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TABLE 9.12 Laminate Constructions and Df Data for a Non-Dicy/Non-Phenolic Material
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Core Thickness 0.0020 0.0025 0.0027 0.0030 0.0032 0.0035 0.0035 0.0040 0.0040 0.0043 0.0045 0.0050 0.0053 0.0060 0.0070 0.0070 0.0080 0.0100 0.0120 0.0140 0.0160 0.0180 0.0210 0.0240 0.0280 Standard Construction 1-106 1-1080 1-1080 1-1080 1-2113 1-2113 2-106 1-3070 1-2116 106/1080 1-2116 1-1652 106/2113 1080/2113 1-7628 2-2113 2-2116 2-1652 2-1080/7628 2-7628 2-2116/7628 2-7628/2116 3-7628 2-1652/2-7628 4-7628 Resin Content 70 57 59 63 49 51 65 49 45 61 49 42 56 53 40 51 45 42 47 40 45 41 40 41 40 Df@2.0 GHz 0.0151 0.0136 0.0138 0.0143 0.0121 0.0130 0.0145 0.0122 0.0121 0.0141 0.0122 0.0110 0.0135 0.0132 0.0104 0.0130 0.0123 0.0111 0.0125 0.0114 0.0123 0.0115 0.0114 0.0115 0.0114 Df@5.0 GHz 0.0154 0.0139 0.0141 0.0146 0.0130 0.0132 0.0148 0.0130 0.0125 0.0123 0.0130 0.0122 0.0138 0.0134 0.0119 0.0132 0.0125 0.0120 0.0127 0.0119 0.0125 0.0120 0.0129 0.0120 0.0119 Df@10.0 GHz 0.0154 0.0139 0.0141 0.0146 0.0130 0.0132 0.0148 0.0130 0.0125 0.0123 0.0130 0.0122 0.0138 0.0134 0.0119 0.0132 0.0125 0.0120 0.0127 0.0119 0.0125 0.0120 0.0129 0.0120 0.0119
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BASE MATERIALS PERFORMANCE ISSUES
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9.10 ELECTRICAL PERFORMANCE OF LOW DK/DF LEAD-FREE COMPATIBLE MATERIALS
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However, for performance at very high frequencies, lower Dk/Df materials are preferred. While low Dk/Df materials have been available for many years, the advent of lead-free assembly has complicated material selection, and in these applications not only are the laminate Dk and Df properties critical, but their thermal properties are just as important. Critical material properties for lead-free assembly compatibility will be discussed in a subsequent chapter. Figures 9.32 and 9.33 provide Df and Dk data for three different low Dk/Df materials that are also compatible with lead-free assembly.
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0.014 0.012 0.01 Df 0.008 0.006 0.004 0.002 0 2 5 Frequency (GHz) 10 Low Dk/Df Lower Dk/Df Very Low Dk/Df
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FIGURE 9.32 Df versus Frequency for Low Dk/Df, Lead-Free Compatible Materials.
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3.8 3.75 3.7 Dk 3.65 3.6 3.55 3.5 2
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FIGURE 9.33
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Low Dk/Df Lower Dk/Df Very Low Dk/Df
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5 Frequency (GHz)
Dk versus Frequency for Low Dk/Df, Lead-Free Compatible Materials.
Table 9.13 provides Dk and Df data for the very low Dk/Df material by construction and resin content. This sample of constructions illustrates how these properties vary with resin content in addition to frequency. For a full list of constructions available for any product, it is recommended that the manufacturer s data sheets be consulted.
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TABLE 9.13 Laminate Constructions and Dk Data For A Low Dk/Df Material Resin Content % 70 60 63 51 49 62 55 54 52 49 Dk @ 2 GHz 3.28 3.51 3.44 3.73 3.78 3.46 3.63 3.65 3.70 3.78 Dk @ 5 GHz 3.24 3.47 3.40 3.70 3.75 3.42 3.59 3.62 3.67 3.75 Dk @ 10 GHz 3.24 3.47 3.40 3.70 3.75 3.42 3.59 3.62 3.67 3.75 Df @ 2 GHz 0.0058 0.0059 0.0059 0.0060 0.0060 0.0059 0.0060 0.0060 0.0060 0.0061 Df @ 5 GHz 0.0066 0.0066 0.0066 0.0066 0.0066 0.0066 0.0066 0.0066 0.0066 0.0066 Df @ 10 GHz 0.0072 0.0071 0.0071 0.0070 0.0070 0.0072 0.0071 0.0071 0.0071 0.0070
Thickness (in.) 0.0020 0.0027 0.0030 0.0035 0.0040 0.0043 0.0050 0.0060 0.0070 0.0080
Construction 1-106 1-1080 1-1080 1-2113 1-3070 106/1080 106/2113 1080/2113 2-2113 2-3070
REFERENCES
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. Isola Group Product Reference Materials. Clark-Schwebel Industrial Fabrics Guide. BGF Industries, Inc. Fiberglass Guide. Gould Electronics Product Reference Materials. Brist, Gary, Hall, Stephen, Clouser, Sidney, and Liang Tao, Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment, ECWC 10/IPC Expo 2005. Kelley, Edward J. and Micha, Richard A., Improved Printed Circuit Manufacturing with Reverse Treated Copper Foils, IPC Printed Circuits Expo, March 1997. IPC-TM-650 Test Methods Manual. IPC-4562 Metal Foil for Printed Wiring Applications. Kelley, Edward and Christofferson, Owen, Multilayer Printed Circuits with Exacting Registration Requirements, Achieving Next Generation Design Capabilities, IPC Printed Circuits Expo, May 1998. Kelley, Edward, Meeting the Needs of the Density Revolution with Non-Woven Fiberglass Reinforced Laminates, EIPC/Productronica Conference, November, 1999.
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