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FIGURE 10.12
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Percent weight change after a five-day ambient moisture test and 125 C bake.
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performance in the solder shock testing. The particular halogen-free material shown in this graph exhibits a very high level of moisture absorption and does indeed exhibit poor solder shock resistance. However, with the exception of only one material, all the other materials exhibited good solder shock resistance in this test, even though their moisture absorption levels ranged from less than 0.2 percent to just over 0.4 percent.The one other material that exhibited some level of defects had an intermediate level of moisture absorption, around 0.3 percent.The point is that it is very difficult to draw conclusions about material performance based on reported levels of moisture absorption. Additional reliability testing relevant to the application being considered is needed to make good decisions on material compatibility. With respect to moisture absorption and the subsequent drying or baking of PCBs, consider the tests summarized by Figs. 10.12 and 10.13. In each test, several different types of base material were evaluated, including dicy-cured and phenolic-cured FR-4 materials, as well as low Dk/ Df and halogen-free materials. Figure 10.12 shows moisture absorption data for samples that were dried, then soaked in water at room temperature for five days, measured, and then baked at 125 C for 24, 96, and 120 hours. Samples from this test were then submitted to 35 C and 85 percent RH for seven days, measured, and then baked at 125 C for 24 and 48 hours. The results of this second test are shown in Fig. 10.13. Although these graphs show that the different types of materials may absorb somewhat different amounts of moisture, in each case the moisture was
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1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1
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Moisture absorption (%)
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24 hour bake 0 20 40 60 80 100 120 Time (hours) 140 160 180 200 220
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FIGURE 10.13
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Percent weight change after seven days at 35 C/85 percent RH moisture test and 125 C bake.
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able to be driven off by baking. Beyond this, little correlation could be found between the relative levels of moisture absorption and performance in lead-free assembly applications. Although the materials tested here that showed relatively low levels of moisture absorption have performed well in lead-free assembly applications, some that showed relatively high levels of moisture absorption in these tests have also performed well. The materials in this group that have not done well in lead-free applications fell somewhere in the middle in terms of relative moisture absorption. Thus, although moisture absorption is a critical property, it must also be evaluated within the context of other properties.
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Time to Delamination The time to delamination, and how it is measured, was discussed in further detail in Chap. 8.This test method involves placing a sample of laminate or PCB in a thermomechanical analyzer (TMA) and heating the sample to a specific isothermal temperature, most commonly 260 C (T260) or 288 C (T288). The time it takes for the sample to delaminate is then measured and reported. Figure 10.14 is an example of a complex backplane PCB that was subjected to T260 testing. This PCB used a conventional dicy-cured high-Tg FR-4 material and delaminated before reaching 2 minutes. Note the charring and degradation of the resin system. Alternate resin systems, including alternate types of FR-4 materials, can offer significantly improved performance. Figure 10.15 compares time-to-delamination performance at different temperatures for four different resin systems: two dicy-cured FR-4s and two that use an alternate type of curing mechanism. Note that the materials using an alternative curing mechanism
FIGURE 10.14 Delamination and resin decomposition after T260 testing.
THE IMPACT OF LEAD-FREE ASSEMBLY ON BASE MATERIALS
120 System 1 System 3 System 5 System 7
100 Time to delamination (minutes) Hydroxyl cured materials
Dicy cured materials 260 270 280 290 Test temperature ( C) 300 310
0 250
FIGURE 10.15
Time to delamination versus temperature for different resin systems.
offer much longer times to delamination at each temperature, although all systems exhibit much shorter times as the temperature is increased. Times to delamination also vary based on the type of sample measured. Laminates with the copper foil removed generally exhibit longer times than laminates with copper foil. Clad laminates in turn exhibit longer times than multilayer PCBs. Figure 10.16 provides data on clad versus unclad samples for several material types in T260 and T288 testing. In multilayer PCBs, usually the interface between the resin and the internal copper surfaces will fail first. Time to delamination in multilayer PCBs is affected by the quality of the surface treatment of
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