This material has a sponge like structure that can also be impregnated with a resin system and used in HDI applications (see Fig. 7.19). Expanded PTFE also has a very low dielectric constant and loss factor.
TABLE 9.5 Commonly Available Thicknesses of Thermount Thermount Type E210 E220 E230 Prepreg Thickness 0.0018 in./46 mm 0.0030 in./76 mm 0.0037 in./94 mm Laminate Thickness 0.0020 in./51 mm 0.0032 in./81 mm 0.0039 in./99 mm
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